Abstract: A sensor package has integrated magnetic and acceleration sensor package structures, where a first wafer is bonded to a second wafer with a cavity defined between them. The magnetic sensor is bonded to the bottom of the first wafer and the acceleration sensor is provided within the cavity. Circuitry to drive the accelerometer and interface with the magnetic sensor is provided on the first wafer.

Abstract: The use of magnetic field sensing to perform sophisticated command control and data input into a portable device is disclosed. A magnetic field sensor is embedded or fixedly attached to a portable device to measure changes in the magnetic field strength and/or direction accompanying movement, motion or tilt of the device in one-, two- or three-dimensions when the portable device is used to air-write or make gestures.

Abstract: Micro-machined capacitive sensors implemented in micro-electro-mechanical system (MEMS) processes that have higher sensitivity, while providing an increased linear capacitive sensing range. Capacitive sensing is achieved via variable-area sensing, which employs a transduction mechanism in which the relationship between changes in the capacitance of variable, parallel-plate capacitors and displacements of a proof mass is generally linear. Each respective variable, parallel-plate capacitor is formed by a finger/electrode pair, in which both the finger and the electrode have rectangular tooth profiles that include a plurality of rectangular teeth.

Abstract: A magnetometer with only a SET operation for initiating a magnetic orientation within a magnetic field sensor based on anisotropic magnetoresistive (AMR) technology. Within the magnetometer, the relative orientations of the respective X, Y and Z axes detectors are maintained by a package in which all detectors are mounted on a single assembly with the Z axis sensor displaced and held orthogonal to the other two sensors by potting material. Shorting bars on respective barber pole structures are provided with a geometry that allows for closer placement of adjacent barber poles to one another. The barber pole structures are deposited in a nested orientation which provides for balanced resistance legs in a Wheatstone bridge construction.

Abstract: A turbine nozzle includes outer and inner bands bounding nozzle vanes. The outer band includes an aft flange. An impingement baffle bridges the outer band and aft flange at the root thereof to provide impingement cooling.

Abstract: The use of magnetic field sensing to perform sophisticated command control and data input into a portable device is disclosed. A magnetic field sensor is embedded or fixedly attached to a portable device to measure changes in the magnetic field strength and/or direction accompanying movement, motion or tilt of the device in one-, two- or three-dimensions when the portable device is used to air-write or make gestures.

Abstract: A system and method for testing and calibrating integrated sensor devices that improves the manufacturing test throughput of the devices. The system includes a tester, a temperature controller, and at least one probe station including a thermal chuck. The chuck can be heated to specified temperatures to achieve variable heating of a wafer, PCB, or pallet disposed thereon. The temperature controller adjusts the temperature of the chuck to a first specified level. The tester performs at least one first measurement of the output offset of each integrated sensor embodied as a die on the wafer, or as a device on the PCB or pallet. Next, the temperature controller adjusts the temperature of the chuck to a second specified level, and the tester performs at least one second measurement of the output offset of each integrated sensor at the second temperature level.

Abstract: A system and method for testing and calibrating integrated sensor devices that improves the manufacturing test throughput of the devices. The system includes a tester, a temperature controller, and at least one probe station including a thermal chuck. The chuck can be heated to specified temperatures to achieve variable heating of a wafer, PCB, or pallet disposed thereon. The temperature controller adjusts the temperature of the chuck to a first specified level. The tester performs at least one first measurement of the output offset of each integrated sensor embodied as a die on the wafer, or as a device on the PCB or pallet. Next, the temperature controller adjusts the temperature of the chuck to a second specified level, and the tester performs at least one second measurement of the output offset of each integrated sensor at the second temperature level.