Abstract: A heat sink assembly includes a first heat dissipating plate, a second heat dissipating plate, at least one flat heat pipe horizontally positioned between the first heat dissipating plate and the second heat dissipating plate. The at least one flat heat pipe surrounds or defines an enclosed-space. The enclosed-space is closed by the first heat dissipating plate and the second heat dissipating plate. At least one through hole communicates with the enclosed-space and is defined in the second heat dissipating plate.

Abstract: A heat dissipation device adapted for removing heat from a heat-generating electronic device, includes a base, a first fin unit arranged on a top surface of the base. The base includes a base plate, a spreader and a heat pipe group sandwiched between the base plate and the spreader. The base plate defines therein an opening. The heat pipe group has an inserting protrusion and a receiving recession opposing the inserting protrusion. The inserting protrusion protrudes upwardly from a top surface of the heat pipe group and is embedded in the opening of the base plate. The receiving recession recesses upwardly from a bottom surface of the heat pipe group and receives therein the spreader.