Abstract: Systems and methods for prediction and measurement of overlay errors are disclosed. Process-induced overlay errors may be predicted or measured utilizing film force based computational mechanics models. More specifically, information with respect to the distribution of film force is provided to a finite element (FE) model to provide more accurate point-by-point predictions in cases where complex stress patterns are present. Enhanced prediction and measurement of wafer geometry induced overlay errors are also disclosed.

Abstract: Disclosed are a polymer-stabilized liquid crystal composition and the use thereof. The composition comprises one or two polymerizable compounds represented by general formula I: (I), and further comprises a negative dielectric anisotropy liquid crystal composition, wherein the negative dielectric anisotropy liquid crystal composition has a dielectric anisotropy of ????1.5; and the added amount of the polymerizable compound(s) represented by general formula I is 0.1-0.5% of the total mass of the negative dielectric anisotropy liquid crystal composition. A polymer film formed after the polymerization of the provided liquid crystal composition containing the polymerizable compound(s) has a very good uniformity, such that the problem of liquid crystal displays having poor display can be improved.

Abstract: The present invention provides a novel liquid crystal material composition comprising one or more compound, in order to achieve the properties of low viscosity, high resistivity, good low-temperature mutual solubility, fast response, excellent transmission, and which can be used for a variety of fast response display modes. Since the working temperature of a LCD material is subjected to the temperature range of individual LC molecules, information can only be displayed in a specific temperature range of the specific liquid crystal macro-alignment phase. At low temperature, the viscosity of liquid crystal increases exponentially, which in turn substantially reduces the response speed and overall performances of the display system.

Abstract: A liquid crystal composition and use thereof in the liquid crystal display field. The liquid crystal composition includes, in percentages by weight, 5-40% of one or more compounds represented by general formula I, 2-30% of one or more compounds represented by general formula II, and 20-70% of one or more compounds represented by general formula III, and may further include 4-30% of one or more compounds represented by general formula IV and/or 5-25% of one or more compounds represented by general formulas V to IX. The combined use of the above-mentioned compounds can effectively reduce the rotational viscosity of the liquid crystal composition, improve related properties of the mixed liquid crystal, and thus reduce the response time thereof. The liquid crystal composition can be used for a fast-response liquid display in a variety of display modes.

Abstract: Systems and methods for prediction and measurement of overlay errors are disclosed. Process-induced overlay errors may be predicted or measured utilizing film force based computational mechanics models. More specifically, information with respect to the distribution of film force is provided to a finite element (FE) model to provide more accurate point-by-point predictions in cases where complex stress patterns are present. Enhanced prediction and measurement of wafer geometry induced overlay errors are also disclosed.

Abstract: The present invention relates to the technical field of liquid crystal displays, and particularly relates to a liquid crystal composition containing a 2-methyl-3,4,5-trifluorobenzene liquid crystal compound and use thereof, wherein the liquid crystal composition of the present invention comprises, in percentages by weight, 1-50% of one or more compounds represented by general formula I and 10-70% of one or more compounds represented by general formula II, and may further comprise 0-30% of compounds represented by general formula III and/or 6-45% of one or more compounds represented by general formulas IV to XIII. The liquid crystal composition provided by the present invention has a low rotational viscosity and a large elastic constant, is presented as having a shorter response time, and can significantly improve the display effect of a liquid crystal display when applied to TN, IPS and FFS mode displays.

Abstract: Systems and methods for improving results of wafer higher order shape (HOS) characterization and wafer classification are disclosed. The systems and methods in accordance with the present disclosure are based on localized shapes. A wafer map is partitioned into a plurality of measurement sites to improve the completeness of wafer shape representation. Various site based HOS metric values may be calculated for wafer characterization and/or classification purposes, and may also be utilized as control input for a downstream application. In addition, polar grid partitioning schemes are provided. Such polar grid partitioning schemes may be utilized to partition a wafer surface into measurement sites having uniform site areas while providing good wafer edge region coverage.

Abstract: Systems and methods for prediction and measurement of overlay errors are disclosed. Process-induced overlay errors may be predicted or measured utilizing film force based computational mechanics models. More specifically, information with respect to the distribution of film force is provided to a finite element (FE) model to provide more accurate point-by-point predictions in cases where complex stress patterns are present. Enhanced prediction and measurement of wafer geometry induced overlay errors are also disclosed.

Abstract: Systems and methods for improving results of wafer higher order shape (HOS) characterization and wafer classification are disclosed. The systems and methods in accordance with the present disclosure are based on localized shapes. A wafer map is partitioned into a plurality of measurement sites to improve the completeness of wafer shape representation. Various site based HOS metric values may be calculated for wafer characterization and/or classification purposes, and may also be utilized as control input for a downstream application. In addition, polar grid partitioning schemes are provided. Such polar grid partitioning schemes may be utilized to partition a wafer surface into measurement sites having uniform site areas while providing good wafer edge region coverage.

Abstract: Systems and methods for processing phase maps acquired using interferometer wafer geometry tools are disclosed. More specifically, instead of performing phase unwrapping first and then analyze the unwrapped data in a height domain, systems and methods in accordance with the present disclosure operate in a curvature domain without having to perform any phase unwrapping.

Abstract: Systems and methods for providing micro defect inspection capabilities for optical systems such as wafer metrology tools and interferometer systems are disclosed. The systems and methods in accordance with the present disclosure may detect, classify and quantify wafer surface features, wherein the detected defects are classified and the important defect metrology information of height/depth, area and volume is reported. The systems and methods in accordance with the present disclosure therefore provide more values for quantifying the negative effect of these defects on the wafer quality.

Abstract: Systems and methods for prediction of in-plane distortions (IPD) due to wafer shape in semiconductor wafer chucking process is disclosed. A series of Zernike basis wafer shapes process to emulate the non-linear finite element (FE) contact mechanics model based IPD prediction is utilized in accordance with one embodiment of the present disclosure. The emulated FE model based prediction process is substantially more efficient and provides accuracy comparable to the FE model based IPD prediction that utilizes full-scale 3-D wafer and chuck geometry information and requires computation intensive simulations. Furthermore, an enhanced HOS IPD/OPD prediction process based on a series of Zernike basis wafer shape images is also disclosed.

Abstract: The present invention relates to the liquid crystal field, and particularly relates to a liquid crystal composition and use thereof in the liquid crystal display field. The liquid crystal composition of the present invention comprises, in percentages by weight, 5-40% of one or more compounds represented by general formula I, 2-30% of one or more compounds represented by general formula II, and 20-70% of one or more compounds represented by general formula III, and may further comprise 4-30% of one or more compounds represented by general formula IV and/or 5-25% of one or more compounds represented by general formulas V to IX. The combined use of the above-mentioned compounds can effectively reduce the rotational viscosity of the liquid crystal composition, improves related properties of the mixed liquid crystal, and thus reduces the response time thereof. The liquid crystal composition of the present invention can be used for a fast-response liquid display in a variety of display modes.

Abstract: Systems and methods for providing improved wafer geometry measurements are disclosed. A wafer geometry measurement system may utilize techniques that enable the wafer geometry measurement system to identify and reduce wafer surface errors caused by structures such as patterns on the wafers being measured. The wafer geometry measurement system may also utilize techniques that enable the wafer geometry measurement system to accurately reconstruct patterned wafer surfaces.

Abstract: The present invention relates to the technical field of liquid crystal displays, and particularly relates to a liquid crystal composition containing a 2-methyl-3,4,5-trifluorobenzene liquid crystal compound and use thereof, wherein the liquid crystal composition of the present invention comprises, in percentages by weight, 1-50% of one or more compounds represented by general formula I and 10-70% of one or more compounds represented by general formula II, and may further comprise 0-30% of compounds represented by general formula III and/or 6-45% of one or more compounds represented by general formulas IV to XIII The liquid crystal composition provided by the present invention has a low rotational viscosity and a large elastic constant, is presented as having a shorter response time, and can significantly improve the display effect of a liquid crystal display when applied to TN, IPS and FFS mode displays.

Abstract: The present invention provides a novel liquid crystal material composition comprising one or more compound, in order to achieve the properties of low viscosity, high resistivity, good low-temperature mutual solubility, fast response, excellent transmission, and which can be used for a variety of fast response display modes. Since the working temperature of a LCD material is subjected to the temperature range of individual LC molecules, information can only be displayed in a specific temperature range of the specific liquid crystal macro-alignment phase. At low temperature, the viscosity of liquid crystal increases exponentially, which in turn substantially reduces the response speed and overall performances of the display system.

Abstract: Interferometer systems and methods for providing improved defect detection and quantification are disclosed. The systems and methods in accordance with the present disclosure may detect surface defects on patterned or bare wafer surfaces and subsequently quantify them. In certain embodiments in accordance with the present disclosure, amplitude maps of the wafer surfaces are obtained and are utilized in addition/alternative to phase maps for wafer surface feature detection. Furthermore, local one-dimensional and/or two-dimensional unwrapping techniques are also disclosed and are utilized in certain embodiments in accordance with the present disclosure to provide height and depth information of the detected defects, further improving the detection capabilities of the measurement systems.

Abstract: Methods and systems for detection of selected defects in relatively noisy inspection data are provided. One method includes applying a spatial filter algorithm to inspection data acquired across an area on a substrate to determine a first portion of the inspection data that has a higher probability of being a selected type of defect than a second portion of the inspection data. The selected type of defect includes a non-point defect. The inspection data is generated by combining two or more raw inspection data corresponding to substantially the same locations on the substrate. The method also includes generating a two-dimensional map illustrating the first portion of the inspection data. The method further includes searching the two-dimensional map for an event that has spatial characteristics that approximately match spatial characteristics of the selected type of defect and determining if the event corresponds to a defect having the selected type.

Abstract: Systems and methods for unwrapping phase signals obtained from interferometry measurements of patterned wafer surfaces are disclosed. A phase unwrapping method in accordance with the present disclosure may calculate a front surface phase map and a back surface phase map of a wafer, subtract the back surface phase map from the front surface phase map to obtain a phase difference map, unwrap the phase difference map to obtain a wafer thickness variation map, unwrap the back surface phase map to obtain a back surface map representing the back surface of the wafer; and add the wafer thickness variation map to the back surface phase map to calculate a front surface map representing the front surface of the wafer.

Abstract: Systems and methods for improving results of wafer higher order shape (HOS) characterization and wafer classification are disclosed. The systems and methods in accordance with the present disclosure are based on localized shapes. A wafer map is partitioned into a plurality of measurement sites to improve the completeness of wafer shape representation. Various site based HOS metric values may be calculated for wafer characterization and/or classification purposes, and may also be utilized as control input for a downstream application. In addition, polar grid partitioning schemes are provided. Such polar grid partitioning schemes may be utilized to partition a wafer surface into measurement sites having uniform site areas while providing good wafer edge region coverage.