Abstract: The present invention provides a wafer-level fan-out structure and a manufacturing method thereof. The wafer-level fan-out structure includes a plurality of chips, a sheet-like structure and a plastic packaging layer. The plastic packaging layer covers the plurality of chips and the sheet-like structure. The sheet-like structure includes a first region and a second region. The first region includes a plurality of spaced apertures, and each aperture is adjacent to the second region. The plurality of chips and the plurality of apertures are in one-to-one correspondence, and each chip is located in the corresponding aperture. A Young’s modulus of the plastic packaging layer is smaller than that of the sheet-like structure, and a ratio of an area of the first region to an area of the second region is (0.5-2):1. The wafer-level fan-out structure can remarkably reduce package warpage and achieves better package strength.