Abstract: A computer-implemented method for defect analysis is provided. The computer-implemented method includes obtaining a plurality of sets of defect point coordinates, a respective set of the plurality of sets of detect point coordinates including coordinates of defect points in a respective substrate of a plurality of substrates, the coordinates of defect points in the respective substrate being coordinates in an image coordinate system; combining the plurality of sets of defect point coordinates according to the image coordinate system into a composite set of coordinates to generate a composite image; and performing a clustering analysis to classify defect points in the composite set in the composite image into a plurality of clusters.

Abstract: The present disclosure provides a method for processing defect information of a product, which includes the following steps of: acquiring defect information on a current film layer and defect information on historical film layers; determining whether defect information exists at a target location of the historical film layer if defect information exists at a target location of the current film layer; if defect information exists for a corresponding location to the target location in at least one of the historical film layers, deleting the defect information detected at the target location in the current film layer; and if no defect information exists for the target location in any of the historical film layers, retaining the defect information detected at the target location in the current film layer.

Abstract: A data processing method, comprising: acquiring a production record corresponding to each sample of a plurality of samples, the production record including process information, a production time corresponding to the process information, and an index value; determining a high-incidence time period of defects according to index values and production times corresponding to the process information in acquired production records of a plurality of samples; determining an influence degree of the process information on sudden defect according to the high-incidence time period of defects and the acquired production records.

Abstract: A method for querying a product history is disclosed. The method includes receiving a product query request including at least one product query parameter for a target product to a product graph database that stores a relational map constructed based on a manufacturing process of the target product and describing entities including product entities and manufacturing entities and entity relations therebetween involved in the manufacturing process, querying the product graph database according to the product query parameter to obtain product history data of the target product by searching for a product entity corresponding to the target product as a target product entity in the relational map according to the parameter, searching for associated manufacturing entities of the target product entity according to the entity relations, obtaining the product history data based on the associated manufacturing entities, and sending a notification message to notify obtained product history data.

Abstract: A data processing method includes: obtaining a defect type of a sample set in response to a first input of a user on a first interface, the sample set including samples, each sample having a first parameter used to represent a defect degree of the sample with regard to the defect type and a second parameter used to represent device informations of sample production devices through which the sample passes; calculating yield purity indexes of sample production devices on the samples based on first parameters and second parameters of the samples, so as to obtain influencing parameters of the sample production devices, an influencing parameter of each sample production device being used to represent an influence degree to which the sample production device affects an occurrence of the defect type on the samples; and displaying the influencing parameters of the sample production devices on a second interface.

Abstract: A computer-implemented method for defect analysis is provided. The computer-implemented method includes obtaining a plurality of sets of defect point coordinates, a respective set of the plurality of sets of detect point coordinates including coordinates of defect points in a respective substrate of a plurality of substrates, the coordinates of defect points in the respective substrate being coordinates in an image coordinate system; combining the plurality of sets of defect point coordinates according to the image coordinate system into a composite set of coordinates to generate a composite image; and performing a clustering analysis to classify defect points in the composite set in the composite image into a plurality of clusters.

Abstract: The present disclosure relates to defect prediction methods, apparatuses, electronic devices, and storage media. One of the methods includes: obtaining parameter data of equipment parameters of target equipment within a preset time period; where the parameter data includes values recorded at a preset interval for each of the equipment parameters when a product passes through the target equipment; obtaining fusion features indicating features of the target equipment based on the parameter data; inputting the fusion features into a preset prediction model; and obtaining a prediction result output by the preset prediction model, where the prediction result indicates whether the product is abnormal.

Abstract: A method for querying a product history is disclosed. The method includes receiving a product query request including at least one product query parameter for a target product to a product graph database that stores a relational map constructed based on a manufacturing process of the target product and describing entities including product entities and manufacturing entities and entity relations therebetween involved in the manufacturing process, querying the product graph database according to the product query parameter to obtain product history data of the target product by searching for a product entity corresponding to the target product as a target product entity in the relational map according to the parameter, searching for associated manufacturing entities of the target product entity according to the entity relations, obtaining the product history data based on the associated manufacturing entities, and sending a notification message to notify obtained product history data.

Abstract: Embodiments of the present disclosure provide a motherboard of an array substrate and a manufacturing method thereof. The motherboard of an array substrate includes a plurality of display areas and a plurality of non-display areas. The non-display area is located between adjacent display areas. The display area includes a first pixel unit configured for display. The non-display area includes a second pixel unit configured to test a characteristic of a thin film transistor on the motherboard of an array substrate. Through the second pixel unit, a characteristic of a thin film transistor on the non-display area may be tested, thereby being able to reflect a characteristic of a thin film transistor on the display area.