Patents by Inventor Haijun Dai

Haijun Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260341950
    Abstract: Disclosed is a transparent thin-film antenna and its manufacturing method, including: providing a base substrate and a conductive substrate layered on the substrate; performing laser depth-controlled cutting treatment on the conductive substrate to form an antenna pattern layer with multiple grooves, wherein the grooves limits the routing distance of the antenna pattern layer, and the portion between two adjacent grooves forms the routing of the antenna pattern layer; laminating the antenna pattern layer with a transparent substrate to fill each groove with the transparent substrate; peeling off the base substrate to make the antenna pattern layer and the transparent substrate to form a transparent thin-film antenna. It does not require additional molds and can eliminate reliance on high-precision imprint molds, reduce costs, and shorten lead time. In addition, copper foil can be used in conjunction with laser depth-controlled cutting process to manufacture antenna pattern layers.
    Type: Application
    Filed: June 14, 2026
    Publication date: October 29, 2026
    Applicant: SHENZHEN DEMAN ELECTRONICS CO., LTD.
    Inventors: RUMIN XIAO, HAIJUN DAI, XU ZHANG, BIN ZHANG
  • Patent number: 12242747
    Abstract: A data processing method in a storage system is provided. The method includes: when the storage system is under a first load, performing an inline deduplication operation; and when the storage system is under a second load, directly storing a received second data block without performing the inline deduplication operation, where the first load is less than the second load.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: March 4, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Ren Ren, Chen Wang, Haijun Dai, Fangfang Zhu
  • Patent number: 12019890
    Abstract: A data processing method in a storage system is provided. The method includes: when the storage system is under a first load, performing an inline deduplication operation; and when the storage system is under a second load, directly storing a received second data block without performing the inline deduplication operation, where the first load is less than the second load.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: June 25, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Ren Ren, Chen Wang, Haijun Dai, Fangfang Zhu
  • Publication number: 20220300180
    Abstract: A data processing method in a storage system is provided. The method includes: when the storage system is under a first load, performing an inline deduplication operation; and when the storage system is under a second load, directly storing a received second data block without performing the inline deduplication operation, where the first load is less than the second load.
    Type: Application
    Filed: June 1, 2022
    Publication date: September 22, 2022
    Inventors: Ren Ren, Chen Wang, Haijun Dai, Fangfang Zhu
  • Publication number: 20220147256
    Abstract: A data processing method in a storage system is provided. The method includes: when the storage system is under a first load, performing an inline deduplication operation; and when the storage system is under a second load, directly storing a received second data block without performing the inline deduplication operation, where the first load is less than the second load.
    Type: Application
    Filed: January 25, 2022
    Publication date: May 12, 2022
    Inventors: Ren Ren, Chen Wang, Haijun Dai, Fangfang Zhu