Patents by Inventor Haijun She

Haijun She has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Temperature stabilizing enclosure
    Patent number: 10655896
    Abstract: A device includes a substrate, a micro-electro-mechanical system (MEMS) device disposed on the substrate, a controller disposed on the substrate, a heating element, and an enclosure. The heating element is configured to generate heat in response to a signal generated by the controller. The enclosure encloses the MEMS sensor device, the controller, and the heating element. The controller is configured to generate the signal responsive to temperature measurements within the enclosure. The signal causes the heating element to generate heat and maintain a predetermined temperature within the enclosure.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: May 19, 2020
    Assignee: InvenSense, Inc.
    Inventors: Muhammad Maaz Qazi, Brian H. Kim, Haijun She
  • Assembly and packaging of MEMS device
    Patent number: 10472231
    Abstract: A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: November 12, 2019
    Assignee: Invensense, Inc.
    Inventors: Brian H. Kim, Haijun She, Mozafar Maghsoudnia
  • ASSEMBLY AND PACKAGING OF MEMS DEVICE
    Publication number: 20190308874
    Abstract: A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.
    Type: Application
    Filed: October 27, 2016
    Publication date: October 10, 2019
    Inventors: Brian H. Kim, Haijun She, Mozafar Maghsoudnia
  • TEMPERATURE STABILIZING ENCLOSURE
    Publication number: 20170176062
    Abstract: A device includes a substrate, a micro-electro-mechanical system (MEMS) device disposed on the substrate, a controller disposed on the substrate, a heating element, and an enclosure. The heating element is configured to generate heat in response to a signal generated by the controller. The enclosure encloses the MEMS sensor device, the controller, and the heating element. The controller is configured to generate the signal responsive to temperature measurements within the enclosure. The signal causes the heating element to generate heat and maintain a predetermined temperature within the enclosure.
    Type: Application
    Filed: December 15, 2016
    Publication date: June 22, 2017
    Inventors: Muhammad Maaz QAZI, Brian H. KIM, Haijun SHE
  • ASSEMBLY AND PACKAGING OF MEMS DEVICE
    Publication number: 20170044007
    Abstract: A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.
    Type: Application
    Filed: October 27, 2016
    Publication date: February 16, 2017
    Inventors: Brian H. Kim, Haijun She, Mozafar Maghsoudnia
  • Assembly and packaging of MEMS device
    Patent number: 9508663
    Abstract: A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: November 29, 2016
    Assignee: INVENSENSE, INC.
    Inventors: Brian H. Kim, Haijun She, Mozafar Maghsoudnia
  • ASSEMBLY AND PACKAGING OF MEMS DEVICE
    Publication number: 20150028432
    Abstract: A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.
    Type: Application
    Filed: July 24, 2013
    Publication date: January 29, 2015
    Inventors: Brian H. Kim, Haijun She, Mozafar Maghsoudnia