Abstract: A method for testing the tightness of a housing involves providing a pressure sensor in a housing, sealing the housing, and detecting a pressure level in the housing.

Abstract: A method for testing the tightness of a housing involves providing a pressure sensor in a housing, sealing the housing, and detecting a pressure level in the housing.

Abstract: In the manufacture of a high-frequency assembly, a plurality of components, at least one (12) of which is frequency-specific, are placed with respect to each other using a placing apparatus and are interconnected. In a specimen of the frequency-specific component (12, 30) a feature (23, 24) which encodes the frequency is looked for. The specimen is built in if the feature (23, 24; 26) is found in the specimen and is judged to be correct; otherwise the specimen is rejected.

Abstract: For gluing a circuit component (17) to a circuit board (1), at first at least one fore-running adhesive dot (14) is placed within a contact area (2) between the circuit component (17) and the circuit board (1), then adhesive dots (4) are placed in a regular pattern, and finally the adhesive dots (4) are brought to merge by pressing the circuit component (17) and the circuit board (1) against each other.

Abstract: A circuit assembly comprises a circuit board, at least one circuit component connected to the circuit board by wire bonding, and a base plate, on which the circuit board is fixed. A gap between the base plate and the circuit board fixed to it is filled at least locally by a filling body made of a material hardened in the gap.

Abstract: In the manufacture of a high-frequency assembly, a plurality of components, at least one (12) of which is frequency-specific, are placed with respect to each other using a placing apparatus and are interconnected. In a specimen of the frequency-specific component (12, 30) a feature (23, 24) which encodes the frequency is looked for. The specimen is built in if the feature (23, 24; 26) is found in the specimen and is judged to be correct; otherwise the specimen is rejected.

Abstract: A circuit component (1) is glued to the circuit substrate (2) by the following steps: a) seizing a circuit component (1) using a grip-per (4); b) moving the gripper (4) towards the surface of the circuit substrate (2) up to a target distance from the surface at which adhesive (3) applied between the circuit component (1) and the circuit substrate (2) is pressed; C) releasing the circuit component (1) and removing the gripper (4) from the circuit component (1); d) turning the gripper (4) around an axis (A) perpendicular to the surface of the circuit substrate (2); e) moving the gripper (4) into the target distance again; and f) removing the gripper (4) again.

Abstract: A method of gluing a circuit component onto a circuit board. The circuit component has a bottom area with at least one edge for bringing into contact with the circuit board. The distance between the edge and a first line parallel to the edge and an amount of adhesive to be applied per length unit along the line are determined such that, when placing the circuit component on the circuit board,the adhesive advances to the edge but not to a second circuit component adjacent to the edge. The adhesive is applied in the selected quantity along the first line and along further lines which are parallel to the first line and further away from the edge. Then, the circuit component is placed on the circuit board.

Abstract: In a procedure for automatically placing components of a circuit on a base plate based on predefined position data, the position of at least one first reference mark formed at the base plate is detected. A target position for placing a substrate on the base plate is calculated based on the detected position of the first reference mark and the position data, and the substrate is placed at the calculated position. The position of at least one second reference mark formed at the substrate is detected and a target position for placing a further component on the substrate is calculated based on the detected position of the second reference mark and the position data predefined for said component, and the component is placed at the calculated target position.