Abstract: An optical path compensation apparatus includes a wedge assembly, a driving mechanism and a preload unit. The wedge assembly includes a movable wedge and a fixed wedge. The movable wedge and the fixed wedge having equal wedge angles and respective wedge surfaces inclined in opposite directions. The preload unit is configured to elastically press the movable wedge on the fixed wedge, and the driving mechanism is configured to cause relative movement between the wedge surface of the movable wedge and the wedge surface of the fixed wedge. This optical path compensation apparatus is capable of achieving effective position correction of a focal plane of a measurement system for focusing and leveling in a smooth, convenient and precise way while not causing any error in other directions.

Abstract: A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

Abstract: An optical path compensation apparatus includes a wedge assembly, a driving mechanism and a preload unit. The wedge assembly includes a movable wedge and a fixed wedge. The movable wedge and the fixed wedge having equal wedge angles and respective wedge surfaces inclined in opposite directions. The preload unit is configured to elastically press the movable wedge on the fixed wedge, and the driving mechanism is configured to cause relative movement between the wedge surface of the movable wedge and the wedge surface of the fixed wedge. This optical path compensation apparatus is capable of achieving effective position correction of a focal plane of a measurement system for focusing and leveling in a smooth, convenient and precise way while not causing any error in other directions.

Abstract: A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.