Abstract: A semiconductor structure is provided, including: a substrate and a dielectric layer arranged on the substrate; a conductive plug, wherein a first part of the conductive plug is arranged in the substrate, and a second part of the conductive plug is arranged in the dielectric layer; and an isolation ring structure at least surrounding the second part of the conductive plug.

Abstract: An invisible orthodontic device without an occlusal surface includes a medial surface and a lateral surface. The medial surface is a side surface adjacent to the tongue, and the lateral surface is a side surface adjacent to the cheek. One end of each of the medial surface and the lateral surface is connected through a top face, and other ends thereof are in an open state and include a wearing hole. Lateral sides of the medial surface and the lateral surface are connected through a connection face. The medial surface, the lateral surface, the top face and the connection face enclose to form an accommodation groove in the middle for accommodating teeth. The wearing hole is in communication with the accommodation groove, and the invisible orthodontic device can be worn on the teeth through the wearing hole. The invisible orthodontic device includes an anterior region and a molar region.