Abstract: Semiconductor devices and methods of forming semiconductor devices are described. A method of forming metal silicon nitride films is disclosed. Some embodiments of the disclosure provide a process using ammonia plasma for treating a metal silicide or metal film to form a metal silicon nitride film. The ammonia plasma treatment generates NH* radicals that diffuse through the metal silicide to form a metal silicon nitride film that is substantially free of silicon nitride (SiN). The metal silicon nitride films have improved resistance relative to films deposited by thermal processes or plasma processes with a nitrogen plasma exposure.

Abstract: Memory devices and methods of forming memory devices are described. The memory devices comprise a silicon nitride hard mask layer on a ruthenium layer. Forming the silicon nitride hard mask layer on the ruthenium comprises pre-treating the ruthenium layer with a plasma to form an interface layer on the ruthenium layer; and forming a silicon nitride layer on the interface layer by plasma-enhanced chemical vapor deposition (PECVD). Pre-treating the ruthenium layer, in some embodiments, results in the interface layer having a reduced roughness and the memory device having a reduced resistivity compared to a memory device that does not include the interface layer.

Abstract: A single piece electrical connector having a housing with a mating face, a wire receiving face, and housing side walls. Terminal receiving cavities extend from the mating face to the wire receiving face. The terminal receiving cavities have cavity side walls. Resilient securing arms are provided in the terminal receiving cavities. The resilient securing arms have fixed portions which extend from and are integrally attached to base members which extend from and are integrally attached to the cavity side walls of the terminal receiving cavities. The resilient securing arms are made from the same material and in the same manufacturing process that forms the housing. The fixed ends are spaced from the cavity side walls by gaps. The gaps between the resilient securing arms and the cavity side walls facilitate the cleaning or removal of excess material formed during the manufacturing process of the electrical connector.

Abstract: An electrical connector includes a shell and a coupling ring. The shell has contact receiving passages and an outer wall with a coupling ring retaining projection. The coupling ring is integrally mounted on the shell. The coupling ring is movable between a first position and a second position. A spring is integrally positioned on the coupling ring. The spring is provided in a stressed position when the coupling ring is moved to the second position. Openings are provided in the coupling ring; the openings being positioned proximate the spring. The opening are dimensioned to allow the removal of residual material produced during the manufacture of the electrical connector.

Abstract: A single piece electrical connector having a housing with a mating face, a wire receiving face, and housing side walls. Terminal receiving cavities extend from the mating face to the wire receiving face. The terminal receiving cavities have cavity side walls. Resilient securing arms are provided in the terminal receiving cavities. The resilient securing arms have fixed portions which extend from and are integrally attached to base members which extend from and are integrally attached to the cavity side walls of the terminal receiving cavities. The resilient securing arms are made from the same material and in the same manufacturing process that forms the housing. The fixed ends are spaced from the cavity side walls by gaps. The gaps between the resilient securing arms and the cavity side walls facilitate the cleaning or removal of excess material formed during the manufacturing process of the electrical connector.

Abstract: An electrical connector includes a shell and a coupling ring. The shell has contact receiving passages and an outer wall with a coupling ring retaining projection. The coupling ring is integrally mounted on the shell. The coupling ring is movable between a first position and a second position. A spring is integrally positioned on the coupling ring. The spring is provided in a stressed position when the coupling ring is moved to the second position. Openings are provided in the coupling ring; the openings being positioned proximate the spring. The opening are dimensioned to allow the removal of residual material produced during the manufacture of the electrical connector.

Abstract: System includes a first object having an energy-assisted bonding (EAB) mechanism along a surface of the first object. The EAB mechanism includes a heat-activatable adhesive layer and a carbon-filled (CF) sheet material. The CF sheet material is electrically conductive for resistive heating. A control sub-system is configured to control a coupling actuator to drive an actuator body toward the first object, wherein the actuator body and the first object engage each other. The coupling actuator is configured to apply pressure to the EAB mechanism along the surface of the first object. The control sub-system is also configured to control the power source to apply a current through the CF sheet material of the EAB mechanism to provide thermal energy through resistive heating that activates the adhesive layer along the interface.

Abstract: System includes a first object having an energy-assisted bonding (EAB) mechanism along a surface of the first object. The EAB mechanism includes a heat-activatable adhesive layer and a carbon-filled (CF) sheet material. The CF sheet material is electrically conductive for resistive heating. A control sub-system is configured to control a coupling actuator to drive an actuator body toward the first object, wherein the actuator body and the first object engage each other. The coupling actuator is configured to apply pressure to the EAB mechanism along the surface of the first object. The control sub-system is also configured to control the power source to apply a current through the CF sheet material of the EAB mechanism to provide thermal energy through resistive heating that activates the adhesive layer along the interface.