Abstract: A non-destructive testing method for flexural strength of fine ceramic, an apparatus, and a storage medium, including adjusting an uncut intact fine ceramic test sample to an ultrasonic testing position, and fixing the test sample; adjusting an ultrasonic testing instrument, controlling and adjusting the positions of ultrasonic testing probes of the ultrasonic testing instrument until the ultrasonic testing probes, the fine ceramic test sample and the resiling direction are located on the same plane, performing ultrasonic testing on the test sample, and collecting ultrasonic testing data of the test sample; adjusting the position of the fine ceramic test sample until a resilience testing rod and the test sample are located on the same plane and fixed, performing resilience testing on the test sample, and collecting resilience testing data of the test sample; and building a data model, or substituting testing data into the pre-built data model.

Abstract: A compound of Formula (I), or a pharmaceutically acceptable salt thereof, is provided that has been shown to be useful for treating a PRC2-mediated disease or disorder: wherein R1, R2, R3, R4, R5, and n are as defined herein.

Abstract: A semiconductor structure includes a plurality of composite layers formed on a portion of a substrate. An interlayer dielectric layer is formed on the substrate and the plurality of composite layers. A first gate trench is formed on the interlayer dielectric layer, and a gate sidewall is formed on a side surface of the first gate trench. The composite layer includes stacked channel layers and a second gate trench between neighboring channel layers. The first gate trench and the gate sidewall cross over a portion of a sidewall and a portion of a top surface of the composite layer, and the first gate trench communicates with the second gate trench. A gate is formed in the first and second gate trenches. The doping region is formed in a channel layer. The source-drain layer is formed in the composite layer on two sides of the gate structure.

Abstract: A semiconductor structure and a fabrication method of the semiconductor structure are provided. The method includes providing a substrate, forming a first dielectric layer and a plurality of gate structures, forming source-drain doped regions, and forming a source-drain plug. The first dielectric layer covers surfaces of the gate structure, the source-drain doped region and the source-drain plug. The method also includes forming a first plug in the first dielectric layer, and forming a second dielectric layer on the first dielectric layer. The first plug is in contact with a top surface of one of the source-drain plug and the gate structure. The second dielectric layer covers the first plug. Further, the method includes forming a second plug material film in the first and second dielectric layers. The second plug material film is in contact with the top surface of one of the source-drain plug and the gate structure.

Abstract: A backlight module includes: a first optical element and a fixing frame arranged around the first optical element. The fixing frame includes a first edge frame and a second edge frame that are oppositely arranged, and a third edge frame and a fourth edge frame that are oppositely arranged. The side of each edge frame of the fixing frame facing the first optical element is provided with a plurality of adhesive tapes that are independent of each other and extend in an extension direction of the each edge frame.

Abstract: A non-destructive testing method for an elastic modulus of fine ceramic, an apparatus, and a storage medium, including controlling intact fine ceramic to enter a first testing position, fixing the test sample, controlling an ultrasonic testing instrument to be adjusted to a position of the sample, performing ultrasonic testing e, and collecting testing data; adjusting the sample to a second testing position, performing resilience testing on the sample, and collecting resilience data; building a data model according to the testing data, or substituting the testing data into the pre-built data model to obtain elastic modulus characterization data of the test sample. The test sample does not need to be cut into small-size test samples and is not destroyed, and the intact fine ceramic is subjected to non-destructive testing. The accuracy of tested data is improved, damage to the test sample is also avoided, and reuse of the sample is realized.

Abstract: An electronic ink screen and a method for manufacturing the same are provided. The electronic ink screen includes: a display module including pixel units configured to display by using electronic ink; and a control module configured to convert a touch signal applied from outside into a change of electric signal of corresponding one or more pixel units through an electrode microstructure, so that a display state of the corresponding one or more pixel units is changed from an initial state; the electrode microstructure includes sub-electrode microstructures, each sub-electrode microstructure includes a first nano electrode and a second nano electrode which are made of different materials, the first nano electrode and the second nano electrode are arranged at intervals and configured to be in mutual friction contact in response to that the touch signal applied from the outside is received, so as to generate charge transferring.

Abstract: Disclosed herein is an ingestible composition comprising a sphingan and its use as a prebiotic.

Abstract: A semiconductor structure and its fabrication method are provided. The method includes: providing a substrate and a first metal layer in the substrate; forming a dielectric layer with a first opening exposing a portion of a top surface of the first metal layer on the substrate; bombarding the portion of the top surface of the first metal layer exposed by the first opening, by using a first sputtering treatment, to make metal materials on the top surface of the first metal layer be sputtered onto sidewalls of the first opening to form a first adhesion layer; and forming a second metal layer on a surface of the first adhesion layer and on the exposed portion of the top surface of the first metal layer using a first metal selective growth process.

Abstract: A method for forming a semiconductor structure includes providing an initial semiconductor structure formed in a substrate; forming a dielectric layer on the substrate; forming a first opening in the dielectric layer to expose a portion of the initial semiconductor structure; etching the portion of the initial semiconductor structure exposed at a bottom of the first opening to form a second opening in the initial semiconductor structure; and forming a contact layer in the second opening and a third opening in the contact layer. The contact layer has a concave top surface, and the third opening is located above the concave top surface of the contact layer and under the first opening. The method further includes forming a conductive structure in the first opening and the third opening.

Abstract: An electronic ink screen and a method for manufacturing the same are provided. The electronic ink screen includes: a display module including pixel units configured to display by using electronic ink; and a control module configured to convert a touch signal applied from outside into a change of electric signal of corresponding one or more pixel units through an electrode microstructure, so that a display state of the corresponding one or more pixel units is changed from an initial state; the electrode microstructure includes sub-electrode microstructures, each sub-electrode microstructure includes a first nano electrode and a second nano electrode which are made of different materials, the first nano electrode and the second nano electrode are arranged at intervals and configured to be in mutual friction contact in response to that the touch signal applied from the outside is received, so as to generate charge transferring.

Abstract: Provided is a prelithiation material, comprising a lithium-containing compound and an inorganic non-metallic reductive agent. Further provided is a method for preparing the prelithiation material of the present invention. Further provided is use of the prelithiation material of the present invention in a lithium ion battery. By mixing the prelithiation material provided by the present invention with a positive electrode material or coating the side of a separator near the positive electrode with the same, a battery is assembled, and during first cycle, active lithium can be released so as to compensate active lithium lost from a negative electrode. The prelithiation material provided by the present invention has a good compatibility with currently commercially available positive and negative electrodes, and is very suitable for current secondary lithium ion batteries.

Abstract: Methods for performing network configuration on apparatus and network configuration systems are provided. The method includes: receiving a network configuration request sent by a network configuration application, wherein the network configuration request includes hotspot information of an online hotspot; generating a hotspot switching command based on the network configuration request; and sending the hotspot switching command to an apparatus needing network configuration through a network configuration hotspot, to make the apparatus switch a hotspot that the apparatus currently connects to from the network configuration hotspot to the online hotspot.

Abstract: Disclosed herein is an ingestible composition comprising a sphingan and its use as a prebiotic.

Abstract: Semiconductor structure and forming method thereof are provided. The forming method includes: providing a substrate; forming a plurality of initial composite layers on a portion of the substrate; forming a plurality of source and drain layers on surfaces of the plurality of channel layers exposed by a first opening and grooves by using a selective epitaxial growth process, the plurality of source and drain layers being parallel to a first direction and distributed along a second direction, the second direction being parallel to a normal direction of the substrate, and gaps being between adjacent source and drain layers; forming contact layers on surfaces of the plurality of source and drain layers and in the gaps; and forming a conductive structure on a surface of a contact layer on a source and drain layer of the plurality of source and drain layers.

Abstract: The embodiments of the present disclosure provide a display panel, a manufacturing method thereof, and a display device. The display panel includes a first substrate and a second substrate cell-assembled to each other, a light emitting member layer disposed between the first substrate and the second substrate and a light diffusion layer disposed on a light existing side of the light emitting member layer, the light emitting member layer includes a plurality of light emitting units and imaging holes disposed on at least two sides of each of the light emitting units, the light diffusion layer includes a reflective member configured to reflect a light ray emitted by the light emitting unit and reaching the reflective member, and the reflected light ray reflected by the reflective member exits from the imaging holes.

Abstract: A backlight assembly and a display device including the backlight assembly are provided. The backlight assembly includes a light source unit, a peep-proof layer on a light emitting side of the light source unit, a light adjustment layer on a side of the peep-proof layer distal to the light source unit, and a plurality of first microstructures between the peep-proof layer and the light adjustment layer and spaced apart from each other.

Abstract: An ultrasonic-resilience value testing apparatus for an inorganic non-metal plate, including: a fixing mechanism, a testing mechanism and a control mechanism. The fixing mechanism is for carrying and fixing an inorganic non-metal plate to be tested; the testing mechanism is for performing ultrasonic-resilience value testing on the inorganic non-metal plate fixed on the fixing mechanism; and the control mechanism is in communication connection to the fixing mechanism and the testing mechanism, and is for controlling the fixing mechanism and the testing mechanism to run. By setting the fixing mechanism, problems such as slipping, angle deviation, vibration or movement and damage to the test sample are avoided. By setting the testing mechanism for the resilience value testing, the phenomenon that the relevant mechanical properties of the test sample cannot be accurately reflected since a resilience angle, a velocity and the like are affected by human factors, is improved.

Abstract: A non-destructive testing method for flexural strength of fine ceramic, an apparatus, and a storage medium, including adjusting an uncut intact fine ceramic test sample to an ultrasonic testing position, and fixing the test sample; adjusting an ultrasonic testing instrument, controlling and adjusting the positions of ultrasonic testing probes of the ultrasonic testing instrument until the ultrasonic testing probes, the fine ceramic test sample and the resiling direction are located on the same plane, performing ultrasonic testing on the test sample, and collecting ultrasonic testing data of the test sample; adjusting the position of the fine ceramic test sample until a resilience testing rod and the test sample are located on the same plane and fixed, performing resilience testing on the test sample, and collecting resilience testing data of the test sample; and building a data model, or substituting testing data into the pre-built data model.

Abstract: A non-destructive testing method for an elastic modulus of fine ceramic, an apparatus, and a storage medium, including controlling intact fine ceramic to enter a first testing position, fixing the test sample, controlling an ultrasonic testing instrument to be adjusted to a position of the sample, performing ultrasonic testing e, and collecting testing data; adjusting the sample to a second testing position, performing resilience testing on the sample, and collecting resilience data; building a data model according to the testing data, or substituting the testing data into the pre-built data model to obtain elastic modulus characterization data of the test sample. The test sample does not need to be cut into small-size test samples and is not destroyed, and the intact fine ceramic is subjected to non-destructive testing. The accuracy of tested data is improved, damage to the test sample is also avoided, and reuse of the sample is realized.