Patents by Inventor Hailuo FU

Hailuo FU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesion promoting process for metallisation of substrate surfaces
    Patent number: 10487404
    Abstract: A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a metal oxide adhesion promoter which is activated and then metal plated. The method provides high adhesion of the non-conductive substrate to the plated metal layer.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: November 26, 2019
    Assignee: Atotech Deutschland GmbH
    Inventors: Zhiming Liu, Hailuo Fu, Sara Hunegnaw, Lutz Brandt
  • NOVEL ADHESION PROMOTING AGENTS FOR METALLISATION OF SUBSTRATE SURFACES
    Publication number: 20160237571
    Abstract: A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a novel combination of a metal oxide compound to promote adhesion and a transition metal plating catalyst compound promoting the metal layer formation.
    Type: Application
    Filed: September 22, 2014
    Publication date: August 18, 2016
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Zhiming LIU, Hailuo FU, Sara HUNEGNAW, Lutz BRANDT, Tafadzwa MAGAYA
  • NOVEL ADHESION PROMOTING PROCESS FOR METALLISATION OF SUBSTRATE SURFACES
    Publication number: 20160208387
    Abstract: A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a metal oxide adhesion promoter which is activated and then metal plated. The method provides high adhesion of the non-conductive substrate to the plated metal layer.
    Type: Application
    Filed: September 22, 2014
    Publication date: July 21, 2016
    Applicant: Atotech Deutschland GmbH
    Inventors: Zhiming LIU, Hailuo FU, Sara HUNEGNAW, Lutz BRANDT