Patents by Inventor Haim Epstein

Haim Epstein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High density front access device
    Patent number: 7259325
    Abstract: A high density device comprising: a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack, the chassis frame defining a front plane and a back plane, the front plane being substantially coincident with a front support of the telecommunications rack; a sub-module chassis secured to the chassis frame, the sub-module chassis exhibiting a proximal face and a distal face; a first plurality of jacks located distal of the proximal face of the sub-module chassis; and a passageway formed between the sub-module chassis and an inner wall of the chassis frame, the passageway configured and dimensioned for the passage of cabling for connection to the first plurality of jacks.
    Type: Grant
    Filed: February 22, 2005
    Date of Patent: August 21, 2007
    Assignee: PowerDsine, Ltd.-Microsemi Corporation
    Inventors: David Pincu, Haim Epstein
  • High density front access device
    Publication number: 20050201073
    Abstract: A high density device comprising: a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack, the chassis frame defining a front plane and a back plane, the front plane being substantially coincident with a front support of the telecommunications rack; a sub-module chassis secured to the chassis frame, the sub-module chassis exhibiting a proximal face and a distal face; a first plurality of jacks located distal of the proximal face of the sub-module chassis; and a passageway formed between the sub-module chassis and an inner wall of the chassis frame, the passageway configured and dimensioned for the passage of cabling for connection to the first plurality of jacks.
    Type: Application
    Filed: February 22, 2005
    Publication date: September 15, 2005
    Inventors: David Pincu, Haim Epstein