Patents by Inventor Haina Wu

Haina Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing holes in component carrier material
    Patent number: 11039535
    Abstract: A method includes providing an electrically conductive layer structure on top of an electrically insulating layer structure, forming a window in the electrically conductive layer structure and removing material of the electrically insulating layer structure below the window by a first laser beam, and subsequently removing further material of the electrically insulating layer structure below the window by a second laser beam having a smaller size than a size of the window.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: June 15, 2021
    Assignee: AT&S (China) Co. Ltd.
    Inventors: Seok Kim Tay, Abderrazzaq Ifis, Haina Wu
  • Manufacturing Holes In Component Carrier Material
    Publication number: 20200253051
    Abstract: A method includes providing an electrically conductive layer structure on top of an electrically insulating layer structure, forming a window in the electrically conductive layer structure and removing material of the electrically insulating layer structure below the window by a first laser beam, and subsequently removing further material of the electrically insulating layer structure below the window by a second laser beam having a smaller size than a size of the window.
    Type: Application
    Filed: January 28, 2020
    Publication date: August 6, 2020
    Inventors: Seok Kim Tay, Abderrazzaq Ifis, Haina Wu