Patents by Inventor Haiqiang SONG

Haiqiang SONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • OPTICAL SENSOR PACKAGE STRUCTURE AND ELECTRONIC DEVICE
    Publication number: 20230246012
    Abstract: Disclosed are an optical sensor package structure and a device. The optical sensor package structure includes a substrate, a signal processing chip, a photodiode and a potting adhesive layer. The signal processing chip provided on a surface of the substrate is provided with a conductive through hole, and the signal processing chip is electrically connected to the substrate via the conductive through hole. The photodiode provided on a surface of the signal processing chip away from the substrate is electrically connected to the substrate via the conductive through hole. The potting adhesive layer is for wrapping the signal processing chip and the photodiode, and an elongation at break of the potting adhesive layer is greater than 40%.
    Type: Application
    Filed: December 10, 2020
    Publication date: August 3, 2023
    Inventors: Kui WANG, Dexin WANG, Yanmei SUN, Haiqiang SONG