Patents by Inventor Hairui LIU

Hairui LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240159730
    Abstract: A signal processing system and method for inductive oil abrasive particle sensor, comprising a sensor, an excitation signal generator, an analog signal processing circuit, a MCU signal acquisition module and a computer signal processing module is disclosed. The sensor is provided with two groups of induction coils, the excitation signal generator generates excitation signals and drives the excitation coils of the sensor to output induction signals containing abrasive particle information, and the analog signal processing circuit receives the induction signals output by the sensor and demodulates and amplifies the induction signals. The signal processing system of the sensor applied to online monitoring of oil abrasive particles is simple in structure and convenient to apply, has a complete signal statistics and monitoring interface, and can be used to effectively monitor the size, concentration and other information of the metal abrasive particles in oil in real time.
    Type: Application
    Filed: November 14, 2023
    Publication date: May 16, 2024
    Inventors: Zhenghua QIAN, Mingming WANG, Peng LI, Xianwei WU, Hairui LIU, Zhi QIAN, Qi LI, Zelin XU
  • Publication number: 20240120903
    Abstract: A semiconductor device including a first functional module arranged on a first substrate and having a chip, an electrical connection component and a sealing ring, where the sealing ring surrounds the chip, and the chip is electrically connected to the electrical connection component; a second functional module having a packaging substrate, where the packaging substrate includes at least two metal layers and a dielectrical layer between the metal layers; a third functional module having multiple redistribution lines and multiple micro through holes for electrical connection between the first functional module and the second functional module, where the electrical connection component in the first functional module is electrically connected to the third functional module; and a second substrate, where the second substrate is sealed with the first substrate.
    Type: Application
    Filed: July 17, 2023
    Publication date: April 11, 2024
    Inventors: Hairui LIU, Zhiguo LAI, Qinghua YANG