Patents by Inventor Haisheng Tu

Haisheng Tu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240049505
    Abstract: Embodiments of this application provide a display terminal, and relate to the field of display technologies, to solve the problem that the overall screen-to-body ratio decreases due to a receiver disposed on a display terminal. The display terminal includes a middle frame, a display module, a vibrator, and at least one vibrating plate. The display module is connected to the middle frame, and an accommodation space is formed between the display module and the middle frame. At least a part of the vibrator is disposed in the accommodation space. The vibrator is connected to the display module or the middle frame. The vibrating plate is located in the accommodation space. An upper surface of the vibrating plate is connected to a lower surface of the display module. A lower surface of the vibrating plate faces the middle frame.
    Type: Application
    Filed: July 23, 2020
    Publication date: February 8, 2024
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yingming LI, Senjun CHEN, Chien Feng YEH, Renxuan QIN, Chao XU, Haisheng TU
  • Publication number: 20230363087
    Abstract: This application provides a printed circuit board assembly and an electronic device. The printed circuit board assembly includes: a printed circuit board, where the printed circuit board includes a functional network, and the functional network is configured to provide an electrical function; a conductive part, where the conductive part is connected to the printed circuit board and is electrically connected in parallel to the functional network; and a cover-shaped structure, where the cover-shaped structure covers the conductive part and is connected to the printed circuit board, and the cover-shaped structure is configured to prevent the conductive part located in the cover-shaped structure from contacting a conductor outside the cover-shaped structure. The foregoing technical solutions can reduce impedance of a circuit board, improve a current utilization, and further improve mechanical reliability of the circuit board.
    Type: Application
    Filed: September 7, 2021
    Publication date: November 9, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Hongbin Shi, Xin Guo, Lixiang Wang, Haisheng Tu, Benyin Zheng