Patents by Inventor Hai Sung Lee

Hai Sung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8557617
    Abstract: A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.
    Type: Grant
    Filed: February 22, 2007
    Date of Patent: October 15, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youn Gon Park, Jong Myeon Lee, Hai Sung Lee, Myung Whun Chang, Ho Sung Choo
  • Patent number: 8226852
    Abstract: The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: July 24, 2012
    Assignee: Samsung LED Co., Ltd.
    Inventors: Hai Sung Lee, Jong Myeon Lee, Ho Sung Choo, Myung Whun Chang, Youn Gon Park
  • Publication number: 20110043100
    Abstract: The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.
    Type: Application
    Filed: October 28, 2010
    Publication date: February 24, 2011
    Applicant: SAMSUNG LED CO., LTD.
    Inventors: Hai Sung LEE, Jong Myeon Lee, Ho Sung Choo, Myung Whun Chang, Youn Gon Park
  • Patent number: 7842333
    Abstract: The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: November 30, 2010
    Assignee: Samsung LED Co., Ltd.
    Inventors: Hai Sung Lee, Jong Myeon Lee, Ho Sung Choo, Myung Whun Chang, Youn Gon Park
  • Patent number: 7829056
    Abstract: Disclosed herein is a method of forming a guanidine group on carbon nanotubes to improve the dispersibility of carbon nanotubes, a method of attaching carbon nanotubes having guanidine groups to a substrate, and carbon nanotubes and a substrate manufactured by the above methods. The method of forming the guanidine group on the carbon nanotubes includes forming a carboxyl group on the carbon nanotubes, and forming the guanidine group on the carboxyl group of the carbon nanotubes. In addition, the method of attaching the carbon nanotubes having guanidine groups to the substrate includes coating a substrate with a polymer having crown ether attached thereto, drying the polymer layer having crown ether attached thereto formed on the substrate to be semi-dried, and coating the semi-dried polymer layer with a solution including carbon nanotubes having guanidine groups dispersed therein.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: November 9, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Hai Sung Lee
  • Publication number: 20090063530
    Abstract: A system and method for a mobile web service is provided. A system for a mobile web service includes: a generator parsing a web page to generate a text formatted first hierarchical structure tree; a converter encoding the generated first hierarchical structure tree to convert the encoded first hierarchical structure tree into a binary formatted second hierarchical structure tree; and a transmitter transmitting the converted second hierarchical structure tree to a mobile terminal.
    Type: Application
    Filed: September 3, 2008
    Publication date: March 5, 2009
    Inventors: Jihoon LEE, Hai-Sung LEE, Jong-Oh KAHNG
  • Publication number: 20080193656
    Abstract: Disclosed herein is a method of forming a guanidine group on carbon nanotubes to improve the dispersibility of carbon nanotubes, a method of attaching carbon nanotubes having guanidine groups to a substrate, and carbon nanotubes and a substrate manufactured by the above methods. The method of forming the guanidine group on the carbon nanotubes includes forming a carboxyl group on the carbon nanotubes, and forming the guanidine group on the carboxyl group of the carbon nanotubes. In addition, the method of attaching the carbon nanotubes having guanidine groups to the substrate includes coating a substrate with a polymer having crown ether attached thereto, drying the polymer layer having crown ether attached thereto formed on the substrate to be semi-dried, and coating the semi-dried polymer layer with a solution including carbon nanotubes having guanidine groups dispersed therein.
    Type: Application
    Filed: July 6, 2007
    Publication date: August 14, 2008
    Inventor: Hai Sung Lee
  • Patent number: 7261924
    Abstract: Disclosed herein is a method of forming a guanidine group on carbon nanotubes to improve the dispersibility of carbon nanotubes, a method of attaching carbon nanotubes having guanidine groups to a substrate, and carbon nanotubes and a substrate manufactured by the above methods. The method of forming the guanidine group on the carbon nanotubes includes forming a carboxyl group on the carbon nanotubes, and forming the guanidine group on the carboxyl group of the carbon nanotubes. In addition, the method of attaching the carbon nanotubes having guanidine groups to the substrate includes coating a substrate with a polymer having crown ether attached thereto, drying the polymer layer having crown ether attached thereto formed on the substrate to be semi-dried, and coating the semi-dried polymer layer with a solution including carbon nanotubes having guanidine groups dispersed therein.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: August 28, 2007
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Hai Sung Lee
  • Publication number: 20070194691
    Abstract: In a light emitting diode package, a package substrate includes a mounting area, an electrode and a light emitting diode chip disposed on the mounting area. A phosphor film encapsulates the light emitting diode chip in an upward convex configuration. A resin encapsulant encapsulates the phosphor film in an upward convex configuration. The light emitting diode package prevents light loss which arises from increased light scattering due to dense phosphors, thereby achieving excellent light extraction efficiency. Also, a phosphor film is formed by dispensing, thereby leading to no breaking of an upper wire even in a face-up chip.
    Type: Application
    Filed: February 21, 2007
    Publication date: August 23, 2007
    Inventors: Ho Sung Choo, Youn Gon Park, Hai Sung Lee, Myung Whun Chang, Jong Myeon Lee
  • Publication number: 20070194341
    Abstract: A light emitting diode package. A package substrate has first and second electrode structures and a light emitting diode is mounted on the package substrate and electrically connected to the first and second electrode structures. A resin encapsulant is made of a transparent resin to seal the light emitting diode. A plurality of transparent spherical particles having a refractive index higher than the transparent resin are dispersed in the resin encapsulant.
    Type: Application
    Filed: February 22, 2007
    Publication date: August 23, 2007
    Inventors: Myung Whun Chang, Jong Myeon Lee, Ho Sung Choo, Young Gon Park, Hai Sung Lee
  • Publication number: 20070196939
    Abstract: A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.
    Type: Application
    Filed: February 22, 2007
    Publication date: August 23, 2007
    Inventors: Youn Gon Park, Jong Myeon Lee, Hai Sung Lee, Myung Whun Chang, Ho Sung Choo
  • Publication number: 20070148332
    Abstract: The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.
    Type: Application
    Filed: September 22, 2006
    Publication date: June 28, 2007
    Inventors: Hai Sung Lee, Jong Myeon Lee, Ho Sung Choo, Myung Whun Chang, Youn Gon Park