Abstract: Disclosed are a fully-automatic multi-station cutting machine and a method for cutting a material. The fully-automatic multi-station cutting machine includes a conveying assembly, a cutting assembly, transfer assemblies and a receiving assembly; the cutting assembly is located on one side of a length direction of the conveying assembly; the transfer assemblies and the receiving assembly are located on the other side of the length direction of the conveying assembly; and the transfer assemblies are capable of reciprocating in length and width directions of the conveying assembly. After being conveyed to a specified position by the conveying assembly, a material can be uniformly cut into a plurality of segments by the cutting assembly. After the cutting is ended, a head or tail material is taken out of the conveying assembly and is transferred to the receiving assembly by the transfer assemblies.

Abstract: A square bar grinding device includes a loading rack, a clamping device, a grinding device, and a grinding tool grinding device. The loading rack is provided with stations, the stations include a first station and a second station, the first station is used for placing a to-be-machined square bar, the grinding tool grinding device includes an oil stone assembly, the oil stone assembly is disposed at the second station, and the clamping device is used for clamping and transferring the to-be-machined square bar or the oil stone assembly in the stations of the loading rack to the grinding device. According to the square bar grinding device, a grinding tool grinding device is disposed at a loading rack, and can be clamped and transferred by a clamping device to be quickly moved to a grinding device for grinding of a grinding tool.

Abstract: Disclosed are an upper jacking structure, a half-slitting machine and a half-slitting method. The upper jacking structure includes a lower jacking block, a cutting assembly, a first linear reciprocating device, an upper jacking block and an auxiliary tensioner. The lower jacking block is located below the upper jacking block, a clamping space is formed between the lower jacking block and the upper jacking block, a cutting end of the cutting assembly moves in a vertical direction and a horizontal direction in and out of the clamping space, a movable end of the first linear reciprocating device moves in the vertical direction, and the upper jacking block is provided on the movable end of the first linear reciprocating device; the upper jacking block has a first jacking surface provided with a first jacking head and a second jacking head at either side of a center line of the first jacking surface.

Abstract: A grinding machine includes a conveying structure and a grinding structure, the conveying structure having first clamper sets for clamping a square rod. The grinding machine further includes a first top seat formed in at least one of the first clamper sets, and at least one second top seat formed in the grinding structure; the first top seat and the second top seat respectively abut against two opposite sides of the square rod; abutment surfaces of two first top seats are coplanar in a vertical plane, and are parallel to an abutment surface of the second top seat; a plane of the abutment surface of the first top seat is perpendicular to a plane of at least one abutment surface of the first clamper sets. The grinding machine according to the present disclosure may adjust the attitude of the square rod, thereby ensuring a stable grinding process.

Abstract: Disclosed are a lower jacking member, a wire withdrawal method based on the lower jacking member, and a squaring machine including the lower jacking member. The lower jacking member is used for axially fixing a bottom surface of an edge scrap formed by cutting a round rod, and a bottom outline of the edge scrap has a cutting edge. The lower jacking member includes at least two single components, and drive structures independently connected to the single components. A spacing between at least one of the single components and the cutting edge is different from a spacing between the rest of the single components and the cutting edge; and the drive structures are used for driving tops of the single components to abut against the bottom surface of the edge scrap.

Abstract: Provided is an airflow control method for an air flotation cyclone operation of a low-pressure heat treatment device, comprising: arranging a pressure sensor in a process chamber of the low-pressure heat treatment device, and controlling a pressure of process gas in the process chamber to be 1 to 20 Torrs; controlling a flow rate of cyclone gas delivered toward a bottom surface of a tray of the low-pressure heat treatment device to be 0.5 to 1.5 L/min by flow control, and controlling accuracy to be within ±0.2 L/min; and adjusting the flow rate of the cyclone gas so that the tray and a semiconductor workpiece placed on an upper surface of the tray rotate together.

Abstract: Provided is a gas distribution element and a heat treatment device containing the gas distribution element. The gas distribution element comprises at least two regions with different hole distribution densities. Specifically, the gas distribution element comprises a first region defined by a first distance radially extending outward from a geometric center, and a second region defined by a second distance radially extending from an outermost edge toward the geometric center; and the first region and the second region respectively have holes with different distribution densities.

Abstract: Provided is a low-pressure oxidation treatment method and device for a semiconductor workpiece. The low-pressure oxidation treatment method includes: pumping a reaction chamber such that the reaction chamber has a pressure lower than 760 Torr; introducing a process gas including hydrogen and oxygen to the reaction chamber; increasing a temperature within the reaction chamber to cause the process gas to generate oxygen radicals; and exposing the semiconductor workpiece to the oxygen radicals to form an oxide film on a surface of the semiconductor workpiece.

Abstract: Provided is a process platform, relating to the field of semiconductor technologies and specifically. The process platform includes a conveying bin, an accommodating bin, and reaction chambers. The conveying bin is internally provided with a first conveying part having grabbing mechanisms. The accommodating bin is communicated with the conveying bin and used for loading a wafer. The reaction chambers are each communicated with the conveying bin, at least one wafer carrying table is arranged in each reaction chamber, and liftable ejector pins are arranged on a top surface of the wafer carrying table.

Abstract: Provided is a reaction chamber and an oxidation device. The reaction chamber includes a chamber body and a flow guide tube. The chamber body is provided with a wafer stage inside, the wafer stage forms a reaction area for accommodating a wafer, a top surface of the reaction area is not lower than a top surface of the wafer, and a side wall of the chamber body is provided with an opening. The flow guide tube is arranged inside the chamber body, the flow guide tube comprises a tube body, a gas inlet of the tube body is communicated with the opening, and a gas outlet of the tube body extends toward the reaction area and is used to transport the plasma to the top surface of the reaction area.

Abstract: A hygienic assembly and a hygienic robot. The hygienic assembly includes a housing adapted to be connected to a reduction box of a joint of the robot, an opening, and a flange having a first end for connecting to an output member of the reduction box and a second end for connecting to an end effector. The assembly also includes a seal member which includes an outer ring fixed to an inner circumferential surface of the opening and a seal lip slidably contacting an outer circumferential surface of the flange.

Abstract: Disclosed are a support unit and a floor plate. The support unit includes a first plate and a second plate which are spaced apart from each other, one end of the first plate is provided with a plurality of first ring walls at intervals, one end of second plate facing the first plate is provided with a plurality of second ring walls at intervals, the plurality of second ring walls are arranged corresponding to the plurality of first ring walls, each of the second ring walls is sleeved outside and matched with a respective one of the first ring walls to form a support structure that supports the first plate and the second plate.

Abstract: Disclosed are a support unit and a floor plate. The support unit includes a first plate and a second plate which are spaced apart from each other, one end of the first plate is provided with a plurality of first ring walls at intervals, one end of second plate facing the first plate is provided with a plurality of second ring walls at intervals, the plurality of second ring walls are arranged corresponding to the plurality of first ring walls, each of the second ring walls is sleeved outside and matched with a respective one of the first ring walls to form a support structure that supports the first plate and the second plate.

Abstract: A compound with anti-drug resistant bacteria activity having the following formula (I): is disclosed. R1 and R2 are each independently H, alkyl, or phenyl, or R1 and R2 form —(CH2)3—, —(CH2)4—, or —(CH2)5—, and R3 is —COOCH2CH3, or CN. A method of preparing the compound of formula (I) is also disclosed.

Abstract: Disclosed is a floor decker, which includes: a first metal plate, a plurality of first protrusions are formed on the first metal plate by stamping; and a second metal plate disposed below the first metal plate, a lower end surface of each of the plurality of first protrusions is attached to an upper end surface of the second metal plate, and the first metal plate is fixedly connected to an edge of the second metal plate, and a plurality of supporting legs are provided at a lower end of the second metal plate.

Abstract: A compound having the formula (I): is disclosed. A method of preparing the compound of formula (I) is also disclosed.

Abstract: Embodiments of the present disclosure provide a volume adjusting method, system, apparatus and computer storage medium. In one aspect, in the embodiments of the present disclosure, the audio signal in the environment where the terminal lies is acquired, and then the volume of the information output by the terminal is adjusted according to the attributes of the audio signal. Hence, technical solutions provided by embodiments of the present disclosure can automatically adjust the volume of the information output by the terminal, lower volume adjustment operation costs and improve the volume adjusting efficiency.

Abstract: Embodiments of the present disclosure provide a volume adjusting method, system, apparatus and computer storage medium. In one aspect, in the embodiments of the present disclosure, the audio signal in the environment where the terminal lies is acquired, and then the volume of the information output by the terminal is adjusted according to the attributes of the audio signal. Hence, technical solutions provided by embodiments of the present disclosure can automatically adjust the volume of the information output by the terminal, lower volume adjustment operation costs and improve the volume adjusting efficiency.