Abstract: A display panel includes a display module and a lens layer. The display module has a display region and includes a plurality of pixel units disposed in the display region and distributed in an array, each pixel unit is configured to emit light. The lens layer is disposed on a display side of the display module. Light emitted by the plurality pixel units passes through the lens layer to form a display image, and the display image includes a plurality of pixels distributed in an array. The number of pixel units included in a row of pixel units in a first direction is less than the number of pixels included in a row of pixels in the first direction. A first pixel distance is smaller than a first pixel unit distance.

Abstract: A display panel includes a plurality of sub-panels tiled in sequence along a first direction. The sub-panels have a first edge and a second edge in the first direction. The sub-panels include a column of first pixels closest to the first edge, a column of second pixels closest to the second edge, and a plurality of columns of third pixels between the column of first pixels and the column of second pixels. A sum of a distance between effective display bodies in the first pixels and the first edge and a distance between effective display bodies in the second pixels and the second edge is smaller than a spacing between effective display bodies in two adjacent columns of the third pixels.

Abstract: A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.

Abstract: The present disclosure provides a display panel and a display device. The display panel includes a substrate, a light-emitting layer located at a side of the substrate, and an encapsulation layer located at s side of the light-emitting layer facing away from the substrate; the light-emitting layer comprises a plurality of light-emitting elements, and the encapsulation layer comprises a cut-off filter film layer, wherein the plurality of the light-emitting elements generate emitted light of at least two colors; wherein, the cut-off filter film layer comprises a plurality of filter areas, and one filter area filters the emitted light of one color, so that a wavelength range of the emitted light transmitting through the filter area is narrower than that of emergent light.

Abstract: A wiring board includes a mother board and a daughter board that are stacked, a bonding layer disposed between the mother board and the daughter board, and at least one side wiring. The mother board includes a first substrate, and a first wiring layer disposed on the first substrate and including at least one first connection pad. The daughter board is disposed on a side of the first substrate away from the first wiring layer. The daughter board includes a second substrate, and a second wiring layer disposed on the second substrate and including at least one second connection pad. The at least one side wiring is connected, via a respective end thereof, to the at least one first connection pad in one-to-one correspondence, and the at least one side wiring is connected, via respective another end thereof, to the at least one second connection pad in one-to-one correspondence.

Abstract: An array substrate is provided. In the array substrate, an organic material layer includes a first planar portion, a bending portion and a second planar portion which are connected in sequence. The first planar portion and the second planar portion are disposed on both sides of a base substrate. A lead structure includes a first lead portion, a bent lead portion and a second lead portion which are connected in sequence, wherein the first lead portion is disposed outside the first plane portion, the bent lead portion is disposed outside the bending portion, and the second lead portion is disposed outside the second plane portion. An LED layer and a control circuit are respectively disposed on the both sides of the base substrates.

Abstract: A backlight module and a driving method therefor, and a display panel and a display apparatus. The backlight module includes: a backlight panel; and a backlight driving circuit, which is used for responding to a first timing signal, so as to output a first brightness signal to drive the backlight panel to emit light, and is used for responding to a second timing signal to output a second brightness signal to drive the backlight panel to emit light. For a frame picture of a first sequence frame, a first brightness signal is output to drive a backlight panel to emit light, and for a frame picture of a second sequence frame, a second brightness signal is output to drive the backlight panel to emit light.

Abstract: A display panel includes a substrate, first bonding electrodes, connecting leads, an electrode carrier plate and second bonding electrodes. The substrate includes a display surface, a non-display surface, and a selected side face. The display surface includes a first bonding area, and the non-display surface includes a second bonding area. The first bonding electrodes are arranged side by side at the intervals in the first bonding area. The connecting leads are arranged side by side at intervals, each connecting lead includes a first portion, a second portion and a third portion, and the first portion of each connecting lead is electrically connected to a first bonding electrode. The electrode carrier plate is arranged on the non-display surface and provided thereon with the second bonding electrodes arranged side by side at intervals, and each second bonding electrode is electrically connected to a third portion of a connecting lead.

Abstract: A driving substrate includes: a base substrate including first and second surfaces and side surfaces, at least one side surface being a selected side surface; a flexible film including a first region located on the first surface, a second region located on the second surface, and a bending region located between the first and second regions, the bending region including a first corner region, a second corner region and a side region; and a wiring layer, an electrode layer and a connection lead layer disposed in sequence on a side of the flexible film away from the base substrate. The wiring layer is located in the first region, the second region and the side region. The electrode layer includes first, second, third, and fourth electrodes. Each third electrode is electrically connected to a fourth electrode through the wiring layer. The connection lead layer includes first and second connection leads.

Abstract: A display substrate includes a base, a plurality of light-emitting devices disposed on a side of the base, and a light adjustment layer. The plurality of light-emitting devices are spaced apart from each other. At least part of the light adjustment layer is located in gaps among the plurality of light-emitting devices, so that side walls of at least one of the plurality of light-emitting devices are surrounded by the light adjustment layer. A material of the light adjustment layer includes a light-absorbing material. The light adjustment layer is configured to absorb light incident on the light adjustment layer.

Abstract: A display panel includes a first substrate, first electrodes, connection leads, a connection layer, a second substrate, and second electrodes disposed on a side of the second substrate away from the first substrate. The first substrate includes a first surface and a second surface that are opposite to each other and side surfaces connecting the first and second surfaces. At least one side surface is a selected side surface. The second substrate is disposed on the second surface. The connection layer bonds the first substrate and the second substrate. An orthographic projection of the connection layer on the second surface is located within an orthographic projection of the second substrate on the second surface. The connection leads extend from the first surface to the second surface through the selected side surface. Two ends of a connection lead are connected to a first electrode and a second electrode, respectively.

Abstract: This invention introduces a pneumatic chip transfer mechanism for laser ungluing needles in the semiconductor optoelectronic field. It comprises upper and lower platform mobile systems, and a central transfer platform system equipped with a transfer slide, vertical power module, needle clamping bracket, and a laser-assisted needle assembly. This assembly includes a laser section with a window, a pneumatic section with an inlet hole, and a micro-hole needle aimed at the blue film assembly on the lower platform. A camera assembly, laser bracket, and laser generator are also integral parts. The mechanism employs a laser generator to modify blue film material properties, creating a bubble that facilitates chip detachment onto a target substrate. This design ensures efficient, flexible Mini/Micro LED chip transfers, revolutionizing chip detachment methods with its innovative approach to leveraging laser and pneumatic technologies for optimal performance.

Abstract: A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.

Abstract: A display substrate includes a base substrate, a plurality of light-emitting units, a protecting layer and a connecting line. The base substrate is a transparent substrate, and the plurality of light-emitting units, the protecting layer and the connecting line are laminated in sequence along a direction distal from the base substrate. A via is arranged in the protecting layer, one end of the connecting line is connected to the plurality of light-emitting units through the via, and the other end of the connecting line is configured to connect to a driving circuit of a display apparatus.

Abstract: A display substrate includes a base, a plurality of light-emitting devices disposed on a side of the base, and a light adjustment layer. The plurality of light-emitting devices are spaced apart from each other. At least part of the light adjustment layer is located in gaps among the plurality of light-emitting devices, so that side walls of at least one of the plurality of light-emitting devices are surrounded by the light adjustment layer. A material of the light adjustment layer includes a light-absorbing material. The light adjustment layer is configured to absorb light incident on the light adjustment layer.

Abstract: A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The connection line includes a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion includes a plurality of connection sub-portions, each of the connection sub-portions includes at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair.

Abstract: A display panel includes: a backplane, light-emitting devices, first electrodes, and connection traces. The backplane includes a first surface, a second surface opposite thereto, and side surfaces connecting the two surfaces. At least one of the side surfaces is a selected side surface. The light-emitting devices are disposed on the first surface. The first electrodes are disposed on the first surface and are proximate to the selected side surface. Each connection trace includes a first trace segment, a second trace segment, and a third trace segment that are connected in sequence. The first trace segment is disposed on the first surface, and the first trace segment is electrically connected to a first electrode. The second trace segment is disposed on the selected side surface. The third trace segment is disposed on the second surface, and is configured to be electrically connected to a flexible printed circuit.

Abstract: A display panel and a display apparatus are provided. The display panel includes: a base substrate having a first face, a second face, and a side face, the first face including a display region and a peripheral region; multiple first bonding electrodes in the peripheral region each being electrically connected to a display signal line on the first face and extending from the display region to the peripheral region; multiple driving signal lines on the second face of the base substrate, wherein at least one driving signal line is a ground line; multiple side wires each electrically connecting one driving signal line to one first bonding electrode via the side face; and an electrostatic protection layer electrically connected to the ground line and having an orthographic projection on the side face that is at least partially overlapped with orthographic projections of the side wires on the side face.

Abstract: A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.

Abstract: A backplane includes: a substrate including a circuit structure layer and a second reflective layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in a through hole. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.