Abstract: The present disclosure provides a display substrate, a spliced display module and a display apparatus. The display substrate includes a substrate, a light-emitting unit group on the substrate, the first light adjustment layer on the substrate, and the second light adjustment layer located on the first light adjustment layer and away from the substrate. The light-emitting unit group includes a plurality of light-emitting units, the distance from the surface of the first light adjustment layer away from the substrate to the substrate is greater than the distance from the surface of the light-emitting unit away from the substrate to the substrate. The orthographic projection of the second light adjustment layer on the substrate covers the substrate; and the transmittance of the first light adjustment layer is greater than the transmittance of the second light adjustment layer.

Abstract: A display panel includes: a backplane, light-emitting devices, first electrodes, and connection traces. The backplane includes a first surface, a second surface opposite thereto, and side surfaces connecting the two surfaces. At least one of the side surfaces is a selected side surface. The light-emitting devices are disposed on the first surface. The first electrodes are disposed on the first surface and are proximate to the selected side surface. Each connection trace includes a first trace segment, a second trace segment, and a third trace segment that are connected in sequence. The first trace segment is disposed on the first surface, and the first trace segment is electrically connected to a first electrode. The second trace segment is disposed on the selected side surface. The third trace segment is disposed on the second surface, and is configured to be electrically connected to a flexible printed circuit.

Abstract: A splicing display unit, a splicing display device and a manufacturing method thereof are disclosed. The splicing display unit includes a display module and a signal source module. The signal source module includes a first circuit board having a power structure, a first driving structure, a first connector, at least one first wireless signal transmitter. The display module includes a second circuit board, at least one display panel, a second driving structure connected to each display panel. The second circuit board has a second connector, and at least one first wireless signal receiver corresponding to the display panel respectively. The first wireless signal receiver and the second connector are electrically connected to the second driving structure. The first wireless signal receiver is opposite to the first wireless signal transmitter; the first connector and the second connector are arranged in a one-to-one correspondence way and are detachably connected.

Abstract: A display panel includes a backplane, a plurality of light-emitting devices, a plurality of first electrodes, and a plurality of connection leads. The backplane includes a first main surface, a second main surface and a plurality of side surfaces, and at least one side surface is a selected side surface. The plurality of light-emitting devices and the plurality of first electrodes are disposed on the second main surface. The plurality of connection leads are disposed at least on the first main surface and the selected side surface. Each connection lead includes a first portion on the first main surface and a second portion on the selected side surface, and a ratio of a thickness of the first portion to a thickness of the second portion is in a range of 0.6 and 1.6. Each connection lead is electrically connected to a first electrode.

Abstract: A display panel includes: a backplane, light-emitting devices, first electrodes, and connection traces. The backplane includes a first surface, a second surface opposite thereto, and side surfaces connecting the two surfaces. At least one of the side surfaces is a selected side surface. The light-emitting devices are disposed on the first surface. The first electrodes are disposed on the first surface and are proximate to the selected side surface. Each connection trace includes a first trace segment, a second trace segment, and a third trace segment that are connected in sequence. The first trace segment is disposed on the first surface, and the first trace segment is electrically connected to a first electrode. The second trace segment is disposed on the selected side surface. The third trace segment is disposed on the second surface, and is configured to be electrically connected to a flexible printed circuit.

Abstract: A display panel includes a backplane, a plurality of light-emitting devices, a plurality of first electrodes, and a plurality of connection leads. The backplane includes a first main surface, a second main surface and a plurality of side surfaces, and at least one side surface is a selected side surface. The plurality of light-emitting devices and the plurality of first electrodes are disposed on the second main surface. The plurality of connection leads are disposed at least on the first main surface and the selected side surface. Each connection lead includes a first portion on the first main surface and a second portion on the selected side surface, and a ratio of a thickness of the first portion to a thickness of the second portion is in a range of 0.6 and 1.6. Each connection lead is electrically connected to a first electrode.

Abstract: A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The connection line includes a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion includes a plurality of connection sub-portions, each of the connection sub-portions includes at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair.

Abstract: A display substrate, which includes a plurality of first light-emitting diode chips, each first light-emitting diode chip includes a plurality of light-emitting structures, the first substrate comprises a first pixel and a second pixel, the first pixel comprises a light-emitting structure of one first type light-emitting diode chip and a light-emitting structure of one second type light-emitting diode chip, the second pixel comprises a light-emitting structure of one first type light-emitting diode chip and a light-emitting structure of one second type light-emitting diode chip, the first type light-emitting diode chip included in the first pixel and the first type light-emitting diode chip included in the second pixel are the same first type light-emitting diode chip, the second type light-emitting diode chip included in the first pixel and the second type light-emitting diode chip included in the second pixel are different second type light-emitting diode chips.

Abstract: A display module includes a display panel with a plurality of bonding electrodes arranged at intervals along a selected side edge of a non-display surface and divided into two bonding electrode groups, a first flexible circuit board and a second flexible circuit board. For the first flexible circuit board, each first conductive contact piece in a first wiring region is connected to a bonding electrode in a first bonding electrode group. For the second flexible circuit board, each second conductive contact piece in a second wiring region is connected to a bonding electrode in a second bonding electrode group. The first wiring region is closer to the selected side edge than the second wiring region in a first direction. The first fan-out region is spaced apart from the second wiring region in a second direction perpendicular to the first direction.

Abstract: A backplane includes: a substrate including a circuit structure layer and a second reflective layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in a through hole. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.

Abstract: A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.

Abstract: A display panel includes a plurality of sub-panels tiled in sequence along a first direction. The sub-panels have a first edge and a second edge in the first direction. The sub-panels include a column of first pixels closest to the first edge, a column of second pixels closest to the second edge, and a plurality of columns of third pixels between the column of first pixels and the column of second pixels. A sum of a distance between effective display bodies in the first pixels and the first edge and a distance between effective display bodies in the second pixels and the second edge is smaller than a spacing between effective display bodies in two adjacent columns of the third pixels.

Abstract: A backplane includes: a substrate including a circuit structure layer and a second reflective layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in a through hole. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.

Abstract: A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.

Abstract: A display substrate includes a substrate, light-emitting devices disposed on a side of the substrate, a first light dimming layer disposed on the side of the substrate, and a first fixing layer disposed on a side of the light-emitting devices and the first light dimming layer away from the substrate. The light-emitting devices are arranged at intervals from each other and divided into a plurality of groups of light-emitting devices, and each group of light-emitting devices includes at least one light-emitting device. The first light dimming layer includes portions each located between two adjacent groups of light-emitting devices, and a gap exists between a portion of the first light dimming layer and at least one side face of at least one light-emitting device adjacent thereto. A portion of the first fixing layer is located in the gap. The first fixing layer is a light-transmitting film.

Abstract: A display panel includes a display module and a lens layer. The display module has a display region and includes a plurality of pixel units disposed in the display region and distributed in an array, each pixel unit is configured to emit light. The lens layer is disposed on a display side of the display module. Light emitted by the plurality pixel units passes through the lens layer to form a display image, and the display image includes a plurality of pixels distributed in an array. The number of pixel units included in a row of pixel units in a first direction is less than the number of pixels included in a row of pixels in the first direction. A first pixel distance is smaller than a first pixel unit distance.

Abstract: A display panel includes a plurality of sub-panels tiled in sequence along a first direction. The sub-panels have a first edge and a second edge in the first direction. The sub-panels include a column of first pixels closest to the first edge, a column of second pixels closest to the second edge, and a plurality of columns of third pixels between the column of first pixels and the column of second pixels. A sum of a distance between effective display bodies in the first pixels and the first edge and a distance between effective display bodies in the second pixels and the second edge is smaller than a spacing between effective display bodies in two adjacent columns of the third pixels.

Abstract: A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.

Abstract: The present disclosure provides a display panel and a display device. The display panel includes a substrate, a light-emitting layer located at a side of the substrate, and an encapsulation layer located at s side of the light-emitting layer facing away from the substrate; the light-emitting layer comprises a plurality of light-emitting elements, and the encapsulation layer comprises a cut-off filter film layer, wherein the plurality of the light-emitting elements generate emitted light of at least two colors; wherein, the cut-off filter film layer comprises a plurality of filter areas, and one filter area filters the emitted light of one color, so that a wavelength range of the emitted light transmitting through the filter area is narrower than that of emergent light.

Abstract: A wiring board includes a mother board and a daughter board that are stacked, a bonding layer disposed between the mother board and the daughter board, and at least one side wiring. The mother board includes a first substrate, and a first wiring layer disposed on the first substrate and including at least one first connection pad. The daughter board is disposed on a side of the first substrate away from the first wiring layer. The daughter board includes a second substrate, and a second wiring layer disposed on the second substrate and including at least one second connection pad. The at least one side wiring is connected, via a respective end thereof, to the at least one first connection pad in one-to-one correspondence, and the at least one side wiring is connected, via respective another end thereof, to the at least one second connection pad in one-to-one correspondence.