Patents by Inventor Haixia WEI

Haixia WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12136399
    Abstract: A control method includes detecting a first object within a first range corresponding to an output device, obtaining a first relative position relationship between the first object and the output device, and adjusting an output parameter of output light of the output device based on the first relative position relationship, to cause the output device to be in a first output state relative to the first object.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: November 5, 2024
    Assignee: LENOVO (BEIJING) LIMITED
    Inventors: Haixia Wei, Xiangzi Kong, Shuzi Tian
  • Publication number: 20230215394
    Abstract: A control method includes detecting a first object within a first range corresponding to an output device, obtaining a first relative position relationship between the first object and the output device, and adjusting an output parameter of output light of the output device based on the first relative position relationship, to cause the output device to be in a first output state relative to the first object.
    Type: Application
    Filed: December 15, 2022
    Publication date: July 6, 2023
    Inventors: Haixia WEI, Xiangzi KONG, Shuzi TIAN
  • Publication number: 20130235529
    Abstract: A heat conducting device, comprising a first heat conducting board and a heat conducting structure, the first heat conducting board comprising an upper heat conducting arm provided on one surface of the first heat conducting board, the heat conducting structure slidably abutting against the upper heat conducting arm of the first heat conducting board to form a contact surface through which heat transfer is realized, the heat conducting structure comprising a heat conducting surface, wherein the heat conducting structure is used to keep the relative position between the first heat conducting board and the heat conducting surface, allow the varying of the distance between the first heat conducting board and the heat conducting surface of the heat conducting structure through relative sliding between the upper heat conducting arm and the heat conducting structure.
    Type: Application
    Filed: April 26, 2013
    Publication date: September 12, 2013
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Youquan YANG, Shuzhong LIU, Haixia WEI, Bo YANG
  • Patent number: D1066903
    Type: Grant
    Filed: August 26, 2024
    Date of Patent: March 18, 2025
    Inventor: Haixia Wei