Abstract: The present disclosure relates to a control method of a virtual object, a control apparatus, a device and a medium. The method displays a target virtual scene in a target interactive interface, under the condition that there is a target virtual object in the plurality of virtual objects, displays a target control, the target virtual object being a virtual object controllable by the virtual subject in a non-contact manner; in response to receiving a trigger operation on the target control, causes the virtual subject to perform non-contact control on the target virtual object according to a control mode corresponding to the target control, wherein the target virtual scene includes a plurality of virtual objects and a virtual subject controlled by a user.

Abstract: The mainboard includes at least two layers of PCBs and electronic components disposed on each layer of PCB of the at least two layers of PCBs, where each layer of PCB constitutes a unit module. The at least two layers of PCBs are stacked, and the at least two layers of PCBs are electrically connected. Any two adjacent unit modules are connected by using a frame board, and the frame board has a middle-hollow or partially hollow structure. The mainboard is designed into a multilayer composite stacked structure, to reduce an area occupied by the mainboard in horizontal directions and provide plane space for electronic parts such as a display module, a camera module, a speaker box component.

Abstract: An auxiliary adhesive dispensing apparatus is connected to a printed circuit board (PCB) through an opening on a side surface of a shielding cover above the PCB, and the auxiliary adhesive dispensing apparatus includes a flow guiding groove, an adhesive-injection opening connected to an end of the flow guiding groove, and a fixing part connecting the flow guiding groove and the PCB. The auxiliary adhesive dispensing apparatus is connected to a PCB through an opening on a side surface of a shielding cover above the PCB. By means of the auxiliary adhesive dispensing apparatus, an adhesive dispensing operation can still be performed after a shielding cover is mounted, so that the adhesive dispensing operation can be performed after second-reflow soldering processing.

Abstract: An auxiliary adhesive dispensing apparatus is connected to a printed circuit board (PCB) through an opening on a side surface of a shielding cover above the PCB, and the auxiliary adhesive dispensing apparatus includes a flow guiding groove, an adhesive-injection opening connected to an end of the flow guiding groove, and a fixing part connecting the flow guiding groove and the PCB. The auxiliary adhesive dispensing apparatus is connected to a PCB through an opening on a side surface of a shielding cover above the PCB. By means of the auxiliary adhesive dispensing apparatus, an adhesive dispensing operation can still be performed after a shielding cover is mounted, so that the adhesive dispensing operation can be performed after second-reflow soldering processing.