Patents by Inventor Haiyong NI

Haiyong NI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240279544
    Abstract: The present disclosure relates to the field of inorganic non-metallic optoelectronic functional materials, and discloses wet-resistant fluoride red phosphor and preparation and application thereof, and a white light LED device. The fluoride red phosphor is a core-shell structure: the core is Mn4+ doped fluoride red phosphor, and the chemical structural formula is A2B1-xF6:xMn4+, herein A is at least one of Li, Na, K, Rb, and Cs, B is at least one of Ti, Si, Ge, Zr, and Sn, and 0?x?0.4; and the shell is a cubic perovskite-type compound, and the chemical structural formula is CMgF3, herein C is at least one of Li, Na, K, Rb, and Cs. The present disclosure uses CMgF3 generated as a coating waterproof layer, to form the A2B1-xF6:xMn4+ core-shell structure of which the surface is coated by CMgF3, and a wet-resistant problem of the fluoride red phosphor is overcome.
    Type: Application
    Filed: February 21, 2024
    Publication date: August 22, 2024
    Inventors: Lei CHEN, Yanguang GUO, Shuanghong WEI, Qi LIU, Yabing WU, Ping CHEN, Guoqing TONG, Yang JIANG, Haiyong NI
  • Patent number: 11939503
    Abstract: Disclosed are a preparation method for manganese-doped red phosphor, a device and a backlight module including the product. The method includes: 1) mixing A2BF6 polycrystalline particles with mill balls; 2) mixing A2BF6 powder obtained after ball-milling with a hydrofluoric acid for secondary crystallization; 3) filtering out solid particles in A2BF6 and hydrofluoric acid solution after the secondary crystallization; 4) performing ion exchange between A2BF6 particles and A2BF6; and 5) filtering out solid particles to obtain a filter cake, and performing drying treatment to obtain manganese-doped red phosphor.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: March 26, 2024
    Assignees: Hefei University of Technology, Intelligent Manufacturing Institute of HFUT
    Inventors: Lei Chen, Peng Cheng, Jie Chen, Yunfei Tian, Jialong Wang, Liangrui He, Qiuhong Zhang, Haiyong Ni
  • Publication number: 20210324265
    Abstract: Disclosed are a preparation method for manganese-doped red phosphor, a device and a backlight module including the product. The method includes: 1) mixing A2BF6 polycrystalline particles with mill balls; 2) mixing A2BF6 powder obtained after ball-milling with a hydrofluoric acid for secondary crystallization; 3) filtering out solid particles in A2BF6 and hydrofluoric acid solution after the secondary crystallization; 4) performing ion exchange between A2BF6 particles and A2BF6; and 5) filtering out solid particles to obtain a filter cake, and performing drying treatment to obtain manganese-doped red phosphor.
    Type: Application
    Filed: October 26, 2018
    Publication date: October 21, 2021
    Inventors: Lei CHEN, Peng CHENG, Jie CHEN, Yunfei TIAN, Jialong WANG, Liangrui HE, Qiuhong ZHANG, Haiyong NI
  • Patent number: 9573805
    Abstract: A method of manufacturing a pressure sensor is provided. The method includes: providing a substrate, wherein a bottom electrode and a pressure sensing film are disposed on the substrate; forming an etch stop assembly on the pressure sensing film at a location corresponding to a pressure trench; forming a cover layer on the substrate covering the etch stop assembly and the pressure sensing film; forming a mask layer on the cover layer, wherein an opening of the mask layer is formed above the etch stop assembly and exposes a portion of the cover layer at the location corresponding to the pressure trench; etching the cover layer using the mask layer so as to form the pressure trench in the cover layer; removing the etch stop assembly at a bottom of the pressure trench; and removing the mask layer.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: February 21, 2017
    Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Guangcai Fu, Haiyong Ni
  • Publication number: 20150368096
    Abstract: A method of manufacturing a pressure sensor is provided. The method includes: providing a substrate, wherein a bottom electrode and a pressure sensing film are disposed on the substrate; forming an etch stop assembly on the pressure sensing film at a location corresponding to a pressure trench; forming a cover layer on the substrate covering the etch stop assembly and the pressure sensing film; forming a mask layer on the cover layer, wherein an opening of the mask layer is formed above the etch stop assembly and exposes a portion of the cover layer at the location corresponding to the pressure trench; etching the cover layer using the mask layer so as to form the pressure trench in the cover layer; removing the etch stop assembly at a bottom of the pressure trench; and removing the mask layer.
    Type: Application
    Filed: May 15, 2015
    Publication date: December 24, 2015
    Inventors: Guangcai FU, Haiyong NI