Patents by Inventor Haizhong SHI

Haizhong SHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure and method of reinforcing a conductor soldering point of semiconductor device
    Patent number: 9837371
    Abstract: The present invention provides a structure and a method of reinforcing a conductor soldering point of a semiconductor device. The structure includes an inner frame lead, a soldering area arranged on the surface of the inner frame lead, a conductor soldered in the soldering area, and a locking card including a pressing part, a locking part overhangs outwards from the pressing part pressed on the conductor. The locking part penetrates through the inner frame lead and is clamped on the side of the inner frame lead deviating from the conductor. According to the present invention, the conductor soldered on the inner frame lead is firmly clamped on the inner frame lead through the locking card to effectively avoid the stripping condition of the conductor and the inner frame lead, reinforce the electrical connection of the conductor and the inner frame lead, and improve the reliability of the semiconductor device.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: December 5, 2017
    Assignee: TONGFU MICROELECTRONICS CO., L,TD.
    Inventors: Haizhong Shi, Honghui Wang, Jing Wu
  • STRUCTURE AND METHOD OF REINFORCING A CONDUCTOR SOLDERING POINT OF SEMICONDUCTOR DEVICE
    Publication number: 20170207189
    Abstract: The present invention provides a structure and a method of reinforcing a conductor soldering point of a semiconductor device. The structure includes an inner frame lead, a soldering area arranged on the surface of the inner frame lead, a conductor soldered in the soldering area, and a locking card including a pressing part, a locking part overhangs outwards from the pressing part pressed on the conductor. The locking part penetrates through the inner frame lead and is clamped on the side of the inner frame lead deviating from the conductor. According to the present invention, the conductor soldered on the inner frame lead is firmly clamped on the inner frame lead through the locking card to effectively avoid the stripping condition of the conductor and the inner frame lead, reinforce the electrical connection of the conductor and the inner frame lead, and improve the reliability of the semiconductor device.
    Type: Application
    Filed: November 7, 2014
    Publication date: July 20, 2017
    Inventors: Haizhong SHI, Honghui WANG, Jing WU