Abstract: A wafer processing method for processing a wafer (20) having bumps (B) formed on a front surface (21) comprises the steps of: holding on a table (51), a bump region-conforming member (40) that has an outer shape conforming only to a bump region (25) where said bumps are formed in the wafer; forming a resin layer (29) by applying resin around the bump region-conforming member up to a thickness equal to or greater than that of the bump region-conforming member; grinding the bump region-conforming member along with the resin layer to a predetermined thickness; removing the bump region-conforming member from the table to form a concave part (45) in the resin layer; applying a film (11) on the front surface of the wafer; and disposing the wafer in the concave part of the resin layer and holding the wafer on the table so that a back surface (22) of said wafer faces upward. After that, the back surface of the wafer can also be ground.

Abstract: A wafer processing method for processing a wafer (20) having bumps (B) formed on a front surface (21) comprises the steps of: holding on a table (51), a bump region-conforming member (40) that has an outer shape conforming only to a bump region (25) where said bumps are formed in the wafer; forming a resin layer (29) by applying resin around the bump region-conforming member up to a thickness equal to or greater than that of the bump region-conforming member; grinding the bump region-conforming member along with the resin layer to a predetermined thickness; removing the bump region-conforming member from the table to form a concave part (45) in the resin layer; applying a film (11) on the front surface of the wafer; and disposing the wafer in the concave part of the resin layer and holding the wafer on the table so that a back surface (22) of said wafer faces upward. After that, the back surface of the wafer can also be ground.

Abstract: A tape holding device for holding, on a wall, a roll of tape having a cylindrical inner surface, including: a base rod member capable of being supported on the wall in a cantilever state, the base rod member having a first mount end capable of being rotatably mounted to the wall, a second free end opposite to the first end, and an outer surface between the first end and the second end; and a clamping rod member connected coaxially to the second end of the base rod member; the clamping rod member including: a clamp element provided movably in a radial direction of the base rod member between an initial position where the clamp element does not project from the outer surface of the base rod member and a clamp position where the clamp element projects from the outer surface, the clamp element being capable of abutting the inner surface of the roll of tape at the clamp position to apply a pressure to the inner surface; and a pressing unit provided movably in an axial direction of the base rod member between a non