Abstract: An image display device manufacturing method according to an embodiment includes preparing a semiconductor layer, bonding the semiconductor layer to a first surface of a light-transmitting substrate, etching the semiconductor layer to form, on the first surface, a light-emitting element including a light-emitting surface and an upper surface provided on a side opposite to the light-emitting surface, forming a first insulating film covering the first surface and the light-emitting element, forming a circuit element on the first insulating film, forming a second insulating film covering the first insulating film and the circuit element, forming a first via passing through the first insulating film and the second insulating film, and forming a first wiring layer on the second insulating film. The first via is located between and electrically connects the first wiring layer and the upper surface.

Abstract: An image display device according to an embodiment includes a substrate, a first wiring line formed on the substrate along a first direction, a first light-emitting element located on the first wiring line and including a first light-emitting surface, a light-transmitting electrode formed along a second direction intersecting the first direction and located on the first light-emitting surface, a first anisotropic conductive member located on the first wiring line, a first terminal electrically connected to the first wiring line via the first anisotropic conductive member, a second anisotropic conductive member located on the light-transmitting electrode, and a second terminal electrically connected to the light-transmitting electrode via the second anisotropic conductive member.

Abstract: An image display device manufacturing method according to an embodiment includes preparing a semiconductor layer, joining the semiconductor layer to a first substrate with a first metal layer interposed therebetween, bonding the semiconductor layer to a light-transmitting substrate, removing the first substrate, etching the semiconductor layer to form a light-emitting element including a light-emitting surface and an upper surface, etching the first metal layer to form a light-blocking electrode covering the upper surface, forming a first insulating film covering the light-emitting element and the light-blocking electrode, forming a circuit element on the first insulating film, forming a second insulating film covering the first insulating film and the circuit element, forming a first via passing through the first insulating film and the second insulating film, and forming a first wiring layer on the second insulating film.

Abstract: A production method for an image display device, the method including: preparing at least one structure including a semiconductor layer formed on a first substrate; forming a first metal layer on a second substrate; bonding the semiconductor layer to the first metal layer; removing the first substrate; forming a light-emitting element by etching the semiconductor layer, the light-emitting element including a bottom surface on the first metal layer, and a light-emitting surface located opposite to the bottom surface; forming a first insulating film that covers the second substrate and the light-emitting element; forming a circuit element on the first insulating film; forming a second insulating film that covers the circuit element and the first insulating film; exposing a surface that includes the light-emitting surface by removing portions of the first insulating film and the second insulating film; and forming a wiring layer on the second insulating film.

Abstract: A method for manufacturing an image display device according to an embodiment includes preparing a structure including a semiconductor layer formed on a first substrate, bonding the semiconductor layer to a first surface of a second substrate, removing the first substrate, forming a light-emitting element including a light-emitting surface opposite to a bottom surface on the first surface by etching the semiconductor layer, forming a first insulating film that covers the first surface and the light-emitting element, forming a circuit element on the first insulating film, forming a second insulating film that covers the circuit element and the first insulating film, exposing a surface including the light-emitting surface by removing a portion of the first and second insulating films, forming a via extending through the first and second insulating films, and forming a wiring layer on the second insulating film.

Abstract: A display device has a first electrode provided corresponding to each of a plurality of pixels in a region in which the plurality of pixels is provided, a second electrode provided over the plurality of pixels and extending to a contact region provided outside the pixel region, a light emitting layer provided between the first electrode and the second electrode, a third electrode provided in the contact region, an organic insulating layer covering the third electrode and provided with a contact hole exposing the third electrode, and a connection portion between the second electrode and the third electrode in the contact hole, wherein the maximum distance between any two points on the outer periphery of the connection portion is 1 ?m or more and 100 ?m or less.

Abstract: A display device includes: a substrate configured to contain an organic material; a first underlying film provided above the substrate; a thin film transistor provided above the first underlying film; a semiconductor film included in the thin film transistor and configured to have a channel region; and an electric field inhibition film provided between the first underlying film and the semiconductor film and configured to overlap the channel region in a plan view. The electric field inhibition film has a higher permittivity than the first underlying film.

Abstract: The method for manufacturing a display device includes forming a light emitting element and a terminal on a substrate, forming a sealing film including a first inorganic insulating film and a second inorganic insulating film to cover the light emitting element and the terminal, forming a resist having a taper shape in which a thickness of an end portion on the sealing film becomes thinner as it goes to the terminal side by using a gray-tone mask, forming a taper shape in which thicknesses in end portions of the first inorganic insulating film and the second inorganic insulating film becomes thinner as it goes to the terminal side by etching, forming a touch electrode above the sealing film and forming wiring connected to the terminal via the end portions together with connecting to the touch electrode for detecting a touched position.

Abstract: A display device includes a flexible substrate including a first surface and a second surface facing the first surface; a TFT array layer provided on the first surface; a display element layer provided on the TFT array layer; a first heat releasing layer provided on the second surface; a first protective layer provided on the same side as the second surface; a second heat releasing layer provided on the display element layer; and a second protective layer provided on the display element layer. The second heat releasing layer has a light transmittance of 90% or higher.

Abstract: The method for manufacturing a display device includes forming a light emitting element and a terminal on a substrate, forming a sealing film including a first inorganic insulating film and a second inorganic insulating film to cover the light emitting element and the terminal, forming a resist having a taper shape in which a thickness of an end portion on the sealing film becomes thinner as it goes to the terminal side by using a gray-tone mask, forming a taper shape in which thicknesses in end portions of the first inorganic insulating film and the second inorganic insulating film becomes thinner as it goes to the terminal side by etching, forming a touch electrode above the sealing film and forming wiring connected to the terminal via the end portions together with connecting to the touch electrode for detecting a touched position.

Abstract: An image display device includes: a circuit element; a first interconnect layer electrically connected to the circuit element; a first insulating film covering the circuit element and the first interconnect layer; a light emitting element disposed on the first insulating film; a second insulating film covering at least a part of the light emitting element; a second interconnect layer electrically connected to the light emitting element and disposed on the second insulating film; and a first via extending through the first insulating film and the second insulating film, and electrically connecting the first interconnect layer and the second interconnect layer.

Abstract: An image display device includes a glass, a plurality of driving circuits disposed on the glass, and a plurality of light emitting elements disposed on the driving circuits respectively. The plurality of light emitting elements corresponds to a plurality of pixels respectively. Each of the plurality of driving circuits is configured to provide a driving current to each of the plurality of light emitting elements and to control the driving current by a pulse amplitude modulation and a pulse width modulation.

Abstract: A sealing member containing conductive particles and disposed in a seal region is formed between a display panel and a touch panel. A laminated structure formed on the display panel includes a first detection lines. The first detection lines extend from the seal region to a connection region and are connected through the conductive particles to terminals of second detection lines formed on the touch panel. A peripheral edge of the organic barrier is located inward from the conductive particles of the sealing member. The above described structure can facilitate a work for connecting external lines such as FPC to the display panel and the touch panel. Further, the structure can secure stability of electrical connection between the external lines and the touch panel.

Abstract: A method for manufacturing an image display device includes: preparing a substrate, the substrate comprising a semiconductor layer, the semiconductor layer comprising a light emitting layer, the semiconductor layer being formed on a first substrate; bonding the semiconductor layer to a second substrate, the second substrate comprising a circuit that comprises a circuit element; forming a light emitting element by etching the semiconductor layer; forming an insulating film covering the light emitting element; forming a via reaching the circuit through the insulating film; and electrically connecting the light emitting element and the circuit element through the via, the via connecting the light emitting element and the circuit element provided in different layers.

Abstract: A sealing member containing conductive particles and disposed in a seal region is formed between a display panel and a touch panel. A laminated structure formed on the display panel includes a first detection lines. The first detection lines extend from the seal region to a connection region and are connected through the conductive particles to terminals of second detection lines formed on the touch panel. A peripheral edge of the organic barrier is located inward from the conductive particles of the sealing member. The above described structure can facilitate a work for connecting external lines such as FPC to the display panel and the touch panel. Further, the structure can secure stability of electrical connection between the external lines and the touch panel.

Abstract: An image display device includes pixels arranged in a matrix form on a grass. Each of the pixels includes: a drive circuit disposed on the grass and configured to receive a power supply control signal and an analog image signal; and an inorganic semiconductor light emitting element mounted on the drive circuit and electrically connected to the drive circuit. The inorganic semiconductor light emitting element is configured to emit a light based on a driving current provided from the drive circuit. The power supply control signal is applied at once to the pixels. The drive circuit is configured to control a grayscale of a light emitted by the inorganic semiconductor light emitting element by controlling a pulse width of a driving current having an amplitude corresponding to a voltage of the power supply control signal based on a voltage of the analog image signal.

Abstract: A method of manufacturing an image display device includes: providing a semiconductor growth substrate comprising a semiconductor layer; providing a circuit substrate comprising: a circuit element, a first wiring layer, and a first insulating film; forming a first metal layer that is located on the first insulating film and is electrically connected to the first wiring layer; bonding the semiconductor growth substrate to the circuit substrate and electrically connecting the first metal layer to the semiconductor layer; etching the semiconductor layer to form a light-emitting element; etching the first metal layer to form a plug electrically connected to the light-emitting element; forming a second insulating film covering the plug, the light-emitting element, and the first insulating film; removing a portion of the second insulating film to expose a light-emitting surface of the light-emitting element; and forming a second wiring layer electrically connected to the light-emitting surface.

Abstract: An image display device manufacturing method includes: providing a first substrate that includes: a circuit including a circuit element formed on a light-transmitting substrate, and a first insulating film covering the circuit; forming, on the first insulating film, a layer including graphene; forming, on the layer v graphene, a semiconductor layer including a light-emitting layer; etching the semiconductor layer to form a light-emitting element; forming a second insulating film covering the layer including graphene, the light-emitting element, and the first insulating film; forming a via passing through the first insulating film and the second insulating film; and electrically connecting the light-emitting element and the circuit element through the via at a light-emitting surface facing a surface of the light-emitting element on a first insulating film side.

Abstract: An image display device manufacturing method includes: providing a first substrate that includes: a circuit including a circuit element formed on a light-transmitting substrate, and a first insulating film covering the circuit; forming, on the first insulating film, a conductive layer including a portion made of a single crystal metal; forming, on the portion made of the single crystal metal, a semiconductor layer including a light-emitting layer; etching the semiconductor layer to form a light-emitting element; forming a second insulating film covering the conductive layer, the light-emitting element, and the first insulating film; forming a via passing through the first insulating film and the second insulating film; and electrically connecting the light-emitting element and the circuit element through the via at a light-emitting surface facing a surface of the light-emitting element on a first insulating film side.

Abstract: A method for manufacturing an image display device includes: providing a second substrate that includes a first substrate, and a semiconductor layer grown on the first substrate, the semiconductor layer including a light-emitting layer; providing a third substrate including: a circuit including a circuit element formed on a light-transmitting substrate, a first insulating film covering the circuit, and a conductive layer including a light-reflective part formed on the first insulating film; bonding the semiconductor layer to the third substrate; forming a light-emitting element from the semiconductor layer; forming a second insulating film covering the conductive layer, the light-emitting element, and the first insulating film; forming a via extending through the first and second insulating films; and electrically connecting the light-emitting element and the circuit element by the via.