Patents by Inventor Hajime Ban
Hajime Ban has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9394447Abstract: Provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed and further adding water thereto and a method for producing the same. Also, provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed, further adding a coupling agent having an alkoxide group and then adding water thereto and a method for producing the same. Further, provided is a high dielectric constant resin composite material obtained by blending the insulated ultrafine powder of the present invention with a resin in a volume ratio (insulated ultrafine powder/resin) falling in a range of 5/95 to 50/50.Type: GrantFiled: February 10, 2014Date of Patent: July 19, 2016Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Takahiro Matsumoto, Hirotaka Tsuruya, Hajime Ban, Reiki Akita
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Patent number: 9315673Abstract: Provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed and further adding water thereto and a method for producing the same. Also, provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed, further adding a coupling agent having an alkoxide group and then adding water thereto and a method for producing the same. Further, provided is a high dielectric constant resin composite material obtained by blending the insulated ultrafine powder of the present invention with a resin in a volume ratio (insulated ultrafine powder/resin) falling in a range of 5/95 to 50/50.Type: GrantFiled: July 9, 2010Date of Patent: April 19, 2016Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Takahiro Matsumoto, Hirotaka Tsuruya, Hajime Ban, Reiki Akita
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Publication number: 20140170305Abstract: Provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed and further adding water thereto and a method for producing the same. Also, provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed, further adding a coupling agent having an alkoxide group and then adding water thereto and a method for producing the same. Further, provided is a high dielectric constant resin composite material obtained by blending the insulated ultrafine powder of the present invention with a resin in a volume ratio (insulated ultrafine powder/resin) falling in a range of 5/95 to 50/50.Type: ApplicationFiled: February 10, 2014Publication date: June 19, 2014Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Takahiro MATSUMOTO, Hirotaka TSURUYA, Hajime BAN, Reiki AKITA
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Publication number: 20120142836Abstract: Provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed and further adding water thereto and a method for producing the same. Also, provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed, further adding a coupling agent having an alkoxide group and then adding water thereto and a method for producing the same. Further, provided is a high dielectric constant resin composite material obtained by blending the insulated ultrafine powder of the present invention with a resin in a volume ratio (insulated ultrafine powder/resin) falling in a range of 5/95 to 50/50.Type: ApplicationFiled: July 9, 2010Publication date: June 7, 2012Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Takahiro Matsumoto, Hirotaka Tsuruya, Hajime Ban, Reiki Akita
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Publication number: 20110144285Abstract: The present invention provides a resin composition with favorable melt fluidity, sliding characteristics, toughness, mechanical strength, etc. The present invention is directed to the resin composition containing an aromatic polyamide imide resin (A) that is obtained with the moisture content in the reaction system at 100 to 5000 ppm during the reaction to polymerize an aromatic tricarboxylate anhydride and a diisocyanate and for which the reduced viscosity in N,N-dimethyl acetamide at 30° C. is 0.15 to 0.40 dL/g, and a polyarylene sulfide resin (B).Type: ApplicationFiled: August 10, 2009Publication date: June 16, 2011Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INCInventors: Toshiaki Yamada, Hajime Ban, Kenichi Yanagisawa
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Patent number: 7098273Abstract: An object of the present invention is to improve the compatibility of the resin composition comprising the PAI resin and the PAS resin so as to provide a resin composition which is excellent in flowability when molten, strength, tenacity and heat resistance. A resin composition comprising: (1) 5 to 60 parts by weight of aromatic polyamide imide resin (A) having a weight average molecular weight (Mw) of 1,000 to 100,000 and having an amino group in an amount of 0.00002 to 0.002 mol/g in a molecule, (2) 95 to 40 parts by weight of polyarylene sulfide resin (B), and (3) 0.01 to 10 parts by weight of episulfide compound (C) based on 100 parts by weight of the total of (A) and (B).Type: GrantFiled: June 21, 2004Date of Patent: August 29, 2006Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Toshiaki Yamada, Hajime Ban, Hiroyuki Kudo
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Publication number: 20040266956Abstract: An object of the present invention is to improve the compatibility of the resin composition comprising the PAI resin and the PAS resin so as to provide a resin composition which is excellent in flowability when molten, strength, tenacity and heat resistance.Type: ApplicationFiled: June 21, 2004Publication date: December 30, 2004Inventors: Toshiaki Yamada, Hajime Ban, Hiroyuki Kudo
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Patent number: 5543474Abstract: There is provided a resin composition having well balanced moldability, heat resistance and mechanical strength, which comprises (A) all aromatic polyamideimide resin and (B) a Polyester resin, (C) a polyphenylene sulfide resin or (D) a resin capable of forming an anisotropic molten phase, said aromatic polyamideimide resin containing 5 to 95 mol % of a recurring unit of the formula (1) and 5 to 95 mol % of at least one of a recurring unit of the formula (2) and a recurring unit of the formula (3). Said aromatic polyamideimide resin is prepared by conducting a polymerization reaction of an aromatic tricarboxylic acid anhydride and at least any one of all aromatic dicarboxylic acid and an aliphatic dicarboxylic acid with a diisocyanate compound in plural steps in which in the first step the polymerization reaction is conducted in a temperature range of 50.degree. to 110.degree. C. and in the second and subsequent steps the polymerization reaction is conducted in a temperature range of higher than 110.degree.Type: GrantFiled: October 17, 1994Date of Patent: August 6, 1996Assignee: Mitsubishi Gas Company, Inc.Inventors: Takao Kawaki, Akikazu Amagai, Toshiaki Yamada, Hidefumi Harada, Hajime Ban, Yuji Takeda, Koji Yamamoto
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Patent number: 5387652Abstract: A resin composition comprising a melt-kneaded product of (A) an aromatic polyamideimide resin (Component A) which is obtained by polymerizing an aromatic tricarboxylic acid anhydride and a diisocyanate in a solvent under conditions where an amide group is substantially formed first and then an imide group is formed, and which has at least one recurring unit of the formula (1), ##STR1## wherein Ar is a trivalent aromatic hydrocarbon group having at least one 6-membered carbon ring, and R is a divalent aromatic hydrocarbon group or an aliphatic hydrocarbon group, and (B) a polyphenylene sulfide resin (Component B); and the molded article obtained by molding said resin composition.Type: GrantFiled: September 22, 1993Date of Patent: February 7, 1995Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Takao Kawaki, Akikazu Amagai, Toshiaki Yamada, Hidefumi Harada, Hajime Ban
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Patent number: 5321097Abstract: A heat-resistant resin composition comprising a melt-kneaded product of:(A) at least one member selected from the group consisting of a polyamideimide resin precursor composed mainly of a recurring unit of the formula (1)-a, ##STR1## wherein R is a divalent aromatic group or aliphatic group, R.sup.1 is a hydrogen atom, an alkyl group or a phenyl group, and Ar is a trivalent aromatic group composed of at least one six-membered ring, and a polyamideimide resin composed mainly of a recurring unit of the formula (1)-b, ##STR2## wherein R, R.sup.1 and Ar are as defined in the above formula (1)-a, (B) a polyphenylene sulfide resin, and(C) an organic isocyanate compound having at least two isocyanate groups in the molecule, the amount of said organic isocyanate compound being 0.5 to 5 parts by weight based on 100 parts by weight of the total amount of the compounds (A) and (B).Type: GrantFiled: April 30, 1993Date of Patent: June 14, 1994Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Takao Kawaki, Akikazu Amagai, Masahiko Ishikawa, Toshiaki Yamada, Yasuhiro Hirai, Hajime Ban