Patents by Inventor Hajime Fukazawa

Hajime Fukazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6858274
    Abstract: Ground joint surfaces of two synthetic corundum pieces 4, 5 are superposed on each other, and ends thereof are held in intimate contact with each other. The synthetic corundum pieces are then heated at a temperature equal to or lower than the melting point of synthetic corundum to joint the synthetic corundum pieces 4, 5.
    Type: Grant
    Filed: July 19, 2002
    Date of Patent: February 22, 2005
    Assignee: Rion Co., Ltd.
    Inventor: Hajime Fukazawa
  • Publication number: 20020176075
    Abstract: Ground joint surfaces of two synthetic corundum pieces 4, 5 are superposed on each other, and ends thereof are held in intimate contact with each other. The synthetic corundum pieces are then heated at a temperature equal to or lower than the melting point of synthetic corundum to joint the synthetic corundum pieces 4, 5.
    Type: Application
    Filed: July 19, 2002
    Publication date: November 28, 2002
    Applicant: Rion Co. Ltd.
    Inventor: Hajime Fukazawa
  • Patent number: 6440242
    Abstract: Ground joint surfaces of two synthetic corundum pieces 4, 5 are supeposed on each other, and ends thereof are held in intimate contact with each other. The synthetic corundum pieces are then heated at a temperature equal to or lower than the melting point of synthetic corundum to joint the synthetic corundum pieces 4, 5.
    Type: Grant
    Filed: October 21, 1999
    Date of Patent: August 27, 2002
    Assignees: Japan Cell, Co., Ltd., Rion Co., Ltd.
    Inventor: Hajime Fukazawa