Abstract: An object of the invention is to provide glass for semiconductor encapsulation and an outer tube for semiconductor encapsulation which are friendly to environment and allow semiconductor electronic parts to have a heat resistance of 700° C. or higher as normal maximum temperature, and semiconductor electronic parts. The glass for semiconductor encapsulation according to the invention contains essentially no lead and the temperature at which viscosity reaches 1010 dPa·s is 700° C. or higher. According to such a constitution, since the glass contains essentially no lead, no harmful ingredients are discharged in the production of the outer tube for semiconductor encapsulation and in the production of the semiconductor electronic parts and thus the glass is friendly to environment. Moreover, since the temperature at which viscosity reaches 1010 dPa·s is 700° C. or higher, semiconductor electronic parts such as a bead thermistor using the same has a heat resistance of 700° C.

Abstract: An object of the invention is to provide glass for semiconductor encapsulation and an outer tube for semiconductor encapsulation which are friendly to environment and allow semiconductor electronic parts to have a heat resistance of 700° C. or higher as normal maximum temperature, and semiconductor electronic parts. The glass for semiconductor encapsulation according to the invention contains essentially no lead and the temperature at which viscosity reaches 1010 dPa·s is 700° C. or higher. According to such a constitution, since the glass contains essentially no lead, no harmful ingredients are discharged in the production of the outer tube for semiconductor encapsulation and in the production of the semiconductor electronic parts and thus the glass is friendly to environment. Moreover, since the temperature at which viscosity reaches 1010 dPa·s is 700° C. or higher, semiconductor electronic parts such as a bead thermistor using the same has a heat resistance of 700° C.

Abstract: An illuminating glass that is capable of shielding of ultraviolet radiation lying on the large wavelength side, for example, 313 nm, and exhibits high transparency. The illuminating glass is characterized by containing, by mass, 50-78% SiO2, 11-25% B2O3, 0-10% Al2O3, 3-20% Li2O+Na2O+K2O, 0-10% MgO, 0-10% CaO, 0-20% SrO, 0-20% BaO, 0-15% ZnO, 2.6-9% TiO2 and 0.001-5% AS2O3+Sb2O3.

Abstract: An antibacterial glass is a ZnO—B2O3—SiO2 glass and includes 0-6 wt % Na2O. Typically, the antibacterial glass is used as an antibacterial agent which is filled into a resin.

Abstract: A low temperature sealing composition comprising PbO--B.sub.2 O.sub.3 --Bi.sub.2 O.sub.3 glass powder with a reduced amount of SiO.sub.2 content but with an addition of GeO.sub.2 so as to realize a lowered sealing temperature such as 400.degree.-310.degree. C. The glass powder consists essentially of 25-85 wt. % of PbO, 1-11.2 wt. % of B.sub.2 O.sub.3, 5.1-70 wt. % of Bi.sub.2 O.sub.3, 0.1-20 wt. % of GeO.sub.2, 0-5 wt. % of SiO.sub.2, 0-10 wt. % of Fe.sub.2 O.sub.3, 0-10 wt. % of CuO, 0-15 wt. % of ZnO, 0-5 wt. % of TiO.sub.2, and 0-9 wt. % of F.sub.2. The glass powder may be used by mixing with 15-55 vol. % of refractory filler powder of at least one element which is selected from the group consisting of lead titanate based ceramic powder, willemite based ceramic powder, cordierite ceramic powder, zircon based ceramic powder, tin oxide solid solution powder, and alumina powder.

Abstract: A low temperature sealing composition consists essentially of 45.0 to 85.0 wt. % of PbO, 1.0 to 11.0 wt. % of B.sub.2 O.sub.3, 1.0 to 45.0 wt. % of Bi.sub.2 O.sub.3, 0.2 to 10.0 wt. % of Fe.sub.2 O.sub.3, 0 to 15.0 wt. % of ZnO, 0 to 5.0 wt. % of CuO, 0 to 5.0 wt. % of V.sub.2 O.sub.5, 0 to 3.0 wt. % of SnO.sub.2, 0 to 5.0 wt. % of SiO.sub.2 plus Al.sub.2 O.sub.3, 0 to 7.0 wt. % of BaO, 0 to 5.0 wt. % of TiO.sub.2, 0 to 5.0 wt. % of ZrO.sub.2 and 0 to 6.0 wt. % of F.sub.2. The sealing composition has a low sealing temperature of 400.degree.C. or lower and is useful for readily sealing IC packages and display panels without application of load. In order to adjust the thermal coefficient of expansion, the sealing glass composition may be used by mixing with 20 vol. % to 55 vol. % of refractory filler powder of such as lead titanate based ceramics, willemite based ceramics, cordierite ceramics, zircon based ceramics or tin oxide based ceramics.