Abstract: A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.

Abstract: A wiring board includes an insulating layer in which a semiconductor chip is embedded, and a wiring structure connected to the semiconductor chip. A reinforcing member reinforcing the insulating layer is embedded in the insulating layer. This enables reduction in a thickness of the wiring board and a suppression of warpage of the wiring board.

Abstract: There are provided the steps of mounting a semiconductor chip on a first substrate, providing an underfill resin between the semiconductor chip and the first substrate, forming a through hole on a second substrate, providing an electrode on the second substrate, bonding the first and second substrates to include the semiconductor chip through the electrode, and filling a sealing resin between the first and second substrates at a filling pressure capable of correcting a warpage generated on the semiconductor chip and the first substrate while discharging air from the through hole.

Abstract: A pickup device comprises a flexible circuit member including a main circuit portion on which electric or electronic components are mounted and a sub-circuit portion connected to the main circuit portion. The pickup device further comprises a housing on which the flexible circuit member is mounted. Each of the main circuit portion and the sub-circuit portion has a single-sided structure and includes a ground portion. The sub-circuit portion is folded with respect to the main circuit portion. The flexible circuit member is mounted on the housing while the main circuit portion and the sub-circuit portion are held in an overlapping arrangement. With this arrangement, S/N ratio of electric signals can be improved while achieving cost reduction.

Abstract: A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.

Abstract: There are provided the steps of mounting a semiconductor chip on a first substrate, providing an underfill resin between the semiconductor chip and the first substrate, forming a through hole on a second substrate, providing an electrode on the second substrate, bonding the first and second substrates to include the semiconductor chip through the electrode, and filling a sealing resin between the first and second substrates at a filling pressure capable of correcting a warpage generated on the semiconductor chip and the first substrate while discharging air from the through hole.

Abstract: A novel method has been found to produce 2,2?-anhydro-1-(?-L-arabinofuranosyl)thymine as a novel useful intermediate compound. A novel method has been further found to produce thymidine from 2,2?-anhydro-1-(?-L-arabinofuranosyl)thymine. A novel method has been further found to L-2?-deoxyribose derivatives as a useful synthetic intermediate through L-2,2?-anhydro-5,6-dihydrocyclouridine derivative. According to these methods, synthesis of various L-nucleic acid derivatives, synthesis of which has been difficult till now.

Abstract: A wiring board includes an insulating layer in which a semiconductor chip is embedded, and a wiring structure connected to the semiconductor chip. A reinforcing member reinforcing the insulating layer is embedded in the insulating layer. This enables reduction in a thickness of the wiring board and a suppression of warpage of the wiring board.

Abstract: A pickup device comprises a flexible circuit member including a main circuit portion on which electric or electronic components are mounted and a sub-circuit portion connected to the main circuit portion. The pickup device further comprises a housing on which the flexible circuit member is mounted. Each of the main circuit portion and the sub-circuit portion has a single-sided structure and includes a ground portion. The sub-circuit portion is folded with respect to the main circuit portion. The flexible circuit member is mounted on the housing while the main circuit portion and the sub-circuit portion are held in an overlapping arrangement. With this arrangement, S/N ratio of electric signals can be improved while achieving cost reduction.

Abstract: A novel method has been found to produce 2,2′-anhydro-1-(&bgr;-L-arabinofuranosyl)thymine as a novel useful intermediate compound. A novel method has been further found to produce thymidine from 2,2′-anhydro-1-(&bgr;-L-arabinofuranosyl)thymine. A novel method has been further found to L-2′-deoxyribose derivatives as a useful synthetic intermediate through L-2,2′-anhydro-5,6-dihydrocyclouridine derivative. According to these methods, synthesis of various L-nucleic acid derivatives, synthesis of which has been difficult till now.

Abstract: This invention provides amino acid N-carboxyanhydrides, each of which has an N-acyl substituent on its nitrogen atom, is represented by the following formula (1): readily reacts with nucleophilic reagents such as free amino acids, alcohols, anions or the like, and are intermediates useful for the high-yield production of amino acid derivatives, optically active compounds, peptides, polypeptides and the like useful in many fields lead by the fields of pharmaceuticals and agrochemicals, and also provides a process for the production of the amino acid N-carboxyanhydrides. Further, the present invention also provides a process for the production of diamides, which uses the compounds of the formula (1) and amine derivatives represented by the following formula (7): These diamides can also be suitably used for the production of amino acid derivatives, optically active compounds, peptides, polypeptides and the like.

Abstract: A compound represented by the following formula (12) useful as an intermediate for production of drug or agricultural chemical: 1

Abstract: A compound represented by the following formula (12) useful as an intermediate for production of drug or agricultural chemical: (wherein R21 to R25 are each independently a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group of 1 to 4 carbon atoms, an alkoxy group of 1 to 4 carbon atoms, a perfluoroalkyl group of 1 to 4 carbon atoms, a cyano group, a nitro group, an amino group, a carboxyl group, a thiol group, an alkylthio group of 1 to 4 carbon atoms or a carbamoyl group) can be produced by reacting a compound represented by the formula (13): (wherein R21 to R25 have the same definitions as given above) with 1,1-cyclopropanedicarboxylic acid. The compound of the formula (12) is useful as a raw material for production of a pyrrolidinone compound useful as an active ingredient of drug.

Abstract: This invention provides amino acid N-carboxyanhydrides, each of which has an N-acyl substituent on its nitrogen atom, is represented by the following formula (1): 1

Abstract: A semiconductor device in which a plurality of semiconductor chips are consolidated into one and which is provided with at least a set of rerouting wiring lines formed so as to interconnect electrodes of the respective semiconductor chips, the electrodes having a function which is common to the respective semiconductor chips, the set of rerouting wiring line having a common external connection terminal.

Abstract: A method forwarding a semiconductor device that is excellent in bonding strength of bumps with respective protruded electrodes and having high reliability. A wiring pattern 28 to be connected to an electrode 22 of a semiconductor chip 20 is formed on an insulting film 23 formed on the semiconductor chip 20 in which the electrode 20 is formed. Protruded electrodes 32 are formed on the wiring pattern 28. The wiring pattern 28 is covered with a protective film 36, and a bump 38 for external connection is formed on the end portion of each of the protruded electrodes 32 exposed from the protective film 36. The bump 38 is formed in such a manner that the bump is bonded to the at least entire end face of each of the protruded electrodes 32.

Abstract: A compound represented by the following formula (12) useful as an intermediate for production of drug or agricultural chemical: (wherein R21 to R25 are each independently a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group of 1 to 4 carbon atoms, an alkoxy group of 1 to 4 carbon atoms, a perfluoroalkyl group of 1 to 4 carbon atoms, a cyano group, a nitro group, an amino group, a carboxyl group, a thiol group, an alkylthio group of 1 to 4 carbon atoms or a carbamoyl group) can be produced by reacting a compound represented by the formula (13): (wherein R21 to R25 have the same definitions as given above) with 1,1-cyclopropanedicarboxylic acid. The compound of the formula (12) is useful as a raw material for production of a pyrrolidinone compound useful as an active ingredient of drug.

Abstract: A semiconductor device excellent in bonding strength of bumps with respective protruded electrodes and having high reliability wherein a wiring pattern 28 to be connected to an electrode 22 of a semiconductor chip 20 is formed on an insulting film 23 formed on the semiconductor chip 20 in which the electrode 20 is formed, protruded electrodes 32 are formed on the wiring pattern 28, the wiring pattern 28 is covered with a protective film 36, and a bump 38 for external connection is formed on the end portion of each of the protruded electrodes 32 exposed from the protective film 36, the bump 38 is formed in such a manner that the bump is bonded to the at least entire end face of each of the protruded electrodes 32.

Abstract: Since a compound represented by general formula (1), its pharmaceutically acceptable salt and a hydrate of the pharmaceutically acceptable salt have high antipsychotic activity, they may be used as an active ingredient for preparation of an antipsychotic. ##STR1## Also provided are an optical resolution method of the above compound and an intermediate for preparation of the compound.

Abstract: A process for making a chip sized semiconductor device, in which a semiconductor chip is prepared so as to have electrodes on one of surfaces thereof and an electrically insulating passivation film formed on the one surface except for areas where the electrodes exist. An insulation sheet is prepared so as to have first and second surfaces and a metallic film coated on the first surface. The second surface of the insulation sheet is adhered on the one surface of the semiconductor chip. First via-holes are provided in the metallic film at positions corresponding to the electrodes. Second via-holes are provided in the insulation sheet at positions corresponding to the first via-holes so that the electrodes are exposed. The metallic film is electrically connected to the electrodes of the semiconductor chip through the first and second via-holes. A circuit pattern is formed from the metallic film so that the circuit pattern has external terminal connecting portions.