Abstract: A power tool includes a motor, an impact mechanism, an output unit, a circuit board, a housing, and a power cord. The circuit board includes a power-source circuit board configured to convert alternate current into direct current and a control circuit board. The housing includes a body section, a board accommodating section, and a handle section. The board accommodating section accommodates the circuit board. The handle section has one end portion connected to the body section and another end portion connected to the board accommodating section. The power cord extends from the board accommodating section. The power cord is positioned opposed to the handle section with respect to the board accommodating section. The control circuit board is located at a position close to the handle section in the board accommodating section. The power-source circuit board is located between the control circuit board and the power cord.

Abstract: An electrical power tool capable of suppressing increase in a size of a device main body in a radial direction of an electrical motor is provided. A driver which drives a distal end tool with a power of an electrical motor includes: a casing in which the electrical motor is provided; a driven gear and a spindle which are arranged eccentrically with respect to an output shaft of the electrical motor and which transmit power of the output shaft to the distal end tool; and a power supply circuit unit arranged inside the casing. And, an arrangement region of the driven gear and the spindle and an arrangement region of the power supply circuit unit are at least partially overlapped with each other in a circumferential direction centering the output shaft.

Abstract: A substrate assembly including a photosensitive etching glass substrate; and a first substrate and a second substrate for interposing both main surfaces of the photosensitive etching glass substrate between them. One of the main surfaces of the photosensitive etching glass substrate is thermally bonded to the first substrate, and the other main surface of the photosensitive etching glass substrate is bonded to the second substrate. When a thermal expansion coefficient of the photosensitive etching glass substrate is defined as C0, and a thermal expansion coefficient of the first substrate is defined as C1, and a thermal expansion coefficient of the second substrate is defined as C2, C1/C2 satisfies a relation of 0.7 or more and 1.3 or less, and at least one of a relation of C0/C1 satisfying less than 0.7 or larger than 1.3, and a relation of C0/C2 satisfying less than 0.7 or larger than 1.3 is satisfied.

Abstract: There is provided that a substrate comprising a glass substrate 2 constituted by a glass including a silicon oxide. The glass substrate has a through-hole 3 communicating with a front surface and a rear surface of the glass substrate, and filled with a metal material. The substrate is realized by forming an anchor part by selectively etching a silicon oxide on a sidewall surrounding an inside of said through-hole 3 before filling the metal material and by filling the inside of said through-hole 3 with the metal material after forming the anchor part.

Abstract: An underlayer is formed on a side wall 101a of a through hole 101 out of the side wall 101a of the through hole 101 and a substrate main surface, with a main surface having a low adhesion to a conductive layer disposed as an upper surface, and the conductive layer is formed on the substrate main surface and the side wall 101a of the through hole 101 on which the underlayer is formed, and the underlayer formed on the side wall 101a of the through hole 101 is selectively etched.

Abstract: There is provided a glass substrate for electronic amplification having through holes formed on a plate-like glass member and used for causing an electron avalanche in the through holes, wherein a shape of the glass substrate for electronic amplification and a material of the glass member are determined so that an insulation resistance in a plate thickness direction per plane of 100 cm2 is 107 to 1011?.

Abstract: An electronic multiplier porous glass plate used for a detector that measures ionized electrons by utilizing an electron avalanche multiplication in a gas is presented. The plate has a plurality of through holes provided on a plate-like member so as to be arranged two-dimensionally, wherein the plate-like member is formed by a photosensitive crystallized glass obtained by crystallizing a photosensitive glass, to realize a thinner glass plate and finer through holes.

Abstract: A substrate assembly including a photosensitive etching glass substrate; and a first substrate and a second substrate for interposing both main surfaces of the photosensitive etching glass substrate between them. One of the main surfaces of the photosensitive etching glass substrate is thermally bonded to the first substrate, and the other main surface of the photosensitive etching glass substrate is bonded to the second substrate. When a thermal expansion coefficient of the photosensitive etching glass substrate is defined as C0, and a thermal expansion coefficient of the first substrate is defined as C1, and a thermal expansion coefficient of the second substrate is defined as C2, C1/C2 satisfies a relation of 0.7 or more and 1.3 or less, and at least one of a relation of C0/C1 satisfying less than 0.7 or larger than 1.3, and a relation of C0/C2 satisfying less than 0.7 or larger than 1.3 is satisfied.

Abstract: An underlayer is formed on a side wall 101a of a through hole 101 out of the side wall 101a of the through hole 101 and a substrate main surface, with a main surface having a low adhesion to a conductive layer disposed as an upper surface, and the conductive layer is formed on the substrate main surface and the side wall 101a of the through hole 101 on which the underlayer is formed, and the underlayer formed on the side wall 101a of the through hole 101 is selectively etched.

Abstract: Manufacturing methods of a substrate and a wiring substrate include a step A of forming a primary plating layer on a lower side of a glass substrate having a through-hole; a step B of sealing a lower opening of the through-hole by forming a first layer on an upper side using electroplating; and a step C of filling the through-hole by depositing a second layer in the through-hole using electroplating from the upper side. In the step A, the primary plating layer is formed on from a lower opening edge to a partial sidewall surface of the through-hole. In the step B, the lower opening is sealed by growing the first layer from a primary plating layer surface inside the through-hole. In the step C, the through-hole is filled with plating metal by growing the second layer from a first layer surface inside the through-hole toward an upper opening.

Abstract: A power tool includes a motor, an impact mechanism, an output unit, a circuit board, a housing, and a power cord. The circuit board includes a power-source circuit board configured to convert alternate current into direct current and a control circuit board. The housing includes a body section, a board accommodating section, and a handle section. The board accommodating section accommodates the circuit board. The handle section has one end portion connected to the body section and another end portion connected to the board accommodating section. The power cord extends from the board accommodating section. The power cord is positioned opposed to the handle section with respect to the board accommodating section. The control circuit board is located at a position close to the handle section in the board accommodating section. The power-source circuit board is located between the control circuit board and the power cord.

Abstract: A longer life screwdriver is disclosed, and the screwdriver includes a ball retained in a through-hole in a manner movable in a radial direction of a driving shaft member, the through-hole being defined in a driving shaft member, the ball being possible to project beyond the driving shaft member along an outer circumference of the driving shaft member, the ball further being possible to abut an end of a clutch spring, and elements for allowing the ball to protrude beyond the driving shaft member along the outer circumference of the driving shaft member in response to axial movement of the output shaft member against a pressing member, the improvement comprising: disengagement elements for releasing engagement between the clutch spring and the ball during the reverse rotation of a motor.

Abstract: A longer life screwdriver is disclosed, and the screwdriver includes a ball retained in a through-hole in a manner movable in a radial direction of a driving shaft member, the through-hole being defined in a driving shaft member, the ball being possible to project beyond the driving shaft member along an outer circumference of the driving shaft member, the ball further being possible to abut an end of a clutch spring, and means for allowing the ball to protrude beyond the driving shaft member along the outer circumference of the driving shaft member in response to axial movement of the output shaft member against a pressing means, the improvement comprising: disengagement means for releasing engagement between the clutch spring and the ball during the reverse rotation of a motor.

Abstract: A radiotelephone system having a base unit and a plurality of subordinate units for carrying out radiocommunication between the base unit and the subordinate units. The base unit sends transmitting carriers to the subordinate units and gets receiving carriers from the subordinate units. The system includes a first frequency varying part for periodically shifting transmitting/receiving carrier frequencies of the base unit from a given frequency of one operating interval to another frequency of another operating interval. A first synchronizing signal part generates a synchronizing signal in synchronism with a time period determined from the shifting of the carrier frequencies. A second synchronizing signal part extracts a synchronizing signal from a receiving carrier signal received by each of the subordinate units.