Patents by Inventor Hajime Koike

Hajime Koike has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240087798
    Abstract: A coil component includes a coil configured of a winding, an exterior body provided to cover the coil, and a terminal part configured to be continuous with the winding. A proximal end portion of the terminal part is buried in the exterior body. A distal end portion ahead of the proximal end portion is bent from the proximal end portion and located outside a mounting surface of the exterior body along the mounting surface.
    Type: Application
    Filed: April 20, 2023
    Publication date: March 14, 2024
    Applicant: TDK CORPORATION
    Inventors: Junichiro URABE, Toshinori MATSUURA, Hajime KATO, Shintarou KOIKE, Kazushige TOHTA, Takuto KAZAMA, Masashi GOTOH
  • Publication number: 20230084496
    Abstract: A lead frame includes a die pad that includes a mounting surface for a semiconductor chip, and a film-like member that is arranged on the mounting surface of the die pad. The die pad includes a through hole that is formed in an area that includes an outer periphery of the film-like member.
    Type: Application
    Filed: September 12, 2022
    Publication date: March 16, 2023
    Inventors: Shintaro Hayashi, Hajime Koike
  • Patent number: 10985094
    Abstract: A lead frame includes a lead portion having a first surface and a second surface, a connecting bar that has a first surface and a second surface and to which the lead portion is connected, and a raised portion provided on the first surface of the connecting bar. The first surface of the connecting bar is positioned between the first and the second surfaces of the lead portion. The tip of the raised portion is positioned between the first surface of the lead portion and the first surface of the connecting bar.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: April 20, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Shintaro Hayashi, Hajime Koike, Konosuke Kobayashi
  • Publication number: 20200098672
    Abstract: A lead frame includes a lead portion having a first surface and a second surface, a connecting bar that has a first surface and a second surface and to which the lead portion is connected, and a raised portion provided on the first surface of the connecting bar. The first surface of the connecting bar is positioned between the first and the second surfaces of the lead portion. The tip of the raised portion is positioned between the first surface of the lead portion and the first surface of the connecting bar.
    Type: Application
    Filed: September 16, 2019
    Publication date: March 26, 2020
    Inventors: Shintaro Hayashi, Hajime Koike, Konosuke Kobayashi
  • Patent number: 5752868
    Abstract: An apparatus for collecting a cathode-ray tube (2) from a waste cathode-ray tube device (1) and recycling the cathode-ray tube (2) includes a conveyor (15) having a moving pallet (21) for detachably holding a panel portion (10) of the cathode-ray tube (2) by vacuum adsorption portions (63a) through (63d) and sequentially conveying the panel portion (10) to a predetermined position, a device for leaving only the cathode-ray tube (2) by scrapping the waste cathode-ray tube device (1) held on the moving pallet (21) and separating and removing a device housing (4) from the waste cathode-ray tube device (1), and a conveyor for conveying the separated device housing (4). According to an apparatus for and method of collecting a used cathode-ray tube, a cathode-ray tube can be collected from a waste cathode-ray tube device easily and inexpensively, and natural resources can be recycled.
    Type: Grant
    Filed: February 21, 1996
    Date of Patent: May 19, 1998
    Assignee: Sony Corporation
    Inventors: Fujio Yabuki, Yukio Abe, Hajime Koike, Koji Kanehira