Abstract: An active matrix substrate includes a plurality of thin film transistors including an oxide semiconductor layer, an interlayer insulating layer, a plurality of pixel electrodes arranged above the interlayer insulating layer, a common electrode arranged between the pixel electrode and the interlayer insulating layer and also configured to function as a touch sensor electrode, a first dielectric layer arranged between the interlayer insulating layer and the common electrode, a second dielectric layer arranged between the common electrode and the pixel electrode, a plurality of touch wiring lines arranged between the interlayer insulating layer and the common electrode and formed of a third conductive film, and a plurality of pixel contact portions, in which each of the plurality of pixel contact portions includes a drain electrode of the thin film transistor, a connection electrode formed of the third conductive film and electrically connected to the drain electrode in a lower opening formed in the interlayer i

Abstract: A blade tensioner of a blade tensioner system for a chain that drivingly connects a drive shaft to a driving shaft in an engine, that improves the chain-damping efficiency in a blade tensioner applied to the chain within an engine, prevents the sideways tilt of the blade tensioner during operation, in a blade tensioner applied to the chain in an engine, and provides a blade tensioner with a functionality that allows it to transversely guide a chain along the chain sliding face in a blade shoe, while maintaining the flexural deformability (i.e., the flexibility) of the blade shoe.

Abstract: A subject of the present invention is to provide a clip-type lead frame having flexibility against a board thickness variation caused by not only an uneven product quality but also several different thick type products. To this end, the provided clip-type lead frame has a height adjustable means at lead pins corresponding to upper or/and lower side connection pads of the semiconductor device or the sub-board.

Abstract: A semiconductor module achieving higher density of the semiconductor module itself as well as of being disposed in an area-efficient manner relative to another electronic component, such as a mother board and the like. The semiconductor module includes a mounting substrate having, on an underside, a solder ball for connecting to an interconnection of a mother board and semiconductor packages mounted in multiple layers on the top side of the mounting substrate and connected to electrodes on the mounting substrate.

Abstract: A tensioner device 14 for an engine 1 comprises a support member 16, a blade shoe 17 coming into sliding contact with a timing chain 11 having a base end section 17a held by a cylinder block 3 and a tip end section 17b supported by the support member 16, and a leaf spring 18 held by the blade shoe 1 for pressing the blade shoe 17 against the timing chain 11 elastically. The support member 16 is formed integrally with the cylinder block 3. The tip end section 17b comes into sliding contact with a guide surface 16a formed on the support member 16 to be supported.

Abstract: A subject of the present invention is to provide a clip-type lead frame having flexibility against a board thickness variation caused by not only an uneven product quality but also several different thick type products. To this end, the provided clip-type lead frame has a height adjustable means at lead pins corresponding to upper or/and lower side connection pads of the semiconductor device or the sub-board.

Abstract: A blade tensioner of s blade tensioner system for a chain that drivingly connects a drive shaft to a driving shaft in an engine, that improves the chain-damping efficiency in a blade tensioner applied to the chain within an engine, prevents the sideways tilt of the blade tensioner during operation, in a blade tensioner applied to the chain in an engine, and provides a blade tensioner with a functionality that allows it to transversely guide a chain along the chain sliding face in a blade shoe, while maintaining the flexural deformability (i.e., the flexibility) of the blade shoe.

Abstract: In an integrated circuit package, a deformed IC lead is reliably connected with a land for mounting. Such reliable connection between the deformed IC lead and a land is realized by a method for mounting an integrated circuit package wherein a non deformed first lead and a deformed second lead in the integrated circuit package are connected to a first land and a second land on a substrate, respectively.

Abstract: A semiconductor module can be produced that is capable of achieving higher density of the semiconductor module itself as well as of being disposed in an area-efficient manner to another electronic component such as a mother substrate and the like. The semiconductor module includes a mounting substrate having on the underside a solder ball for connecting to the interconnection of a mother substrate and a plurality of semiconductor packages mounted in multiple layers on the surface side of the mounting substrate and connected to electrodes provided on the mounting substrate.

Abstract: In an integrated circuit package, a deformed IC lead is reliably connected with a land for mounting.

Abstract: A semiconductor device card system is capable of preventing foreign matter from entering from outside even when a semiconductor device is mounted and to prevent the semiconductor device card from being removed inadvertently. A mounting section of a semiconductor device card is disposed in a semiconductor device card system unit. The mounting section includes an openable mounting section door, and a window for a connector, disposed in the mounting section door, and through which a back-end connector is inserted.

Abstract: A memory card having no ordinary type circuit board and a reduced thickness. Insulating layers are disposed on reverse surfaces of a pair of metallic panels, and circuit patterns are formed on the insulating layers. A plurality of electronic parts are mounted on the metallic panels by, for example, being soldered to the circuit patterns. The pair of metallic panels on which the electronic parts are mounted are fitted and bonded to openings formed in a frame of the card so that the electronic parts are accommodated inside the frame facing each other.

Abstract: An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded to the frame on the opposite sides of the frame by means of adhesive layers. The semiconductor devices are prevented from being bonded to the panel via the adhesive layers at locations on the adhesive layers facing the semiconductor devices.

Abstract: An IC card arranged so that a connector cannot come off a frame during an assembly process in which the connector and a circuit board are accommodated in the frame and panels are thereafter attached to obverse and reverse surfaces of the frame. Projections on sides of the connector and resilient engaging/fixing hooks with oblique surfaces on the frame are engaged. As the connector is forced into the frame, the projections of the connector are brought into engagement with and temporarily deflect the engaging/fixing hooks of the frame. The connector is thereby fixed firmly on the frame.

Abstract: A semiconductor device includes a package substrate, a first IC package having external lead terminals which are downwardly bent with respect to a plane surface of the package and a second IC package having external lead terminals which are upwardly bent with respect to a plane surface of the package. These packages are disposed on one surface of the package substrate parallel to each other. One or more pairs of the external lead terminals of the first and second IC packages, which face each other and are electrically connected with to each other, are disposed on the same mount pads provided on the package substrate. Therefore, wires for connecting those lead terminals can be dispensed with and the other external lead terminals can be connected by simply drawing around wires without providing through holes. In addition, no positional deviation between the two packages, occurs and no solder bridges are created during soldering.

Abstract: An IC card is disclosed which would not be deformed, and hence, which maintains its quality reliability. A frame is provided to house a substrate which mounts ICs. Panels for protecting the ICs are fixed to the frame by first adhesive material layers. A connector is disposed, in contact with the substrate, between the panels. The connector is fixed to the frame by a second adhesive material layer. This prohibits that external force which acts on the connector at insertion and detachment of the IC card into and from external equipment from acting on the first adhesive material layers. Hence, insertion and detachment of the IC card do not cause deterioration in adhesion between the panels and the frame. Thus, deformation of the ICs due to the external force is prevented, thereby the quality reliability of the IC card being better maintained.

Abstract: In a portable electrical device, a plurality of engaging portions of a frame on surfaces of the frame are directed in the same direction and engaging portions on two connecting terminals can be brought into engagement with the engaging portions along the same direction. Thus, both of the connecting terminals can be mounted on the frame from the same direction, and the efficiency of the mounting operation is improved and can be automated. Furthermore, deformation of or damage to the connecting terminals, caused by the mounting process, is reduced.

Abstract: A connector-supporting element of a main frame of an IC card and a sub-frame receive holding parts of a connector. The connector-supporting element has barriers having a height of at least one-half that of the holding parts for receiving the barriers and a force applied in the direction along bonded surfaces of the connector-supporting element and the sub-frame. Oblique surfaces are respectively provided on each of the barriers and there is a positional deviation in the parts.

Abstract: A semiconductor device card and a method of manufacturing the card. A frame includes an integral spacer which fills a dead space on a circuit board to eliminate the need for positioning a separate spacer in the dead space on the circuit board and fixing the spacer in place with a bonding sheet or the like. In a semiconductor device card in which a spacer for filling a dead space on the circuit board is bonded to a corresponding panel, a recess is formed on the surface of the spacer bonded to the obverse or reverse panel to reduce undulations occurring in the panel surface.

Abstract: An IC card having a shutter, in which the right and left sides of the shutter are bent to form L-shaped flanges enclosing the sides of an electrode terminal board, the shutter sliding over the electrode terminal board.