Patents by Inventor Hajime MITSUISHI
Hajime MITSUISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240021447Abstract: A method of manufacturing a stacked substrate by bonding a first substrate and a second substrate, including a step of determining, based on information about curving of each of the first substrate and the second substrate, whether or not the first substrate and the second substrate satisfy a predetermined condition, and, a step of bonding the first substrate and the second substrate if the predetermined condition is satisfied. The stacked substrate manufacturing method described above includes a step of estimating, based on the information, an amount of misalignment which occurs after the first substrate is bonded to the second substrate and the predetermined condition may include that the amount of misalignment is equal to or less than a threshold.Type: ApplicationFiled: September 27, 2023Publication date: January 18, 2024Applicant: NIKON CORPORATIONInventors: Isao SUGAYA, Hajime MITSUISHI
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Publication number: 20240014079Abstract: To improve the throughput of substrate bonding. A substrate bonding apparatus that bonds first and second substrates so that contact regions in which the first and second substrates contact are formed in parts of the first and second substrates and the contact regions enlarge from the parts, the apparatus including: a detecting unit detecting information about the contact regions; and a determining unit determining that the first and second substrates can be carried out based on the information detected at the detecting unit. In the substrate bonding apparatus, the information may be information, a value of which changes according to progress of enlargement of the contact regions, and the determining unit may determine that the first and second substrates can be carried out if the value becomes constant or if a rate of changes in the value becomes lower than a predetermined value.Type: ApplicationFiled: September 26, 2023Publication date: January 11, 2024Applicant: NIKON CORPORATIONInventors: Isao SUGAYA, Eiji ARIIZUMI, Yoshiaki KITO, Mikio USHIJIMA, Masanori ARAMATA, Naoto KIRIBE, Hiroshi SHIRASU, Hajime MITSUISHI, Minoru FUKUDA, Masaki TSUNODA
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Patent number: 11842905Abstract: A method of manufacturing a stacked substrate by bonding a first substrate and a second substrate, including a step of determining, based on information about curving of each of the first substrate and the second substrate, whether or not the first substrate and the second substrate satisfy a predetermined condition, and, a step of bonding the first substrate and the second substrate if the predetermined condition is satisfied. The stacked substrate manufacturing method described above includes a step of estimating, based on the information, an amount of misalignment which occurs after the first substrate is bonded to the second substrate and the predetermined condition may include that the amount of misalignment is equal to or less than a threshold.Type: GrantFiled: January 10, 2019Date of Patent: December 12, 2023Assignee: Nikon CorporationInventors: Isao Sugaya, Hajime Mitsuishi
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Patent number: 11823935Abstract: A stacking apparatus that stacks substrate and a second substrate includes: a plurality of holding members that hold the first substrate, wherein the plurality of bolding members correct positional misalignment of the first substrate relative to the second substrate by preset amounts of correction, and the plurality of holding members include holding members having the amounts of correction that are different from each other. The stacking apparatus may further include a carrying unit that carries a holding member that is selected from among the plurality of holding members and holds the first substrate from a position here the holding member is housed to a position where the first substrate is held.Type: GrantFiled: September 29, 2020Date of Patent: November 21, 2023Assignee: NIKON CORPORATIONInventors: Hajime Mitsuishi, Isao Sugaya, Minoru Fukuda
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Patent number: 11791223Abstract: To improve the throughput of substrate bonding. A substrate bonding apparatus that bonds first and second substrates so that contact regions in which the first and second substrates contact are formed in parts of the first and second substrates and the contact regions enlarge from the parts, the apparatus including: a detecting unit detecting information about the contact regions; and a determining unit determining that the first and second substrates can be carried out based on the information detected at the detecting unit. In the substrate bonding apparatus, the information may be information, a value of which changes according to progress of enlargement of the contact regions, and the determining unit may determine that the first and second substrates can be carried out if the value becomes constant or if a rate of changes in the value becomes lower than a predetermined value.Type: GrantFiled: June 27, 2018Date of Patent: October 17, 2023Assignee: Nikon CorporationInventors: Isao Sugaya, Eiji Ariizumi, Yoshiaki Kito, Mikio Ushijima, Masanori Aramata, Naoto Kiribe, Hiroshi Shirasu, Hajime Mitsuishi, Minoru Fukuda, Masaki Tsunoda
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Publication number: 20230052396Abstract: A control device configured to control a supply condition of a gas which is supplied between two substrates that are to be bonded to each other by a substrate bonding device, is configured to control the supply condition based on a measurement result obtained by a measurement in relation to at least one of the substrate, another substrate bonded before the substrate is bonded, or the substrate bonding device, and the two substrates are bonded to each other by a contact region expanding after the contact region is formed in a center.Type: ApplicationFiled: September 6, 2022Publication date: February 16, 2023Applicant: NIKON CORPORATIONInventors: Hidehiro MAEDA, Toshimasa SHIMODA, Hajime MITSUISHI, Hiroshi MORI, Kishou TAKAHATA, Masahiro YOSHIHASHI, Takashi SHIOMI, Yoshihiro MAEHARA
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Patent number: 11362059Abstract: A manufacturing method for manufacturing a stacked substrate by bonding two substrates includes: acquiring information about crystal structures of a plurality of substrates; and determining a combination of two substrates to be bonded to each other, based on the information about the crystal structures. In the manufacturing method described above, the information about the crystal structures may include at least one of plane orientations of bonding surfaces and crystal orientations in a direction in parallel with the bonding surfaces. In the manufacturing methods described above, the determining may include determining a combination of the two substrates with a misalignment amount after bonding being equal to or smaller than a predetermined threshold.Type: GrantFiled: April 30, 2020Date of Patent: June 14, 2022Assignee: Nikon CorporationInventors: Isao Sugaya, Atsushi Kamashita, Hajime Mitsuishi, Minoru Fukuda
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Publication number: 20220148978Abstract: A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.Type: ApplicationFiled: November 18, 2021Publication date: May 12, 2022Applicant: NIKON CORPORATIONInventors: Isao SUGAYA, Kazuya OKAMOTO, Hajime MITSUISHI, Minoru FUKUDA
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Publication number: 20220084870Abstract: A substrate holder includes a central support portion configured to support a central portion of a substrate, and an circumferential support portion arranged on an outside of the central support portion and configured to support a circumferential portion on an outside of the central portion, and the circumferential support portion is configured to support the circumferential portion so that at least a partial region of the circumferential portion is curved toward the substrate holder with a curvature greater than that of the central portion.Type: ApplicationFiled: November 5, 2021Publication date: March 17, 2022Applicant: NIKON CORPORATIONInventors: Hajime MITSUISHI, Isao SUGAYA, Atsushi KAMASHITA, Masashi OKADA, Minoru FUKUDA, Hidehiro MAEDA
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Patent number: 11211338Abstract: A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.Type: GrantFiled: October 11, 2019Date of Patent: December 28, 2021Assignee: Nikon CorporationInventors: Isao Sugaya, Kazuya Okamoto, Hajime Mitsuishi, Minoru Fukuda
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Publication number: 20210242044Abstract: Provided is a substrate bonding apparatus comprising: a first holding unit for holding a first substrate; and a second holding unit for holding a second substrate, wherein the substrate bonding apparatus is configured to bond the first substrate and the second substrate by, after forming a contact region between a part of the first substrate and a part of the second substrate, expanding the contact region to form an initially bonded region and releasing the second substrate having the initially bonded region formed thereon from the second holding unit.Type: ApplicationFiled: April 20, 2021Publication date: August 5, 2021Applicant: NIKON CORPORATIONInventors: Hajime MITSUISHI, Isao SUGAYA, Masaki TSUNODA, Kazuhiro SUZUKI, Takashi SHIOMI, Minoru FUKUDA
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Publication number: 20210225651Abstract: A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.Type: ApplicationFiled: April 8, 2021Publication date: July 22, 2021Applicant: NIKON CORPORATIONInventors: Hajime MITSUISHI, Isao SUGAYA, Minoru FUKUDA, Masaki TSUNODA, Hidehiro MAEDA, Ikuhiro KUWANO
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Publication number: 20210138778Abstract: A bonding method including firstly bonding a first substrate to a second substrate by releasing a holding of the first substrate to form a first stack; and secondly bonding one substrate, which has been thinned, among the first substrate and the second substrate that have been bonded, to a third substrate, to form a second stack, wherein when the first substrate is thinned, the holding of the third substrate is released at the second bonding, and when the second substrate is thinned, the holding of the first stack is released at the second bonding.Type: ApplicationFiled: January 22, 2021Publication date: May 13, 2021Applicant: NIKON CORPORATIONInventors: Yoshihiro MAEHARA, Atsushi KAMASHITA, Hajime MITSUISHI, Minoru FUKUDA
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Patent number: 11004686Abstract: A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.Type: GrantFiled: May 15, 2019Date of Patent: May 11, 2021Assignee: NIKON CORPORATIONInventors: Hajime Mitsuishi, Isao Sugaya, Minoru Fukuda, Masaki Tsunoda, Hidehiro Maeda, Ikuhiro Kuwano
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Publication number: 20200381387Abstract: An alignment method for aligning two substrates to be stacked, comprising measuring a position of a mark selected from plurality of marks disposed on at least one substrate of the two substrates and aligning the two substrates based on the position of the measured mark, wherein the mark to be measured is selected based on information relating to distortion of the at least one substrate. The mark may be a mark disposed in a region having a smaller distortion amount of the at least one substrate than a threshold. The mark may be a mark disposed in a region having a higher reproducibility of distortion that occurs in the at least one substrate than a threshold.Type: ApplicationFiled: August 20, 2020Publication date: December 3, 2020Applicant: NIKON CORPORATIONInventors: Hajime MITSUISHI, Minoru FUKUDA, Isao SUGAYA
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Patent number: 10825707Abstract: A stacking apparatus that stacks a first substrate and a second substrate includes: a plurality of holding members that hold the first substrate, wherein the plurality of holding members correct positional misalignment of the first substrate relative to the second substrate by preset amounts of correction, and the plurality of holding members include holding members having the amounts of correction that are different from each other. The stacking apparatus may further include a carrying unit that carries a holding member that is selected from among the plurality of holding members and holds the first substrate from a position where the holding member is housed to a position where the first substrate is held.Type: GrantFiled: December 14, 2018Date of Patent: November 3, 2020Assignee: Nikon CorporationInventors: Hajime Mitsuishi, Isao Sugaya, Minoru Fukuda
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Publication number: 20200335472Abstract: A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising a joining section that joins the first substrate and second substrate together aligned to each other for stacking; a detecting section that detects an uneven state on at least one of the first substrate and second substrate prior to joining by the joining section; and a determining section that determines whether the uneven state detected by the detecting section satisfies a predetermined condition, wherein the joining section does not join the first substrate and the second substrate if it is determined by the determining section that the uneven state does not satisfy the predetermined condition.Type: ApplicationFiled: July 1, 2020Publication date: October 22, 2020Applicant: NIKON CORPORATIONInventors: Kazuya OKAMOTO, Isao SUGAYA, Naohiko KURATA, Masashi OKADA, Hajime MITSUISHI
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Publication number: 20200286851Abstract: A manufacturing method is provided, which includes processing at least one of a plurality of substrates; stacking the plurality of substrates to manufacture a stacked substrate; and correcting, in the processing, a part of an amount of positional misalignment that is generated among a plurality of substrates in the stacking and correcting, in the stacking, at least a part of the remainder of the amount of positional misalignment.Type: ApplicationFiled: May 27, 2020Publication date: September 10, 2020Applicant: NIKON CORPORATIONInventors: Hajime Mitsuishi, Isao Sugaya
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Publication number: 20200273836Abstract: A manufacturing method for manufacturing a stacked substrate by bonding two substrates includes: acquiring information about crystal structures of a plurality of substrates; and determining a combination of two substrates to be bonded to each other, based on the information about the crystal structures. In the manufacturing method described above, the information about the crystal structures may include at least one of plane orientations of bonding surfaces and crystal orientations in a direction in parallel with the bonding surfaces. In the manufacturing methods described above, the determining may include determining a combination of the two substrates with a misalignment amount after bonding being equal to or smaller than a predetermined threshold.Type: ApplicationFiled: April 30, 2020Publication date: August 27, 2020Applicant: NIKON CORPORATIONInventors: Isao SUGAYA, Atsushi KAMASHITA, Hajime MITSUISHI, Minoru FUKUDA
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Publication number: 20200091015Abstract: When distortion occurs in substrates before bonding, this distortion dissipates when the hold on the substrate by a holding section is released, and misalignment occurs between the two bonded substrates. Provided is a substrate bonding method for bonding a first substrate held by a first holding section and a second substrate held by a second holding section, by releasing the hold on at least one of the first substrate and the second substrate, the substrate bonding method including determining which of the first substrate and the second substrate is to be released from the hold or continued to be held, based on information concerning distortion of at least one of the first substrate and the second substrate, wherein the information concerning the distortion includes information concerning distortion occurring in a bonding process of the first substrate and the second substrate.Type: ApplicationFiled: November 27, 2019Publication date: March 19, 2020Applicant: NIKON CORPORATIONInventors: Isao SUGAYA, Hajime MITSUISHI