Patents by Inventor Hajime MITSUISHI

Hajime MITSUISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11362059
    Abstract: A manufacturing method for manufacturing a stacked substrate by bonding two substrates includes: acquiring information about crystal structures of a plurality of substrates; and determining a combination of two substrates to be bonded to each other, based on the information about the crystal structures. In the manufacturing method described above, the information about the crystal structures may include at least one of plane orientations of bonding surfaces and crystal orientations in a direction in parallel with the bonding surfaces. In the manufacturing methods described above, the determining may include determining a combination of the two substrates with a misalignment amount after bonding being equal to or smaller than a predetermined threshold.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: June 14, 2022
    Assignee: Nikon Corporation
    Inventors: Isao Sugaya, Atsushi Kamashita, Hajime Mitsuishi, Minoru Fukuda
  • Publication number: 20220148978
    Abstract: A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.
    Type: Application
    Filed: November 18, 2021
    Publication date: May 12, 2022
    Applicant: NIKON CORPORATION
    Inventors: Isao SUGAYA, Kazuya OKAMOTO, Hajime MITSUISHI, Minoru FUKUDA
  • Publication number: 20220084870
    Abstract: A substrate holder includes a central support portion configured to support a central portion of a substrate, and an circumferential support portion arranged on an outside of the central support portion and configured to support a circumferential portion on an outside of the central portion, and the circumferential support portion is configured to support the circumferential portion so that at least a partial region of the circumferential portion is curved toward the substrate holder with a curvature greater than that of the central portion.
    Type: Application
    Filed: November 5, 2021
    Publication date: March 17, 2022
    Applicant: NIKON CORPORATION
    Inventors: Hajime MITSUISHI, Isao SUGAYA, Atsushi KAMASHITA, Masashi OKADA, Minoru FUKUDA, Hidehiro MAEDA
  • Patent number: 11211338
    Abstract: A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: December 28, 2021
    Assignee: Nikon Corporation
    Inventors: Isao Sugaya, Kazuya Okamoto, Hajime Mitsuishi, Minoru Fukuda
  • Publication number: 20210242044
    Abstract: Provided is a substrate bonding apparatus comprising: a first holding unit for holding a first substrate; and a second holding unit for holding a second substrate, wherein the substrate bonding apparatus is configured to bond the first substrate and the second substrate by, after forming a contact region between a part of the first substrate and a part of the second substrate, expanding the contact region to form an initially bonded region and releasing the second substrate having the initially bonded region formed thereon from the second holding unit.
    Type: Application
    Filed: April 20, 2021
    Publication date: August 5, 2021
    Applicant: NIKON CORPORATION
    Inventors: Hajime MITSUISHI, Isao SUGAYA, Masaki TSUNODA, Kazuhiro SUZUKI, Takashi SHIOMI, Minoru FUKUDA
  • Publication number: 20210225651
    Abstract: A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.
    Type: Application
    Filed: April 8, 2021
    Publication date: July 22, 2021
    Applicant: NIKON CORPORATION
    Inventors: Hajime MITSUISHI, Isao SUGAYA, Minoru FUKUDA, Masaki TSUNODA, Hidehiro MAEDA, Ikuhiro KUWANO
  • Publication number: 20210138778
    Abstract: A bonding method including firstly bonding a first substrate to a second substrate by releasing a holding of the first substrate to form a first stack; and secondly bonding one substrate, which has been thinned, among the first substrate and the second substrate that have been bonded, to a third substrate, to form a second stack, wherein when the first substrate is thinned, the holding of the third substrate is released at the second bonding, and when the second substrate is thinned, the holding of the first stack is released at the second bonding.
    Type: Application
    Filed: January 22, 2021
    Publication date: May 13, 2021
    Applicant: NIKON CORPORATION
    Inventors: Yoshihiro MAEHARA, Atsushi KAMASHITA, Hajime MITSUISHI, Minoru FUKUDA
  • Patent number: 11004686
    Abstract: A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: May 11, 2021
    Assignee: NIKON CORPORATION
    Inventors: Hajime Mitsuishi, Isao Sugaya, Minoru Fukuda, Masaki Tsunoda, Hidehiro Maeda, Ikuhiro Kuwano
  • Publication number: 20200381387
    Abstract: An alignment method for aligning two substrates to be stacked, comprising measuring a position of a mark selected from plurality of marks disposed on at least one substrate of the two substrates and aligning the two substrates based on the position of the measured mark, wherein the mark to be measured is selected based on information relating to distortion of the at least one substrate. The mark may be a mark disposed in a region having a smaller distortion amount of the at least one substrate than a threshold. The mark may be a mark disposed in a region having a higher reproducibility of distortion that occurs in the at least one substrate than a threshold.
    Type: Application
    Filed: August 20, 2020
    Publication date: December 3, 2020
    Applicant: NIKON CORPORATION
    Inventors: Hajime MITSUISHI, Minoru FUKUDA, Isao SUGAYA
  • Patent number: 10825707
    Abstract: A stacking apparatus that stacks a first substrate and a second substrate includes: a plurality of holding members that hold the first substrate, wherein the plurality of holding members correct positional misalignment of the first substrate relative to the second substrate by preset amounts of correction, and the plurality of holding members include holding members having the amounts of correction that are different from each other. The stacking apparatus may further include a carrying unit that carries a holding member that is selected from among the plurality of holding members and holds the first substrate from a position where the holding member is housed to a position where the first substrate is held.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: November 3, 2020
    Assignee: Nikon Corporation
    Inventors: Hajime Mitsuishi, Isao Sugaya, Minoru Fukuda
  • Publication number: 20200335472
    Abstract: A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising a joining section that joins the first substrate and second substrate together aligned to each other for stacking; a detecting section that detects an uneven state on at least one of the first substrate and second substrate prior to joining by the joining section; and a determining section that determines whether the uneven state detected by the detecting section satisfies a predetermined condition, wherein the joining section does not join the first substrate and the second substrate if it is determined by the determining section that the uneven state does not satisfy the predetermined condition.
    Type: Application
    Filed: July 1, 2020
    Publication date: October 22, 2020
    Applicant: NIKON CORPORATION
    Inventors: Kazuya OKAMOTO, Isao SUGAYA, Naohiko KURATA, Masashi OKADA, Hajime MITSUISHI
  • Publication number: 20200286851
    Abstract: A manufacturing method is provided, which includes processing at least one of a plurality of substrates; stacking the plurality of substrates to manufacture a stacked substrate; and correcting, in the processing, a part of an amount of positional misalignment that is generated among a plurality of substrates in the stacking and correcting, in the stacking, at least a part of the remainder of the amount of positional misalignment.
    Type: Application
    Filed: May 27, 2020
    Publication date: September 10, 2020
    Applicant: NIKON CORPORATION
    Inventors: Hajime Mitsuishi, Isao Sugaya
  • Publication number: 20200273836
    Abstract: A manufacturing method for manufacturing a stacked substrate by bonding two substrates includes: acquiring information about crystal structures of a plurality of substrates; and determining a combination of two substrates to be bonded to each other, based on the information about the crystal structures. In the manufacturing method described above, the information about the crystal structures may include at least one of plane orientations of bonding surfaces and crystal orientations in a direction in parallel with the bonding surfaces. In the manufacturing methods described above, the determining may include determining a combination of the two substrates with a misalignment amount after bonding being equal to or smaller than a predetermined threshold.
    Type: Application
    Filed: April 30, 2020
    Publication date: August 27, 2020
    Applicant: NIKON CORPORATION
    Inventors: Isao SUGAYA, Atsushi KAMASHITA, Hajime MITSUISHI, Minoru FUKUDA
  • Publication number: 20200091015
    Abstract: When distortion occurs in substrates before bonding, this distortion dissipates when the hold on the substrate by a holding section is released, and misalignment occurs between the two bonded substrates. Provided is a substrate bonding method for bonding a first substrate held by a first holding section and a second substrate held by a second holding section, by releasing the hold on at least one of the first substrate and the second substrate, the substrate bonding method including determining which of the first substrate and the second substrate is to be released from the hold or continued to be held, based on information concerning distortion of at least one of the first substrate and the second substrate, wherein the information concerning the distortion includes information concerning distortion occurring in a bonding process of the first substrate and the second substrate.
    Type: Application
    Filed: November 27, 2019
    Publication date: March 19, 2020
    Applicant: NIKON CORPORATION
    Inventors: Isao SUGAYA, Hajime MITSUISHI
  • Publication number: 20200043860
    Abstract: A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.
    Type: Application
    Filed: October 11, 2019
    Publication date: February 6, 2020
    Applicant: NIKON CORPORATION
    Inventors: Isao SUGAYA, Kazuya OKAMOTO, Hajime MITSUISHI, Minoru FUKUDA
  • Patent number: 10483212
    Abstract: A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: November 19, 2019
    Assignee: Nikon Corporation
    Inventors: Isao Sugaya, Kazuya Okamoto, Hajime Mitsuishi, Minoru Fukuda
  • Patent number: 10424557
    Abstract: A substrate bonding apparatus that brings a part of a surface of a first substrate and a part of a surface of a second substrate into contact to form contact regions at the parts, and then enlarges the contact regions to bond the first substrate and the second substrate includes: a temperature adjusting unit that adjusts a temperature of at least one of the first substrate and the second substrate such that positional misalignment between the first substrate and the second substrate does not exceed a threshold at least in a course of enlargement of the contact regions.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: September 24, 2019
    Assignee: NIKON CORPORATION
    Inventors: Isao Sugaya, Hajime Mitsuishi, Minoru Fukuda
  • Publication number: 20190267238
    Abstract: A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.
    Type: Application
    Filed: May 15, 2019
    Publication date: August 29, 2019
    Applicant: NIKON CORPORATION
    Inventors: Hajime MITSUISHI, lsao SUGAYA, Minoru FUKUDA, Masaki TSUNODA, Hidehiro MAEDA, lkuhiro KUWANO
  • Publication number: 20190148184
    Abstract: A method of manufacturing a stacked substrate by bonding a first substrate and a second substrate, including a step of determining, based on information about curving of each of the first substrate and the second substrate, whether or not the first substrate and the second substrate satisfy a predetermined condition, and, a step of bonding the first substrate and the second substrate if the predetermined condition is satisfied. The stacked substrate manufacturing method described above includes a step of estimating, based on the information, an amount of misalignment which occurs after the first substrate is bonded to the second substrate and the predetermined condition may include that the amount of misalignment is equal to or less than a threshold.
    Type: Application
    Filed: January 10, 2019
    Publication date: May 16, 2019
    Applicant: NIKON CORPORATION
    Inventors: Isao SUGAYA, Hajime Mitsuishi
  • Publication number: 20190122915
    Abstract: A stacking apparatus that stacks a first substrate and a second substrate includes: a plurality of holding members that hold the first substrate, wherein the plurality of holding members correct positional misalignment of the first substrate relative to the second substrate by preset amounts of correction, and the plurality of holding members include holding members having the amounts of correction that are different from each other. The stacking apparatus may further include a carrying unit that carries a holding member that is selected from among the plurality of holding members and holds the first substrate from a position where the holding member is housed to a position where the first substrate is held.
    Type: Application
    Filed: December 14, 2018
    Publication date: April 25, 2019
    Applicant: NIKON CORPORATION
    Inventors: Hajime MITSUISHI, Isao Sugaya, Minoru Fukuda