Abstract: Disclosed herein is an electronic component that includes a substrate, a planarizing layer covering a surface of the substrate, a first conductive layer formed on the planarizing layer and having a lower electrode, a dielectric film made of a material different from that of the planarizing layer and covering the planarizing layer and first conductive layer, an upper electrode laminated on the lower electrode through the dielectric film, and a first insulating layer covering the first conductive layer, dielectric film, and upper electrode. An outer periphery of the first insulating layer directly contacts the planarizing layer without an intervention of the dielectric film.

Abstract: There is provided a resin composition that exhibits excellent heat resistance, heat conductivity, and water absorption. The resin composition comprises a cyanate ester resin (A) represented by formula (I), an epoxy resin (B), and an inorganic filler (C), the content of the inorganic filler (C) being 301 to 700 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B) wherein Rs each independently represent a hydrogen atom or a methyl group; and n is an integer of 1 to 50.

Abstract: A resin composition is provided which can be suitably used in a printed wiring board having high glass transition temperature, high copper foil peel strength, heat resistance in moisture absorption, flame resistance, resistance to soldering heat, low water absorption and high heat dissipation characteristics, and a prepreg using the resin composition, and a laminate as well as a metal foil-clad laminate using the prepreg. There is used a resin composition including an epoxy resin (A), a curing agent (B), a first filler (C), a second filler (D) and a wetting dispersant (E), wherein the first filler (C) is borate particles coated with hexagonal boron nitride.

Abstract: A resin composition is provided which can be suitably used in a printed wiring board having high glass transition temperature, high copper foil peel strength, heat resistance in moisture absorption, flame resistance, resistance to soldering heat, low water absorption and high heat dissipation characteristics, and a prepreg using the resin composition, and a laminate as well as a metal foil-clad laminate using the prepreg. There is used a resin composition including an epoxy resin (A), a curing agent (B), a first filler (C), a second filler (D) and a wetting dispersant (E), wherein the first filler (C) is borate particles coated with hexagonal boron nitride.

Abstract: There is provided a resin composition that exhibits excellent heat resistance, heat conductivity, and water absorption. The resin composition comprises a cyanate ester resin (A) represented by formula (I), an epoxy resin (B), and an inorganic filler (C), the content of the inorganic filler (C) being 301 to 700 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B) wherein Rs each independently represent a hydrogen atom or a methyl group; and n is an integer of 1 to 50.

Abstract: A resin composition that can allow allowing a drying step after impregnation coating of a prepreg and lamination pressing performed at low temperatures in a short time and, at the same time, can maintain storage stability of the prepreg, comprises (A) an imidazole compound represented by formula (I), (B) an epoxy compound, and (C1) a cyanate compound or (C2) a BT resin. R1 and R2 represent an alkyl group, an alkenyl group an alkoxyl group, or a substituted or unsubstituted aromatic substituent; and R3 represents hydrogen, an alkyl group, an alkenyl group, an alkoxy group, a substituted or unsubstituted aromatic substituent, or a halogen group.