Abstract: A cleaning apparatus for a semiconductor substrate includes a belt conveyor, a treatment head that executes cleaning, rinsing and drying treatments, a rinse water supplying mechanism that supplies rinse water adjusted to a predetermined pH value to the treatment head and configured to rinse the substrate applies heat to the rinse water to set a rinse water temperature to 70° or above, and an optical mechanism. The treatment head is configured to rinse the substrate. The optical mechanism is configured to recognize a pattern on the semiconductor substrate so that the semiconductor substrate can be automatically placed on the belt conveyor with a direction of the recognized pattern and a feeding direction of the belt conveyor having a predetermined relationship. The treatment head includes a drying treatment mechanism configured to execute both a drying treatment with use of drying solvent and lamp annealing in execution of drying treatment.

Abstract: A semiconductor substrate cleaning method includes cleaning a semiconductor substrate formed with a line-and-space pattern, supplying rinse water to rinse the substrate, rinsing the substrate, and drying the substrate. The supplying rinse water includes supplying deionized water and hydrochloric acid into a mixing section to mix the deionized water and the hydrochloric acid into a mixture, heating the mixture in the mixing section by a heater, detecting a pH value and a temperature of the mixture by a pH sensor and a temperature sensor respectively, adjusting an amount of hydrochloric acid supplied into the mixing section so that the rinse water has a predetermined pH value indicative of acidity, and energizing or de-energizing the heater so that the temperature of the mixture detected by the temperature sensor reaches a predetermined temperature, thereby producing the rinse water which has a temperature of not less than 70° C. and is acidic.

Abstract: A semiconductor substrate cleaning method includes cleaning a semiconductor substrate formed with a line-and-space pattern, rinsing the substrate, supplying the rinse water to rinse the substrate, and drying the substrate. The rinsing includes supplying deionized water and hydrochloric acid into a mixing section to mix the deionized water and the hydrochloric acid into a mixture, heating the mixture in the mixing section by a heater, detecting a pH value and a temperature of the mixture by a pH sensor and a temperature sensor respectively, adjusting an amount of hydrochloric acid supplied into the mixing section so that the rinse water has a predetermined pH value indicative of acidity, and energizing or de-energizing the heater so that the temperature of the mixture detected by the temperature sensor reaches a predetermined temperature, thereby producing the rinse water which has a temperature of not less than 70° C. and is acidic.

Abstract: A substrate cleaning apparatus, comprises a process tank that holds a mixture containing a hydrogen peroxide solution and sulfuric acid and is used for cleaning a substrate immersed in said mixture; circulation piping that extends between a primary side of said process tank on which said mixture is injected into said process tank and a secondary side of said process tank on which said mixture is discharged from said process tank and has a pump for causing circulation of said mixture; a heater disposed in said circulation piping configured to heat said mixture to a predetermined temperature; a chemical injection pipe configured to inject a hydrogen peroxide solution into said circulation piping at a position between the primary side of said process tank and a secondary side, which is a downstream side, of said heater; and a filter disposed in said circulation piping configured to remove particles in said mixture.

Abstract: A substrate cleaning apparatus, comprises a process tank that holds a mixture containing a hydrogen peroxide solution and sulfuric acid and is used for cleaning a substrate immersed in said mixture; circulation piping that extends between a primary side of said process tank on which said mixture is injected into said process tank and a secondary side of said process tank on which said mixture is discharged from said process tank and has a pump for causing circulation of said mixture; a heater disposed in said circulation piping configured to heat said mixture to a predetermined temperature; a chemical injection pipe configured to inject a hydrogen peroxide solution into said circulation piping at a position between the primary side of said process tank and a secondary side, which is a downstream side, of said heater; and a filter disposed in said circulation piping configured to remove particles in said mixture.

Abstract: A method of cleaning a semiconductor substrate includes cleaning a semiconductor substrate with a cleaning liquid, rinsing the semiconductor substrate with rinse water after the semiconductor substrate has been cleaned, and drying the semiconductor substrate after the semiconductor substrate has been rinsed. A temperature of the rinse water is set to 70° C. or above in the rinsing, and the rinse water is set so as to be acidic.

Abstract: A processing tank stores heated sulfuric acid, and a semiconductor substrate having resist formed thereon and to be processed is immersed in the heated sulfuric acid. A first introduction unit introduces ozone gas into the sulfuric acid stored in the processing tank. A second introduction unit introduces hydrogen peroxide into the solution containing sulfuric acid and ozone at least before the processing of the semiconductor substrate is completed.

Abstract: A substrate cleaning apparatus, comprises a process tank that holds a mixture containing a hydrogen peroxide solution and sulfuric acid and is used for cleaning a substrate immersed in said mixture; circulation piping that extends between a primary side of said process tank on which said mixture is injected into said process tank and a secondary side of said process tank on which said mixture is discharged from said process tank and has a pump for causing circulation of said mixture; a heater disposed in said circulation piping configured to heat said mixture to a predetermined temperature; a chemical injection pipe configured to inject a hydrogen peroxide solution into said circulation piping at a position between the primary side of said process tank and a secondary side, which is a downstream side, of said heater; and a filter disposed in said circulation piping configured to remove particles in said mixture.

Abstract: In a gas meter, a measuring diaphragm is provided inside a measuring chamber, the measuring diaphragm is caused to reciprocate according to a gas pressure of gas flowing from a gas inflow port to the measuring chamber, and the reciprocation of the measuring diaphragm is interlocked with a valve mechanism and an integrating mechanism via a wing shaft and a crank mechanism. Here, the measuring diaphragm is formed in an elliptical shape which is horizontally long in the width direction of the gas meter.

Abstract: In a gas meter, a measuring diaphragm is provided inside a measuring chamber, the measuring diaphragm is caused to reciprocate according to a gas pressure of gas flowing from a gas inflow port to the measuring chamber, and the reciprocation of the measuring diaphragm is interlocked with a valve mechanism and an integrating mechanism via a wing shaft and a crank mechanism. Here, the measuring diaphragm is formed in an elliptical shape which is horizontally long in the width direction of the gas meter.

Abstract: A drying apparatus comprises a drying vessel, a treatment liquid feeder-discharger for feeding pure water into the drying vessel, a vapor supplier for supplying an organic solvent vapor to the space over the pure water, inert gas suppliers for supplying an inert gas with which the organic solvent vapor is diluted, and a heated organic solvent supplier for forming a film of the organic solvent on a liquid level of the pure water. After the wafer is immersed in the pure water, the pure water is gradually discharged from the drying vessel by means of the treatment liquid feeder-discharger. Since the wafer passes through the organic solvent film as it is exposed above the liquid level, the organic solvent of the film adheres to the surface of the wafer, and the organic solvent vapor is condensed on the surface of the wafer that is exposed above the liquid level.

Abstract: A substrate drying apparatus comprises a treatment vessel for containing IPA in the form of liquid, an IPA source for supplying IPA into the treatment vessel, a first heat exchanger which is equipped with a heat exchanger tube dipped in IPA and allowing steam to pass therein, the first heat exchanger allowing the steam and IPA to perform heat exchange therebetween to thereby evaporate IPA, and a second heat exchanger provided on or above an upper portion of the treatment vessel and equipped with a heat exchanger tube for allowing a coolant to pass therein, the second heat exchanger allowing the coolant and the evaporated IPA to perform heat exchange therebetween to thereby condense the evaporated IPA.

Abstract: Synthetic quartz glass powder is produced by (a) hydrolyzing an alkoxysilane to form a gel, (b) finely dividing the gel and then drying, or drying the gel and then finely dividing, and (c) calcining the obtained powder, the powder being maintained under an atmosphere with an oxygen concentration of not less than 30 vol % during at least a part of the calcining period at a temperature of not lower than 1,000.degree. C.

Abstract: An automatic power generation type flowmeter generates a measuring signal through measuring of a flow rate of fluid flowing through a passage and transmits it to a receiver at a remote location. The flowmeter includes a power generator coupled to a detection shaft rotated under an action of a fluid flowing through the passage and outputting an electric signal. The power generator includes a permanent magnet having S- and N-poles, an electromagnetic coil having a core around its axis and arranged adjacent to the magnet with the axis of the coil located in a direction substantially perpendicular to a rotation shaft, a first stator magnetically coupled to the core and having its magnetic induction portion arranged opposite to the N-pole of the magnet, and a second stator magnetically connected to the core and having its magnetic induction portion arranged opposite to the S-pole of the magnet.

Abstract: In a flow meter, a cylindrical member containing therein a vane wheel is fitted in a measuring chamber of a casing so as to be closely in contact with the peripheral wall of the casing, and a cover is put on the cylindrical member. Rectangular inlet and outlet nozzles in a side wall portion of the cylindrical member communicate with inlet and outlet ports of the casing, respectively. A pivot supporting the vane wheel is replaceably attached to a bottom portion of the cylindrical member. A supporting shaft of the vane wheel extends upward through a center opening in the cover to be connected to a measuring mechanism.

Abstract: A flow meter comprises a fan wheel provided in a passage of a running fluid to be rotated thereby; a composite magnetic wire formed of a core and shell and fitted to the fan wheel; a pair of mutually facing permanent magnets arranged substantially in parallel above a plane through which the composite magnetic wire is rotated, with the poles of the opposite polarities set adjacent to each other; a magnetic core wound with a coil and disposed between the paired permanent magnets, and wherein, when the composite wire faces one of the paired permanent magnets, the alignment direction of the respective magnetic domains of the core of the composite magnetic wire is changed, and when the composite wire faces the other of the paired permanent magnets, the respective magnetic domains of the core of the composite magnetic wire regains the alignment direction before said change.

Abstract: In a diaphragm type gas meter, one crank plate pivotally mounting a pair of diaphragm movement transmission levers and the other crank plate pivotally mounting a pair of valve actuating levers overlap each other rockably around the central axis of a crank shaft. The relative angular position of the two plates is controlled e.g. by an eccentric cam. On a diaphragm control wall member for restricting the stroke end of the reciprocation of each measuring diaphragm of said gas meter are formed two inclined diaphragm control surfaces with different angles of inclination. Further, on a lower casing of the gas meter is integrally die-cast a partition wall with triangular section flush with the top surface of the lower casing and defining a discharge-side valve chamber and a discharge passage.

Abstract: In a prepayment fluid feeder, a depressing member forces down a valve driving member through a coin located in a coin interposing space by an operation of a handle. When the driving member is depressed, a valve member is shifted to an open position, and a fluid such as tap water is supplied through a flow pipe. The driving member is locked by a locking mechanism in a position to which the member is depressed. A releasing mechanism acts on the locking mechanism and releases the locking of the driving member when the supply of a predetermined flow quantity is completed with a single coin, and the valve member is returned to the closed position, thereby stopping the supply of the fluid. The releasing mechanism comprises a setting wheel with notches formed on the outer periphery thereof and balls placed in the notches.

Abstract: A flow meter for measuring the consumption of a fluid such as tap water and indicating it digitally at a remote place from the detecting section, having a pulse generator; means for giving intermittent rotation to the rotor of the generator which comprises a cam plate with a dwell portion of the same radius and a plurality of recesses formed at the outer periphery thereof, a driving disc placed coaxially therewith and capable of rotating relatively to the cam plate within a prescribed angle, and an intermittently-driven member provided with a plurality of projections capable of being engaged with said recesses at the outer periphery thereof correspondingly to the cam plate and connected to the rotor shaft of the pulse generator; and a pulse motor capable of operating the indicating wheels by using the pulse voltage from the pulse generator.

Abstract: An electronic integration calorimeter comprises a temperature difference detector for detecting a difference between the temperature of a heat medium flowing into a heat load and the temperature of the heat medium flowing out of the heat load, and a flow pulse generator for generating a flow pulse signal having the number of pulses proportional to the flow of the heat medium. The flow pulse signal of said flow pulse generator is shaped by a pulse shaping circuit into a flow pulse signal having a predetermined pulse width. A temperature difference pulse generator is adapted to generate a temperature difference pulse signal having the number of pulses proportional to the output voltage of the temperature difference detector and to be controlled by the shaped flow pulse signal so as to generate a pulse signal obtained by ANDing together the temperature pulse signal and the flow pulse signal. The ANDed pulse signal is supplied to a counter where pulses included in the pulse signal are counted.