Patents by Inventor Hajime Takagi
Hajime Takagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240126015Abstract: This optical coupler for coupling a plurality of visible light beams having different wavelengths includes: a substrate made of a material different from lithium niobate; and an optical coupling function layer formed on a main surface of the substrate. The optical coupling function layer includes: two multimode-interference-type optical coupling parts; optical-input-side waveguides and an optical-output-side waveguide connected to one multimode-interference-type optical coupling part, and optical-input-side waveguides and an optical-output-side waveguide connected to the other multimode-interference-type optical coupling part. The multimode-interference-type optical coupling parts, the optical-input-side waveguides, and the optical-output-side waveguides are made of a lithium niobate film.Type: ApplicationFiled: October 6, 2023Publication date: April 18, 2024Applicant: TDK CORPORATIONInventors: Hajime UTSUNOMIYA, Yasuhiro TAKAGI, Hiroki HARA, Atsushi SHIMURA, Jiro YOSHINARI, Takashi KIKUKAWA, Tsuyoshi KOMAKI, Hideaki FUKUZAWA
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Publication number: 20240096762Abstract: A first chip on a first lead frame includes a first source electrode on a surface opposite to the first lead frame. A first source terminal is located in a first direction from the first lead frame. A first gate terminal is located in a second direction from the first source terminal. A first conductor contacts the first source electrode and the first source terminal via conductors. A second chip on a second lead frame includes a second source electrode on a surface opposite to the second lead frame. A second gate terminal is located in a second direction from the first gate terminal. A second source terminal is located in the second direction from the second gate terminal. A second conductor contacts the second source electrode and the second source terminal via conductors.Type: ApplicationFiled: February 1, 2023Publication date: March 21, 2024Inventors: Kyo Tanabiki, Yoshihiro Higashikawa, Hajime Takagi
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Publication number: 20230405846Abstract: A cooling device for a robot controller includes a servo driver having a circuit board and a heat generation element. The cooling device includes a fin member which is attached to the heat generation element, a temperature sensor, a heat conductive sheet which transmits heat generated in the heat generation element to the temperature sensor, a fan which generates an air flow toward the fin member, and a fan control part which controls the fan based on a detection value of the temperature sensor. The heat conductive sheet is disposed between the circuit board and the heat generation element in the servo driver and is contacted with both of the circuit board and the heat generation element, and the temperature sensor is provided on the circuit board and is covered by the heat conductive sheet.Type: ApplicationFiled: June 1, 2023Publication date: December 21, 2023Applicant: NIDEC INSTRUMENTS CORPORATIONInventor: Hajime TAKAGI
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Publication number: 20230408302Abstract: A fault detection device is provided which detects a fault having occurred in encoder wiring in a system including a controlled apparatus having an encoder and a controller controlling the controlled apparatus and, in the system, the encoder and the controller are connected with each other through the encoder wiring. In a case that a signal which is transmitted from the encoder to the controller is defined as a first signal, and a signal which is transmitted from the controller to the encoder is defined as a second signal, the fault detection device includes a first detection circuit which detects a fault in the encoder wiring through which the first signal is transmitted, and a second detection circuit which detects a fault in the encoder wiring through which the second signal is transmitted.Type: ApplicationFiled: June 5, 2023Publication date: December 21, 2023Applicant: NIDEC INSTRUMENTS CORPORATIONInventors: Kokyu MUKAI, Hajime Takagi
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Patent number: 10822485Abstract: Described herein is a resin composition capable of giving a liquid-packaging container satisfying both high flexibility and low-temperature impact resistance, excellent in low-temperature heat seal strength an also excellent in bag-breakage strength; a heat sealing agent and a film for liquid-packaging container containing the resin composition; a liquid-packaging container formed of the film for liquid-packaging container; a liquid-packaging container and a liquid discharge member obtained using the resin composition; and a medical container having the liquid-packaging container.Type: GrantFiled: March 16, 2017Date of Patent: November 3, 2020Assignee: KURARAY CO., LTD.Inventors: Yusuke Nojima, Hajime Takagi, Shinya Oshita
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Patent number: 10814748Abstract: A vehicle seat structure including a first seat and a second seat, wherein the first seat includes: a tilting rotation mechanism configured to connect the first seat with respect to a floor in a manner switchable between a sitting position and a raised position; and a pivoting mechanism configured to pivotably connect the first seat to the floor with the tilting rotation mechanism provided therebetween, and wherein the second seat includes a concave portion configured to reduce interference between the second seat and a forefoot of a sitting occupant of the first seat which is being pivoted in the raised position when the second seat and the first seat are in a positional relationship in which the second seat overlaps, in a plan view, with a pivoting trajectory of the forefoot of the sitting occupant of the first seat which is being pivoted in the raised position.Type: GrantFiled: May 22, 2019Date of Patent: October 27, 2020Assignee: TOYOTA BOSHOKU KABUSHIKI KAISHAInventors: Fumitoshi Akaike, Hiroshi Tsuji, Keisuke Toda, Hajime Takagi
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Publication number: 20190359086Abstract: A vehicle seat structure including a first seat and a second seat, wherein the first seat includes: a tilting rotation mechanism configured to connect the first seat with respect to a floor in a manner switchable between a sitting position and a raised position; and a pivoting mechanism configured to pivotably connect the first seat to the floor with the tilting rotation mechanism provided therebetween, and wherein the second seat includes a concave portion configured to reduce interference between the second seat and a forefoot of a sitting occupant of the first seat which is being pivoted in the raised position when the second seat and the first seat are in a positional relationship in which the second seat overlaps, in a plan view, with a pivoting trajectory of the forefoot of the sitting occupant of the first seat which is being pivoted in the raised position.Type: ApplicationFiled: May 22, 2019Publication date: November 28, 2019Applicant: TOYOTA BOSHOKU KABUSHIKI KAISHAInventors: Fumitoshi AKAIKE, Hiroshi TSUJI, Keisuke TODA, Hajime TAKAGI
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Publication number: 20190077947Abstract: Described herein is a resin composition capable of giving a liquid-packaging container satisfying both high flexibility and low-temperature impact resistance, excellent in low-temperature heat seal strength an also excellent in bag-breakage strength; a heat sealing agent and a film for liquid-packaging container containing the resin composition; a liquid-packaging container formed of the film for liquid-packaging container; a liquid-packaging container and a liquid discharge member obtained using the resin composition; and a medical container having the liquid-packaging container.Type: ApplicationFiled: March 16, 2017Publication date: March 14, 2019Applicant: KURARAY CO., LTD.Inventors: Yusuke NOJIMA, Hajime TAKAGI, Shinya OSHITA
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Patent number: 9362192Abstract: According to one embodiment, the connector includes a first portion and a second portion. The first portion is provided on the second surface of the semiconductor chip and bonded to the second electrode. The first portion has a bonding surface, a heat dissipation surface, and a side surface. The bonding surface is bonded to the second electrode of the semiconductor chip. The heat dissipation surface is opposite to the bonding surface and exposed from the resin. The side surface is tilted with respect to the bonding surface and the heat dissipation surface, and covered with the resin. The second portion protrudes from the first portion toward the second leadframe side. The second portion is thinner than the first portion and bonded to the second leadframe.Type: GrantFiled: June 10, 2014Date of Patent: June 7, 2016Assignee: Kabushiki Kaisha ToshibaInventors: Hajime Takagi, Takeshi Miyakawa
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Publication number: 20150214138Abstract: According to one embodiment, the connector includes a first portion and a second portion. The first portion is provided on the second surface of the semiconductor chip and bonded to the second electrode. The first portion has a bonding surface, a heat dissipation surface, and a side surface. The bonding surface is bonded to the second electrode of the semiconductor chip. The heat dissipation surface is opposite to the bonding surface and exposed from the resin. The side surface is tilted with respect to the bonding surface and the heat dissipation surface, and covered with the resin. The second portion protrudes from the first portion toward the second leadframe side. The second portion is thinner than the first portion and bonded to the second leadframe.Type: ApplicationFiled: June 10, 2014Publication date: July 30, 2015Inventors: Hajime Takagi, Takeshi Miyakawa
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Patent number: D450020Type: GrantFiled: September 28, 2000Date of Patent: November 6, 2001Assignee: Bridgestone CorporationInventor: Hajime Takagi