Patents by Inventor Hajime Takeya

Hajime Takeya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190127089
    Abstract: A solar power generator overlies a solar power generator when stowed. A plurality of solar cells of the solar power generator includes first solar cells each having a corner at one end of one side, and second solar cells disposed adjacent to the first solar cells. Each of the second solar cells has a chamfered part at an end, corresponding to the one end, of a side facing the one side. When viewed along thickness direction D3 of a support, a cushioning part of the solar power generator is disposed between the corner of the first solar cell and the chamfered part of the second solar cell and projects more outwardly along the thickness direction D3 of the support than the plurality of solar cells.
    Type: Application
    Filed: May 11, 2016
    Publication date: May 2, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Naoko TOMODA, Hajime TAKEYA, Mitsuru OHKUBO, Shinobu KAWAKATSU, Kazuyoshi SEKI
  • Patent number: 10161810
    Abstract: A honeycomb sandwich structure formed of face skin materials made of fiber reinforced plastics and a honeycomb core has a structure in which an optical fiber sensor structure is embedded in an adhesive layer formed between the face skin materials and the honeycomb core. With this, it is possible to provide a honeycomb sandwich structure and a method of manufacturing the honeycomb sandwich structure that enable precise thermal control to be implemented even when a thermal control device is bonded onto a surface of the honeycomb sandwich structure and enable evaluation of a temperature with high resolution and high accuracy.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: December 25, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazushi Sekine, Hajime Takeya, Hiromi Seko, Yoshikazu Tanaka
  • Patent number: 10099460
    Abstract: A method for producing a preform for manufacture of a fiber-reinforced plastic molding. The method includes: fixing a resin-equipped film rolled out from a roll state including a release film and a fixing resin and containing a partially-cured thermosetting resin, to a surface of the dry fiber fabric rolled out from a roll with the fixing resin interposed therebetween, thereby obtaining a first dry fiber fabric; separately fixing the resin-equipped film to a surface of the dry fiber fabric rolled out from a roll with the fixing resin interposed therebetween, and detaching the release film, thereby obtaining one or more second dry fiber fabrics; and laminating the second dry fiber fabrics on a surface of the first dry fiber fabric with the fixing resin of the second dry fiber fabrics interposed therebetween.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: October 16, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Sohei Samejima, Hajime Takeya, Michihito Matsumoto, Hiroki Kobayashi, Kazuki Kubo, Yuhei Awano, Takahiro Mabuchi
  • Patent number: 9643365
    Abstract: A cover for an air conditioning device for a railway vehicle is a cover for an air conditioning device for a vehicle, which covers an air-conditioner main body. The cover includes a core made of a foamed material having heat insulating property, and a surface member made of a fiber reinforced plastic, which covers entire surfaces of the core. The core is deformed into a curved shape by elastic deformation.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: May 9, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiroki Kobayashi, Shinsuke Okano, Kosuke Umemura, Hajime Takeya, Masami Kume, Sohei Samejima, Michihito Matsumoto
  • Patent number: 9354421
    Abstract: Provided is an advanced grid structure manufactured by a lamination step of laminating a first tape prepreg group, a second tape prepreg group, and a third tape prepreg group repeatedly in the stated order on a forming die, in which grooves (2, 3, 4) in a lattice shape are formed in three directions, so as to provide crossing regions (7, 8, 9) in which two tape prepreg groups overlap each other, and a heating forming step of forming a laminate by heating under pressure. In the lamination step, the first tape prepreg group, the second tape prepreg group, and the third tape prepreg group are respectively laminated as one layer in crossing regions (7, 8, 9) so that a tape width is maintained, and laminated in non-crossing regions (2a, 3a, 4a) in a state of being folded as two layers in a width direction thereof.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: May 31, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kazushi Sekine, Michihito Matsumoto, Masami Kume, Hajime Takeya, Hirotsugu Morinaga
  • Publication number: 20160129676
    Abstract: A fiber reinforced plastic including: a first fiber reinforced plastic layer including a first fiber fabric and a resin impregnated into the first fiber fabric; a resin flow layer including an inner medium and a resin, the resin flow layer being laminated on the first fiber reinforced plastic layer; a second fiber reinforced plastic layer including a second fiber fabric and a resin impregnated into the second fiber fabric, the second fiber reinforced plastic layer being laminated on the resin flow layer so that the resin flow layer is arranged between the first fiber reinforced plastic layer and the second fiber reinforced plastic layer; and an inorganic filler layer including an inorganic filler having a particle diameter of 20 ?m or more and 50 ?m or less and a resin, the inorganic filler layer being laminated on the second fiber reinforced plastic layer.
    Type: Application
    Filed: June 4, 2014
    Publication date: May 12, 2016
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Sohei SAMEJIMA, Hiroki KOBAYASHI, Hajime TAKEYA
  • Publication number: 20160109303
    Abstract: A honeycomb sandwich structure formed of face skin materials made of fiber reinforced plastics and a honeycomb core has a structure in which an optical fiber sensor structure is embedded in an adhesive layer formed between the face skin materials and the honeycomb core. With this, it is possible to provide a honeycomb sandwich structure and a method of manufacturing the honeycomb sandwich structure that enable precise thermal control to be implemented even when a thermal control device is bonded onto a surface of the honeycomb sandwich structure and enable evaluation of a temperature with high resolution and high accuracy.
    Type: Application
    Filed: December 19, 2013
    Publication date: April 21, 2016
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kazushi SEKINE, Hajime TAKEYA, Hiromi SEKO, Yoshikazu TANAKA
  • Patent number: 9244248
    Abstract: Provided is an advanced grid structure manufactured by a lamination step of laminating a first tape prepreg group, a second tape prepreg group, and a third tape prepreg group repeatedly in the stated order on a forming die, in which grooves (2, 3, 4) in a lattice shape are formed in three directions, so as to provide crossing regions (7, 8, 9) in which two tape prepreg groups overlap each other, and a heating forming step of forming a laminate by heating under pressure. In the lamination step, the first tape prepreg group, the second tape prepreg group, and the third tape prepreg group are respectively laminated as one layer in crossing regions (7, 8, 9) so that a tape width is maintained, and laminated in non-crossing regions (2a, 3a, 4a) in a state of being folded as two layers in a width direction thereof.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: January 26, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kazushi Sekine, Michihito Matsumoto, Masami Kume, Hajime Takeya, Hirotsugu Morinaga
  • Patent number: 9144942
    Abstract: The present invention is a method for producing a fiber-reinforced plastic molding including, in the following order, the steps of: forming a preform laminate fixed to a molding die by laminating a plurality of preforms each including a dry fiber fabric and a fixing resin, the preforms being laminated through the fixing resin formed on a surface of the dry fiber fabric and including a partially-cured thermosetting resin exhibiting tackiness at a room temperature; impregnating the dry fiber fabric, provided in the preform laminate fixed to the molding die, with a liquid thermosetting resin; curing the liquid thermosetting resin and the fixing resin to form a fiber-reinforced plastic molding; and demolding the fiber-reinforced plastic molding from the molding die.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: September 29, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Sohei Samejima, Hajime Takeya, Michihito Matsumoto, Kazuki Kubo, Yuhei Awano, Takahiro Mabuchi
  • Publication number: 20150084242
    Abstract: A cover for an air conditioning device for a railway vehicle is a cover for an air conditioning device for a vehicle, which covers an air-conditioner main body. The cover includes a core made of a foamed material having heat insulating property, and a surface member made of a fiber reinforced plastic, which covers entire surfaces of the core. The core is deformed into a curved shape by elastic deformation.
    Type: Application
    Filed: May 14, 2013
    Publication date: March 26, 2015
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiroki Kobayashi, Shinsuke Okano, Kosuke Umemura, Hajime Takeya, Masami Kume, Sohei Samejima, Michihito Matsumoto
  • Patent number: 8935851
    Abstract: A method of manufacturing a circuit board includes: forming a first through hole in a core material; forming a first conductive film on an inner wall of the first through hole; forming an insulating layer on both surfaces of the core material and in the first through hole; forming a second through hole in the insulating layer in the first through hole; forming a second conductive film on an inner wall of the second through hole; and forming, on surfaces of the insulating layers formed on the both surfaces of the core material, a signal circuit layer electrically connected to the second conductive film.
    Type: Grant
    Filed: January 12, 2011
    Date of Patent: January 20, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Sohei Samejima, Hajime Takeya, Hiroyuki Osuga
  • Publication number: 20140261993
    Abstract: A method for producing a preform for manufacture of a fiber-reinforced plastic molding. The method includes: fixing a resin-equipped film rolled out from a roll state including a release film and a fixing resin and containing a partially-cured thermosetting resin, to a surface of the dry fiber fabric rolled out from a roll with the fixing resin interposed therebetween, thereby obtaining a first dry fiber fabric; separately fixing the resin-equipped film to a surface of the dry fiber fabric rolled out from a roll with the fixing resin interposed therebetween, and detaching the release film, thereby obtaining one or more second dry fiber fabrics; and laminating the second dry fiber fabrics on a surface of the first dry fiber fabric with the fixing resin of the second dry fiber fabrics interposed therebetween.
    Type: Application
    Filed: September 6, 2012
    Publication date: September 18, 2014
    Applicant: Mitsubishi Electric Corporation
    Inventors: Sohei Samejima, Hajime Takeya, Michihito Matsumoto, Hiroki Kobayashi, Kazuki Kubo, Yuhei Awano, Takahiro Mabuchi
  • Patent number: 8821670
    Abstract: Provided is an advanced grid structure manufactured by a lamination step of laminating a first tape prepreg group, a second tape prepreg group, and a third tape prepreg group repeatedly in the stated order on a forming die, in which grooves in a lattice shape are formed in three directions, so as to provide crossing regions in which two tape prepreg groups overlap each other, and a heating forming step of forming a laminate by heating under pressure. In the lamination step, the first tape prepreg group, the second tape prepreg group, and the third tape prepreg group are respectively laminated as one layer in crossing regions so that a tape width is maintained, and laminated in non-crossing regions in a state of being folded as two layers in a width direction thereof.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: September 2, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazushi Sekine, Michihito Matsumoto, Masami Kume, Hajime Takeya, Hirotsugu Morinaga
  • Publication number: 20140049814
    Abstract: Provided is an advanced grid structure manufactured by a lamination step of laminating a first tape prepreg group, a second tape prepreg group, and a third tape prepreg group repeatedly in the stated order on a forming die, in which grooves (2, 3, 4) in a lattice shape are formed in three directions, so as to provide crossing regions (7, 8, 9) in which two tape prepreg groups overlap each other, and a heating forming step of forming a laminate by heating under pressure. In the lamination step, the first tape prepreg group, the second tape prepreg group, and the third tape prepreg group are respectively laminated as one layer in crossing regions (7, 8, 9) so that a tape width is maintained, and laminated in non-crossing regions (2a, 3a, 4a) in a state of being folded as two layers in a width direction thereof.
    Type: Application
    Filed: October 30, 2013
    Publication date: February 20, 2014
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kazushi SEKINE, Michihito Matsumoto, Masami Kume, Hajime Takeya, Hirotsugu Morinaga
  • Publication number: 20130177727
    Abstract: The present invention is a method for producing a fiber-reinforced plastic molding including, in the following order, the steps of: forming a preform laminate (5b) fixed to a molding die (6) by laminating a plurality of preforms (5a) each including a dry fiber fabric (4) and a fixing resin (2), the preforms being laminated through the fixing resin (2) formed on a surface of the dry fiber fabric and including a partially-cured thermosetting resin exhibiting tackiness at a room temperature; impregnating the dry fiber fabric (4), provided in the preform laminate (5b) fixed to the molding die (6), with a liquid thermosetting resin (11); curing the liquid thermosetting resin (11) and the fixing resin (2) to form a fiber-reinforced plastic molding; and demolding the fiber-reinforced plastic molding from the molding die (6).
    Type: Application
    Filed: May 12, 2011
    Publication date: July 11, 2013
    Applicant: Mitsubishi Electric Corporation
    Inventors: Sohei Samejima, Hajime Takeya, Michihito Matsumoto, Kazuki Kubo, Yuhei Awano, Takahiro Mabuchi
  • Patent number: 8419196
    Abstract: An optical mirror comprising: a mirror body having a reflective surface; a waffle structure that is connected to a surface opposite to the reflective surface of the mirror body, the waffle structure comprising partition walls, wherein at least one of the partition walls includes a heat generation part; and a power supply part configured to supply power to the heat generation part, wherein the partition walls and the mirror body are made of a same material.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: April 16, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Masami Kume, Hajime Takeya
  • Publication number: 20130033745
    Abstract: Provided is an advanced grid structure manufactured by a lamination step of laminating a first tape prepreg group, a second tape prepreg group, and a third tape prepreg group repeatedly in the stated order on a forming die, in which grooves (2, 3, 4) in a lattice shape are formed in three directions, so as to provide crossing regions (7, 8, 9) in which two tape prepreg groups overlap each other, and a heating forming step of forming a laminate by heating under pressure. In the lamination step, the first tape prepreg group, the second tape prepreg group, and the third tape prepreg group are respectively laminated as one layer in crossing regions (7, 8, 9) so that a tape width is maintained, and laminated in non-crossing regions (2a, 3a, 4a) in a state of being folded as two layers in a width direction thereof.
    Type: Application
    Filed: July 13, 2012
    Publication date: February 7, 2013
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kazushi SEKINE, Michihito MATSUMOTO, Masami KUME, Hajime TAKEYA, Hirotsugu MORINAGA
  • Publication number: 20120279765
    Abstract: A method of manufacturing a circuit board includes: forming a first through hole in a core material; forming a first conductive film on an inner wall of the first through hole; forming an insulating layer on both surfaces of the core material and in the first through hole; forming a second through hole in the insulating layer in the first through hole; forming a second conductive film on an inner wall of the second through hole; and forming, on surfaces of the insulating layers formed on the both surfaces of the core material, a signal circuit layer electrically connected to the second conductive film.
    Type: Application
    Filed: January 12, 2011
    Publication date: November 8, 2012
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Sohei Samejima, Hajime Takeya, Hiroyuki Osuga
  • Patent number: 7993727
    Abstract: An advanced grid structure has high strength and low thermal expansion, and includes first, second, and third tape prepreg groups each including a plurality of tape prepregs. Each tape prepreg includes carbon fibers that are aligned in a first, second, or third direction and that form respective first, second, and third grid sides. A plurality of each the first, second, and third grid sides are spaced apart at equal intervals in the respective first, second, or third direction to form respective first, second, and third grid side groups. A structure ratio of the advanced grid structure is larger than 0 and 0.107 or less, 0.053 or less, or 0.040 or less. A thermal expansion coefficient of the advanced grid structure is ?0.9 ppm/K or more and 0.9 ppm/K or less. The carbon fibers have a tensile modulus of elasticity of 280 GPa or more and 330 GPa or less.
    Type: Grant
    Filed: June 2, 2008
    Date of Patent: August 9, 2011
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazushi Sekine, Hajime Takeya, Tsuyoshi Ozaki, Masami Kume
  • Publication number: 20110128642
    Abstract: An optical mirror comprising: a mirror body having a reflective surface; a waffle structure that is connected to a surface opposite to the reflective surface of the mirror body, the waffle structure comprising partition walls, wherein at least one of the partition walls includes a heat generation part; and a power supply part configured to supply power to the heat generation part, wherein the partition walls and the mirror body are made of a same material.
    Type: Application
    Filed: December 1, 2010
    Publication date: June 2, 2011
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Masami KUME, Hajime Takeya