Abstract: Disclosed are an adhesive agent composition which has high chemical resistance and solvent resistance and is curable at around room temperature, an inkjet head which has good durability and jetting performance even in the case of using solvent ink, and a manufacturing method of the inkjet head. For these characteristics, the adhesive agent composition contains, as an activator, an imidazole derivative in which an alkyl group or a substituted alkyl group is substituted at the 1-postion or at the 1- and 2-positions, and as a base, a compound having three or more epoxy groups.

Abstract: Disclosed are an adhesive agent composition which has high chemical resistance and solvent resistance and is curable at around room temperature, an inkjet head which has good durability and jetting performance even in the case of using solvent ink, and a manufacturing method of the inkjet head. For these characteristics, the adhesive agent composition contains, as an activator, an imidazole derivative in which an alkyl group or a substituted alkyl group is substituted at the 1-postion or at the 1- and 2-positions, and as a base, a compound having three or more epoxy groups.

Abstract: Disclosed is an adhesive agent which is curable and has flexibility at low temperature, and further has resistant to solvent type ink. The adhesive agent includes a base and an activator, wherein the base includes at least any one of: bisphenol F epoxy compound; bisphenol F epoxy compound mixed with an epoxy compound having three or more epoxy groups; and bisphenol A epoxy compound mixed with an epoxy compound having three or more epoxy groups, wherein the activator includes: 100 parts by mass of polyamide composed of a condensation reaction product of C36 unsaturated fatty acid dimer and polyamine; and 5 to 200 parts by mass of alicyclic polyamine, and wherein the base is mixed with the activator with a ratio of 10 to 200 parts by mass of the activator with respect to 100 parts by mass of the base.

Abstract: Disclosed is an adhesive agent which is curable and has flexibility at low temperature, and further has resistant to solvent type ink. The adhesive agent includes a base and an activator, wherein the base includes at least any one of: bisphenol F epoxy compound; bisphenol F epoxy compound mixed with an epoxy compound having three or more epoxy groups; and bisphenol A epoxy compound mixed with an epoxy compound having three or more epoxy groups, wherein the activator includes: 100 parts by mass of polyamide composed of a condensation reaction product of C36 unsaturated fatty acid dimer and polyamine; and 5 to 200 parts by mass of alicyclic polyamine, and wherein the base is mixed with the activator with a ratio of 10 to 200 parts by mass of the activator with respect to 100 parts by mass of the base.

Abstract: Disclosed is an adhesive agent which is curable and has flexibility at low temperature, and further has resistant to solvent type ink. The adhesive agent includes a base and an activator, wherein the base includes at least any one of: bisphenol F epoxy compound; bisphenol F epoxy compound mixed with an epoxy compound having three or more epoxy groups; and bisphenol A epoxy compound mixed with an epoxy compound having three or more epoxy groups, wherein the activator includes: 100 parts by mass of polyamide composed of a condensation reaction product of C36 unsaturated fatty acid dimer and polyamine; and 5 to 200 parts by mass of alicyclic polyamine, and wherein the base is mixed with the activator with a ratio of 10 to 200 parts by mass of the activator with respect to 100 parts by mass of the base.

Abstract: Disclosed are an adhesive agent composition which has high chemical resistance and solvent resistance and is curable at around room temperature, an inkjet head which has good durability and jetting performance even in the case of using solvent ink, and a manufacturing method of the inkjet head. For these characteristics, the adhesive agent composition contains, as an activator, an imidazole derivative in which an alkyl group or a substituted alkyl group is substituted at the 1-postion or at the 1- and 2-positions, and as a base, a compound having three or more epoxy groups.

Abstract: By using a polymeric film having a dielectric loss tangent of 0.002 or less measured at a frequency in the range of 1 kHz to 1 GHz at a temperature of 25 ° C., heat generation of dielectric loss of capacitors can be reduced and rising of temperature can be inhibited, and, can highly stand the rise of temperature, whereby further miniaturization and increase in capacity of capacitors become possible. Furthermore, the problems in handling that the films are apt to cut or become entangled at the rewinding step can be greatly improved by using polymeric films which are 1 or less in friction coefficient between the films of the same material. Accordingly, the polymeric films are excellent in performance of insulator film, namely, small in dielectric loss tangent, and, moreover, are free from the problems in handling that the films are apt to cut or become entangled at the rewinding step. Furthermore, the polymeric films are suitable for film capacitors.

Abstract: A thermoplastic dicyclopentadiene ring-opening polymer obtained by ring-opening polymerization of a monomer component containing a dicyclopentadiene monomer, characterized in that polycyclic rings which are repeating units of the polymer are bonded in cis-position relative to the carbon-carbon double bond of the main chain of the polymer in 50 mol % or more of the repeating units based on the total repeating units and the content of a low-molecular weight component of 2,000 or less in molecular weight is 10% by weight or less based on the total polymer components, and a hydrogenation product obtained by hydrogenating the carbon-carbon unsaturated bond of the thermoplastic dicyclopentadiene ring-opening polymer.

Abstract: An insulator for high frequency connectors which comprises a thermoplastic norbornene resin and has a voltage and standing wave ratio of 1.89 or less even in the high frequency band of 2-3 GHz, and a high frequency connector using the insulator.

Abstract: The present invention relates to a resin composition having a high dielectric constant and a low dielectric loss tangent under high frequency conditions and articles obtained therefrom. The resin composition comprises 100 parts by weight of thermoplastic resin and 50-900 parts by weight of ferroelectric material. The formed articles can be used as substrates for a miniaturized antenna or circuit.

Abstract: A resin composition comprising 100 parts by weight of a thermoplastic resin and 1 to 50 parts by weight of an antistatic composition consisting essentially of 100 parts by weight of carbon fibers having a length of 0.01 to 100 mm and 5 to 70 parts by weight of carbon fibers having a length of 1/2 to 1/100 of the first carbon fibers is molded to obtain a molded article having an even antistatic effect over the surface in which molded article the antistatic agent (carbon fibers) does not bleed to the exterior and the antistatic effect is maintained for a long time.