Abstract: A radio-frequency antenna through which a high amount of current can be efficiently passed even at a radio-frequency level for plasma generation, as well as a plasma processing device utilizing the radio-frequency antenna. A radio-frequency antenna includes a metal fiber sheet. A plasma processing device includes: a vacuum container including a wall having an opening; a radio-frequency antenna including a metal fiber sheet and located at the opening; and a dielectric protection plate located closer to the interior of the vacuum container than the radio-frequency antenna and configured to close the opening in a gas-tight manner. The radio-frequency antenna including a metal fiber sheet has a larger surface area and a lower impedance to a radio-frequency current than a radio-frequency antenna including a metal plate having the same outer shape. Therefore, it allows a radio-frequency current commonly used for plasma generation to be more efficiently passed through in large amounts.

Abstract: The present invention provides a cushion member and a stage member provided with the cushion member, the cushion member including a non-woven fabric formed by binding or entangling metal fibers, wherein when the cushion member is compressed, the cushion member undergoes compressive deformation and the following compressive deformation ratio is 5% to 80%: Compressive deformation ratio=(T0?T1)/T0×100, T0: film thickness of cushion member before application of load, and T1: film thickness of cushion member after application and release of load.

Abstract: The present invention provides a cushion member and a stage member provided with the cushion member, the cushion member including a non-woven fabric formed by binding or entangling metal fibers, wherein when the cushion member is compressed, the cushion member undergoes compressive deformation and the following compressive deformation ratio is 5% to 80%: Compressive deformation ratio=(T0?T1)/T0×100, T0: film thickness of cushion member before application of load, and T1: film thickness of cushion member after application and release of load.

Abstract: Provided is a copper fiber nonwoven fabric having a bonding portion between copper fibers, and in the relationship between compressive stress and strain, is provided with a first region exhibiting plastic deformation and a second region exhibiting elastic deformation in which compressive stress is higher than the first region. Alternatively, the copper fiber nonwoven fabric has a bonding portion between copper fibers, and in the relationship between compressive stress and strain, has a region exhibiting elastic deformation, wherein the region exhibiting elastic deformation has an elastic deformation region before an inflection portion a, the inflection portion a, and an elastic deformation region after the inflection portion a.

Abstract: A clay film composite which exhibits high gas barrier properties even under high humidity conditions is provided. The clay film composite having a clay film including a clay without or with an additive, and provided on at least one surface thereof, a water vapor barrier layer having a water permeability of 1.0 g/m2·day or less. The clay film preferably has a distance between clay particle layers of 1.3 nm or less. The clay film preferably has a water content of 3.0% by mass or less. It is preferable to melt-bond the water vapor barrier layer to the clay film.

Abstract: A clay dispersion, wherein an organically modified clay is dispersed in a polar organic solvent, and the clay dispersion is obtained by: dispersing a swelling clay in a liquid which includes water as a main component; adding organic onium ions to the liquid to cause ion-exchange between the organic onium ions and hydrophilic cations existing on the surface of the swelling clay to obtain an organically modified clay; removing the ion-exchanged hydrophilic cation to obtain the organically modified clay which is in a condition that water exists in the clay; and adding the organically modified clay from which the ion-exchanged hydrophilic cation is removed to an polar organic solvent.

Abstract: A clay film composite which exhibits high gas barrier properties even under high humidity conditions is provided. The clay film composite having a clay film including a clay without or with an additive, and provided on at least one surface thereof, a water vapor barrier layer having a water permeability of 1.0 g/m2·day or less. The clay film preferably has a distance between clay particle layers of 1.3 nm or less. The clay film preferably has a water content of 3.0% by mass or less. It is preferable to melt-bond the water vapor barrier layer to the clay film.

Abstract: An object of the present invention is to provide a clay dispersion liquid which is capable of obtaining a clay film which realizes compatibility between heat resistance and water resistance, and a method for producing the same; a clay film and a transparent material, produced from the lay dispersion. The clay dispersion liquid of the present invention contains a liquid containing water as a main component, and a tetraphenylphosphonium-modified clay. The clay film and the transparent material of the present invention are obtained by applying the clay dispersion liquid on a surface of a supporting body to form a film.

Abstract: A method for producing a clay thin film, which is formed of clay alone or in combination with an additive and has a structure where oriented clay particles are laminated, the method including paste-making in which clay alone or in combination with an additive are dispersed in a dispersion medium formed of water, an organic solvent, or a mixed solvent of water and an organic solvent to prepare clay paste; coating in which a thin film is formed by coating the clay paste on a substrate; planarization in which the thin film is planarized; drying in which water, an organic solvent, or water and an organic solvent are removed from the thin film; and separation in which the thin film is separated from the substrate.

Abstract: To provide a means for achieving sufficient sealing performance even in the case of using a highly heat resistant clay film in a high temperature environment exceeding 600° C., minimizing deterioration thereof caused by structural change even in a high temperature environment exceeding 600° C. in the presence of water, and preventing decline in the function of the product caused by the elution of sodium. A member containing a clay film which contains aligned clay particles in the structure thereof and contains, among the clay particles and/or among clay particle layers, a substance decomposing at temperatures, exceeding 100° C. but not exceeding the temperature allowing the release, as water, of structural hydroxyl groups in the clay particles, wherein the member is to be employed in an environment of equal or higher temperatures than the decomposition temperature of the aforesaid substance.

Abstract: A clay thin film substrate including a clay thin film having a structure, in which oriented clay particles are laminated; and at least a gas barrier inorganic layer which is laminated on at least one surface of the clay thin film.

Abstract: A method for producing a clay thin film, which is formed of clay alone or in combination with an additive and has a structure where oriented clay particles are laminated, the method including paste-making in which clay alone or in combination with an additive are dispersed in a dispersion medium formed of water, an organic solvent, or a mixed solvent of water and an organic solvent to prepare clay paste; coating in which a thin film is formed by coating the clay paste on a substrate; planarization in which the thin film is planarized; drying in which water, an organic solvent, or water and an organic solvent are removed from the thin film; and separation in which the thin film is separated from the substrate.

Abstract: The object of the present invention is to provide a thin film which has excellent heat resistance and water resistance together with excellent flexibility, and a thin film laminate comprising the thin film, and the present invention provides a thin film comprising a heat-resistant fluid between layers comprising heat-resistant flakes.

Abstract: A clay thin film substrate including a clay thin film having a structure, in which oriented clay particles are laminated; and at least a gas barrier inorganic layer which is laminated on at least one surface of the clay thin film.

Abstract: A clay dispersion, wherein an organically modified clay is dispersed in a polar organic solvent, and the clay dispersion is obtained by: dispersing a swelling clay in a liquid which includes water as a main component; adding organic onium ions to the liquid to cause ion-exchange between the organic onium ions and hydrophilic cations existing on the surface of the swelling clay to obtain an organically modified clay; removing the ion-exchanged hydrophilic cation to obtain the organically modified clay which is in a condition that water exists in the clay; and adding the organically modified clay from which the ion-exchanged hydrophilic cation is removed to an polar organic solvent.

Abstract: The invention provides fluororesin fiber paper excellent in adhesion to a copper foil, heat resistance, chemical resistance, low water absorption and electric insulation and capable of being used as a substrate of a printed board suitable for use in high frequency, of which a low dielectric loss is required. The fluororesin fiber paper is a porous sheet obtained by forming a slurry comprising fluororesin fiber into a sheet by a wet paper making method and sintering the resultant sheet and has an average pore diameter of 0.5 to 50 ?m and a maximum pore diameter of at most 250 ?m. A copper-clad laminate for printed board is produced by laminating the fluororesin fiber paper and a copper foil having a ten point mean height of surface roughness profile (Rz) of 0.5 to 8.0 ?m on each other by means of vacuum hot pressing.

Abstract: The method developed herein is for expanding cord blood-derived hematopoietic stem cells to a degree that is sufficiently safe for clinical application, such as the transplantation of hematopoietic stem cells into adult patients. Further, to prepare a number of mesenchymal stem cells or mesenchymal cells that have conventionally been available only in an extremely small number, an immortalizing gene such as that of telomerase is introduced alone into mesenchymal stem cells, mesenchymal cells or the like, so as to induce the differentiation of the expanded mesenchymal stem cells.

Abstract: The invention provides fluororesin fiber paper excellent in adhesion to a copper foil, heat resistance, chemical resistance, low water absorption and electric insulation and capable of being used as a substrate of a printed board suitable for use in high frequency, of which a low dielectric loss is required. The fluororesin fiber paper is a porous sheet obtained by forming a slurry comprising fluororesin fiber into a sheet by a wet paper making method and sintering the resultant sheet and has an average pore diameter of 0.5 to 50 &mgr;m and a maximum pore diameter of at most 250 &mgr;m. A copper-clad laminate for printed board is produced by laminating the fluororesin fiber paper and a copper foil having a ten point mean height of surface roughness profile (Rz) of 0.5 to 8.0 &mgr;m on each other by means of vacuum hot pressing.