Patents by Inventor Hajime Tsuda

Hajime Tsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978284
    Abstract: A preliminary image is captured that includes parts of an authentication target person. Main authentication targets are determined. The main authentication targets are those parts that each have an acceptable image-capturing state. A single image-capturing device can then be controlled to successively capture images of the main authentication parts of the authentication target person that have been determined with different settings. These images of the main authentication parts that have been captured can then be output. For instance, authentication of the target person may be performed using authentication data for each main authentication part, where such authentication is successfully when authentication for all the main authentication parts is successful.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: May 7, 2024
    Assignee: NEC CORPORATION
    Inventors: Shunsuke Tsuda, Hajime Hagimori, Daiki Tanaka, Masaya Tokunaga, Jianquan Liu
  • Publication number: 20210327683
    Abstract: A radio-frequency antenna through which a high amount of current can be efficiently passed even at a radio-frequency level for plasma generation, as well as a plasma processing device utilizing the radio-frequency antenna. A radio-frequency antenna includes a metal fiber sheet. A plasma processing device includes: a vacuum container including a wall having an opening; a radio-frequency antenna including a metal fiber sheet and located at the opening; and a dielectric protection plate located closer to the interior of the vacuum container than the radio-frequency antenna and configured to close the opening in a gas-tight manner. The radio-frequency antenna including a metal fiber sheet has a larger surface area and a lower impedance to a radio-frequency current than a radio-frequency antenna including a metal plate having the same outer shape. Therefore, it allows a radio-frequency current commonly used for plasma generation to be more efficiently passed through in large amounts.
    Type: Application
    Filed: April 16, 2021
    Publication date: October 21, 2021
    Applicants: EMD CORPORATION, TOMOEGAWA CO., LTD.
    Inventors: Akinori EBE, Hajime TSUDA, Hideki MORIUCHI
  • Patent number: 10988876
    Abstract: The present invention provides a cushion member and a stage member provided with the cushion member, the cushion member including a non-woven fabric formed by binding or entangling metal fibers, wherein when the cushion member is compressed, the cushion member undergoes compressive deformation and the following compressive deformation ratio is 5% to 80%: Compressive deformation ratio=(T0?T1)/T0×100, T0: film thickness of cushion member before application of load, and T1: film thickness of cushion member after application and release of load.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: April 27, 2021
    Assignee: Tomoegawa Co., Ltd
    Inventors: Katsuya Okumura, Hajime Tsuda
  • Publication number: 20200063302
    Abstract: The present invention provides a cushion member and a stage member provided with the cushion member, the cushion member including a non-woven fabric formed by binding or entangling metal fibers, wherein when the cushion member is compressed, the cushion member undergoes compressive deformation and the following compressive deformation ratio is 5% to 80%: Compressive deformation ratio=(T0?T1)/T0×100, T0: film thickness of cushion member before application of load, and T1: film thickness of cushion member after application and release of load.
    Type: Application
    Filed: January 10, 2018
    Publication date: February 27, 2020
    Inventors: Katsuya Okumura, Hajime Tsuda
  • Publication number: 20190257014
    Abstract: Provided is a copper fiber nonwoven fabric having a bonding portion between copper fibers, and in the relationship between compressive stress and strain, is provided with a first region exhibiting plastic deformation and a second region exhibiting elastic deformation in which compressive stress is higher than the first region. Alternatively, the copper fiber nonwoven fabric has a bonding portion between copper fibers, and in the relationship between compressive stress and strain, has a region exhibiting elastic deformation, wherein the region exhibiting elastic deformation has an elastic deformation region before an inflection portion a, the inflection portion a, and an elastic deformation region after the inflection portion a.
    Type: Application
    Filed: September 22, 2017
    Publication date: August 22, 2019
    Inventors: Katsuya Okumura, Minoru Tsuchida, Hajime Tsuda, Daisuke Muramatsu
  • Publication number: 20140158277
    Abstract: A clay film composite which exhibits high gas barrier properties even under high humidity conditions is provided. The clay film composite having a clay film including a clay without or with an additive, and provided on at least one surface thereof, a water vapor barrier layer having a water permeability of 1.0 g/m2·day or less. The clay film preferably has a distance between clay particle layers of 1.3 nm or less. The clay film preferably has a water content of 3.0% by mass or less. It is preferable to melt-bond the water vapor barrier layer to the clay film.
    Type: Application
    Filed: January 13, 2014
    Publication date: June 12, 2014
    Applicant: Tomoegawa Co., Ltd.
    Inventors: Hajime TSUDA, Katsumi MOTEGI
  • Publication number: 20130253214
    Abstract: A clay dispersion, wherein an organically modified clay is dispersed in a polar organic solvent, and the clay dispersion is obtained by: dispersing a swelling clay in a liquid which includes water as a main component; adding organic onium ions to the liquid to cause ion-exchange between the organic onium ions and hydrophilic cations existing on the surface of the swelling clay to obtain an organically modified clay; removing the ion-exchanged hydrophilic cation to obtain the organically modified clay which is in a condition that water exists in the clay; and adding the organically modified clay from which the ion-exchanged hydrophilic cation is removed to an polar organic solvent.
    Type: Application
    Filed: May 17, 2013
    Publication date: September 26, 2013
    Inventors: Tomohito Inoue, Katsumi Motegi, Hajime Tsuda
  • Publication number: 20120308761
    Abstract: A clay film composite which exhibits high gas barrier properties even under high humidity conditions is provided. The clay film composite having a clay film including a clay without or with an additive, and provided on at least one surface thereof, a water vapor barrier layer having a water permeability of 1.0 g/m2·day or less. The clay film preferably has a distance between clay particle layers of 1.3 nm or less. The clay film preferably has a water content of 3.0% by mass or less. It is preferable to melt-bond the water vapor barrier layer to the clay film.
    Type: Application
    Filed: December 24, 2010
    Publication date: December 6, 2012
    Inventors: Hajime Tsuda, Katsumi Motegi
  • Publication number: 20120145038
    Abstract: An object of the present invention is to provide a clay dispersion liquid which is capable of obtaining a clay film which realizes compatibility between heat resistance and water resistance, and a method for producing the same; a clay film and a transparent material, produced from the lay dispersion. The clay dispersion liquid of the present invention contains a liquid containing water as a main component, and a tetraphenylphosphonium-modified clay. The clay film and the transparent material of the present invention are obtained by applying the clay dispersion liquid on a surface of a supporting body to form a film.
    Type: Application
    Filed: August 24, 2010
    Publication date: June 14, 2012
    Applicant: Tomoegawa Co., Ltd.
    Inventors: Hajime Tsuda, Katsumi Motegi, Yusuke Takechi, Kazunori Kawasaki, Takeo Ebina, Fujio Mizukami
  • Patent number: 8197741
    Abstract: A method for producing a clay thin film, which is formed of clay alone or in combination with an additive and has a structure where oriented clay particles are laminated, the method including paste-making in which clay alone or in combination with an additive are dispersed in a dispersion medium formed of water, an organic solvent, or a mixed solvent of water and an organic solvent to prepare clay paste; coating in which a thin film is formed by coating the clay paste on a substrate; planarization in which the thin film is planarized; drying in which water, an organic solvent, or water and an organic solvent are removed from the thin film; and separation in which the thin film is separated from the substrate.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: June 12, 2012
    Assignee: Tomoegawa Co., Ltd.
    Inventors: Hajime Tsuda, Tomohito Inoue, Katsumi Motegi, Takeo Ebina, Fujio Mizukami
  • Publication number: 20120091668
    Abstract: To provide a means for achieving sufficient sealing performance even in the case of using a highly heat resistant clay film in a high temperature environment exceeding 600° C., minimizing deterioration thereof caused by structural change even in a high temperature environment exceeding 600° C. in the presence of water, and preventing decline in the function of the product caused by the elution of sodium. A member containing a clay film which contains aligned clay particles in the structure thereof and contains, among the clay particles and/or among clay particle layers, a substance decomposing at temperatures, exceeding 100° C. but not exceeding the temperature allowing the release, as water, of structural hydroxyl groups in the clay particles, wherein the member is to be employed in an environment of equal or higher temperatures than the decomposition temperature of the aforesaid substance.
    Type: Application
    Filed: June 4, 2010
    Publication date: April 19, 2012
    Applicant: Tomoegawa Co., Ltd.
    Inventors: Katsumi Motegi, Hajime Tsuda, Yusuke Takechi
  • Patent number: 7898636
    Abstract: A clay thin film substrate including a clay thin film having a structure, in which oriented clay particles are laminated; and at least a gas barrier inorganic layer which is laminated on at least one surface of the clay thin film.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: March 1, 2011
    Assignees: Tomoegawa Co., Ltd., National Institute of Advanced Science and Technology
    Inventors: Tomohito Inoue, Hajime Tsuda, Katsumi Motegi, Takeo Ebina, Fujio Mizukami
  • Publication number: 20090239037
    Abstract: A method for producing a clay thin film, which is formed of clay alone or in combination with an additive and has a structure where oriented clay particles are laminated, the method including paste-making in which clay alone or in combination with an additive are dispersed in a dispersion medium formed of water, an organic solvent, or a mixed solvent of water and an organic solvent to prepare clay paste; coating in which a thin film is formed by coating the clay paste on a substrate; planarization in which the thin film is planarized; drying in which water, an organic solvent, or water and an organic solvent are removed from the thin film; and separation in which the thin film is separated from the substrate.
    Type: Application
    Filed: September 19, 2006
    Publication date: September 24, 2009
    Applicants: TOMOEGAWA CO., LTD., National Institute of Advanced Industrial Science and Technology
    Inventors: Hajime Tsuda, Tomohito Inoue, Katsumi Motegi, Takeo Ebina, Fujio Mizukami
  • Publication number: 20090233083
    Abstract: The object of the present invention is to provide a thin film which has excellent heat resistance and water resistance together with excellent flexibility, and a thin film laminate comprising the thin film, and the present invention provides a thin film comprising a heat-resistant fluid between layers comprising heat-resistant flakes.
    Type: Application
    Filed: March 29, 2007
    Publication date: September 17, 2009
    Applicant: TOMOEGAWA CO., LTD.
    Inventors: Tomohito Inoue, Katsumi Motegi, Hajime Tsuda
  • Publication number: 20090141230
    Abstract: A clay thin film substrate including a clay thin film having a structure, in which oriented clay particles are laminated; and at least a gas barrier inorganic layer which is laminated on at least one surface of the clay thin film.
    Type: Application
    Filed: September 19, 2006
    Publication date: June 4, 2009
    Applicants: TOMOEGAWA CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE
    Inventors: Tomohito Inoue, Hajime Tsuda, Katsumi Motegi, Takeo Ebina, Fujio Mizukami
  • Publication number: 20090120326
    Abstract: A clay dispersion, wherein an organically modified clay is dispersed in a polar organic solvent, and the clay dispersion is obtained by: dispersing a swelling clay in a liquid which includes water as a main component; adding organic onium ions to the liquid to cause ion-exchange between the organic onium ions and hydrophilic cations existing on the surface of the swelling clay to obtain an organically modified clay; removing the ion-exchanged hydrophilic cation to obtain the organically modified clay which is in a condition that water exists in the clay; and adding the organically modified clay from which the ion-exchanged hydrophilic cation is removed to an polar organic solvent.
    Type: Application
    Filed: November 13, 2008
    Publication date: May 14, 2009
    Applicant: TOMOEGAWA CO., LTD.
    Inventors: Tomohito Inoue, Katsumi Motegi, Hajime Tsuda
  • Patent number: 6942756
    Abstract: The invention provides fluororesin fiber paper excellent in adhesion to a copper foil, heat resistance, chemical resistance, low water absorption and electric insulation and capable of being used as a substrate of a printed board suitable for use in high frequency, of which a low dielectric loss is required. The fluororesin fiber paper is a porous sheet obtained by forming a slurry comprising fluororesin fiber into a sheet by a wet paper making method and sintering the resultant sheet and has an average pore diameter of 0.5 to 50 ?m and a maximum pore diameter of at most 250 ?m. A copper-clad laminate for printed board is produced by laminating the fluororesin fiber paper and a copper foil having a ten point mean height of surface roughness profile (Rz) of 0.5 to 8.0 ?m on each other by means of vacuum hot pressing.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: September 13, 2005
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Takanori Suzuki, Hajime Tsuda
  • Publication number: 20050084959
    Abstract: The method developed herein is for expanding cord blood-derived hematopoietic stem cells to a degree that is sufficiently safe for clinical application, such as the transplantation of hematopoietic stem cells into adult patients. Further, to prepare a number of mesenchymal stem cells or mesenchymal cells that have conventionally been available only in an extremely small number, an immortalizing gene such as that of telomerase is introduced alone into mesenchymal stem cells, mesenchymal cells or the like, so as to induce the differentiation of the expanded mesenchymal stem cells.
    Type: Application
    Filed: October 31, 2002
    Publication date: April 21, 2005
    Inventors: Hirofumi Hamada, Yutaka Kawano, Kiminori Nakamura, Masayoshi Kobune, Osamu Honmou, Atsushi Tanooka, Shin-ichi Oka, Katsunori Sasaki, Hajime Tsuda, Yoshinori Ito, Junji Kato, Takuya Matsunaga, Yoshiro Niitsu
  • Publication number: 20030024666
    Abstract: The invention provides fluororesin fiber paper excellent in adhesion to a copper foil, heat resistance, chemical resistance, low water absorption and electric insulation and capable of being used as a substrate of a printed board suitable for use in high frequency, of which a low dielectric loss is required. The fluororesin fiber paper is a porous sheet obtained by forming a slurry comprising fluororesin fiber into a sheet by a wet paper making method and sintering the resultant sheet and has an average pore diameter of 0.5 to 50 &mgr;m and a maximum pore diameter of at most 250 &mgr;m. A copper-clad laminate for printed board is produced by laminating the fluororesin fiber paper and a copper foil having a ten point mean height of surface roughness profile (Rz) of 0.5 to 8.0 &mgr;m on each other by means of vacuum hot pressing.
    Type: Application
    Filed: July 31, 2002
    Publication date: February 6, 2003
    Applicant: TOMOEGAWA PAPER CO., LTD.
    Inventors: Takanori Suzuki, Hajime Tsuda