Patents by Inventor Hajime TSUGENO

Hajime TSUGENO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9537026
    Abstract: A method for manufacturing a solar-power-generator substrate by cutting out a semiconductor substrate by slicing a semiconductor ingot and then by forming a texture structure on a surface of the semiconductor substrate by performing a surface treatment on the surface of the semiconductor substrate, includes: cleaning including cleaning and removing an organic impurity and a metal impurity adhering to the surface of the semiconductor substrate with a cleaning fluid containing an oxidizing chemical; and etching including removing a damaged layer on a substrate surface generated by the slicing and forming the texture structure on the surface of the semiconductor substrate by performing anisotropic etching on the surface of the semiconductor substrate with an alkaline aqueous solution, the etching being performed subsequent to the cleaning.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: January 3, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hajime Tsugeno, Mitsuhiro Nonogaki, Junji Kobayashi, Yusuke Oshiro, Takahiro Kawasaki, Shoichi Karakida
  • Publication number: 20160118512
    Abstract: A method for manufacturing a solar-power-generator substrate by cutting out a semiconductor substrate by slicing a semiconductor ingot and then by forming a texture structure on a surface of the semiconductor substrate by performing a surface treatment on the surface of the semiconductor substrate, includes: cleaning including cleaning and removing an organic impurity and a metal impurity adhering to the surface of the semiconductor substrate with a cleaning fluid containing an oxidizing chemical; and etching including removing a damaged layer on a substrate surface generated by the slicing and forming the texture structure on the surface of the semiconductor substrate by performing anisotropic etching on the surface of the semiconductor substrate with an alkaline aqueous solution, the etching being performed subsequent to the cleaning.
    Type: Application
    Filed: June 12, 2014
    Publication date: April 28, 2016
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hajime TSUGENO, Mitsuhiro NONOGAKI, Junji KOBAYASHI, Yusuke OSHIRO, Takahiro KAWASAKI, Shoichi KARAKIDA