Patents by Inventor Hajime TSUKUI

Hajime TSUKUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10791650
    Abstract: A cooling device includes a heat receiver that receives heat of an electronic component via a coolant, a heat discharger that discharges heat of the coolant from the heat receiver, and a circulation flow path through which the coolant flows from the heat receiver to the heat discharger and the coolant flows from the heat discharger to the heat receiver. The heat receiver is provided with an attachment surface to which a plurality of the electronic components are attached, a first flow path that communicates with the circulation flow path, and a plurality of surface area increasing members that communicate with the first flow path and that are provided on a rear surface of the attachment surface corresponding to the plurality of electronic components.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: September 29, 2020
    Assignees: KEIHIN CORPORATION, TOHOKU UNIVERSITY
    Inventors: Hajime Tsukui, Yusuke Nishimura, Takuya Ouchi, Shigenao Maruyama, Atsuki Komiya, Junnosuke Okajima
  • Publication number: 20190307021
    Abstract: A cooling device includes a heat receiver that receives heat of an electronic component via a coolant, a heat discharger that discharges heat of the coolant from the heat receiver, and a circulation flow path through which the coolant flows from the heat receiver to the heat discharger and the coolant flows from the heat discharger to the heat receiver. The heat receiver is provided with an attachment surface to which a plurality of the electronic components are attached, a first flow path that communicates with the circulation flow path, and a plurality of surface area increasing members that communicate with the first flow path and that are provided on a rear surface of the attachment surface corresponding to the plurality of electronic components.
    Type: Application
    Filed: March 26, 2019
    Publication date: October 3, 2019
    Inventors: Hajime TSUKUI, Yusuke NISHIMURA, Takuya OUCHI, Shigenao MARUYAMA, Atsuki KOMIYA, Junnosuke OKAJIMA