Patents by Inventor Hajime Yamazaki

Hajime Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive of epoxy resin, CTBN and maleimide
    Patent number: 5292812
    Abstract: Adhesive compositions of a selected class of epoxy resins combined with a selected class of carboxylic group-containing acrylonitrile-butadiene and methacrylonitrile-butadiene copolymers, maleimide derivatives and an imidazole compound. The resultant compositions are electrically insulative, thermally resistant, highly capable of fabrication at low pressure and storage stable.
    Type: Grant
    Filed: March 17, 1993
    Date of Patent: March 8, 1994
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Hajime Yamazaki, Hiroyuki Wakamatsu, Toshinobu Takahashi, Naoya Adachi
  • Process for producing printed wiring boards
    Patent number: 5153987
    Abstract: By using a composite film comprising an additive layer and an insulating layer containing an epoxy resin and a synthetic rubber as major components, printed wiring boards having a higher circuit density and higher reliability can be produced simply and effectively.
    Type: Grant
    Filed: April 10, 1989
    Date of Patent: October 13, 1992
    Assignees: Hitachi Chemical Company, Ltd., Hitachi, Condenser Co., Ltd., Yokohama Rubber Company Limited
    Inventors: Hiroshi Takahashi, Shin Takanezawa, Masao Kanno, Toshiro Okamura, Naoki Fukutomi, Hiroyoshi Yokoyama, Hideo Watanabe, Hajime Yamazaki, Hiroyuki Wakamatsu, Toshinobu Takahashi
  • Printed wiring board
    Patent number: 4985294
    Abstract: Composite films for use in printed wiring boards are comprised of an insulating layer and a copper foil laminated thereover, the insulating layer being made up predominantly of a selected epoxy resin and a selected acrylonitrile-butadiene rubber, whereby voidlessness, thickness uniformity and insulation adjustment are enhanced. Also disclosed is a method of producing a printed wiring board using the film by a subtractive process.
    Type: Grant
    Filed: August 24, 1989
    Date of Patent: January 15, 1991
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Hideo Watanabe, Hajime Yamazaki, Hiroyuki Wakamatsu
  • Microwave-absorptive composite
    Patent number: 4960633
    Abstract: A microwave absorptive composite suitable for use in ships, aircrafts and the like comprises an outermost layer of a thermosetting resin-impregnated, fibrous sheet; an intermediate layer of a normally liquid, carbonblack-containing silicone rubber sheet; and an innermost layer of a reinforced thermosetting resin sheet, the three layers being integrally laminated in that order. The silicone rubber is curable at room temperature or with heat.
    Type: Grant
    Filed: April 20, 1987
    Date of Patent: October 2, 1990
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Misao Hiza, Hajime Yamazaki, Kazuhiro Sugihara, Tetsu So
  • Multi-layered microwave absorber and method of manufacturing the same
    Patent number: 4923736
    Abstract: A multi-layered microwave absorber suitable for use in ships, aircrafts and the like comprises a plurality of layers differing in impedance which are bonded together into an integral sheet structure by a silicone-type adhesive compound applied to a coat thickness of less than 0.1 mm. The absorber is capable of wave absorption over a wide band, free from deformation or distortion, and highly heat-resistant and weather-proof. A method of manufacturing the multi-layered microwave absorber is also disclosed.
    Type: Grant
    Filed: April 20, 1987
    Date of Patent: May 8, 1990
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Misao Hiza, Hajime Yamazaki, Kazuhiro Sugihara, Tetsu So
  • Adhesive compositions
    Patent number: 4654382
    Abstract: An adhesive composition comprising, by weight, (1) 100 parts of triglycidyl ether of trisphenol, (2) 0-40 parts of a polyfunctional epoxy resin, (3) a diamine type curing agent selected from (a) an aromatic diamine compound and (b) a reaction product having an amino group at each terminal thereof, prepared by reacting together an aromatic diamine compound, divinylsilane compound and bismaleimide compound, and, if desired, (4) a powdery inorganic filler.
    Type: Grant
    Filed: May 24, 1985
    Date of Patent: March 31, 1987
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Misao Hiza, Hajime Yamazaki, Shigeo Omote
  • Method for the pretreatment of a substrate for ion implantation
    Patent number: 4636280
    Abstract: An IC wafer with a uniform distribution of impurities is obtained by a pretreatment comprising annealing a semiconductor substrate at a high temperature for a long period of time and then cooling rapidly before IC processing.
    Type: Grant
    Filed: August 21, 1984
    Date of Patent: January 13, 1987
    Assignees: Sumitomo Electric Ind., Ltd., Nippon Telegraph & Telephone Public Corp.
    Inventors: Ryusuke Nakai, Toshihiko Takebe, Hajime Yamazaki
  • Epoxy resin composition
    Patent number: 4632970
    Abstract: An epoxy resin composition comprising:(a) a urethane modified epoxy resin obtained by reacting a compound having both epoxy and hydroxy groups with a urethane bond containing compound having an isocyanate group at the end thereof, which is obtained from (i) an organopolysiloxane compound having a molecular weight of 500 to 10000 and having at least two hydroxy groups per one molecule in the main chain or side chain thereof and (ii) a polyisocyanate compound; and(b) an active organic curing agent.
    Type: Grant
    Filed: December 2, 1985
    Date of Patent: December 30, 1986
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Misao Hiza, Hajime Yamazaki, Shigeo Omote