Patents by Inventor Hajime Yazu
Hajime Yazu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8536696Abstract: A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure.Type: GrantFiled: August 25, 2009Date of Patent: September 17, 2013Assignee: Ibiden Co., Ltd.Inventors: Naohiro Hirose, Hitoshi Ito, Yoshiyuki Iwata, Masanori Kawade, Hajime Yazu
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Patent number: 8110917Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.Type: GrantFiled: October 19, 2009Date of Patent: February 7, 2012Assignee: IBIDEN Co., Ltd.Inventors: Naohiro Hirose, Hitoshi Ito, Yoshiyuki Iwata, Masanori Kawade, Hajime Yazu
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Patent number: 8035214Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.Type: GrantFiled: November 17, 1999Date of Patent: October 11, 2011Assignee: IBIDEN Co., Ltd.Inventors: Naohiro Hirose, Hitoshi Ito, Yoshiyuki Iwata, Masanori Kawade, Hajime Yazu
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Patent number: 7902659Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.Type: GrantFiled: January 26, 2009Date of Patent: March 8, 2011Assignee: Ibiden Co., Ltd.Inventors: Naohiro Hirose, Hitoshi Ito, Yoshiyuki Iwata, Masanori Kawade, Hajime Yazu
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Patent number: 7847393Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.Type: GrantFiled: October 24, 2008Date of Patent: December 7, 2010Assignee: IBIDEN Co., Ltd.Inventors: Naohiro Hirose, Hitoshi Ito, Yoshiyuki Iwata, Masanori Kawade, Hajime Yazu
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Publication number: 20100032200Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.Type: ApplicationFiled: October 19, 2009Publication date: February 11, 2010Applicant: IBIDEN CO., LTD.Inventors: Naohiro HIROSE, Hitoshi Ito, Yoshiyuki Iwata, Masanori Kawade, Hajime Yazu
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Publication number: 20090314537Abstract: A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure.Type: ApplicationFiled: August 25, 2009Publication date: December 24, 2009Applicant: IBIDEN CO., LTD.Inventors: Naohiro HIROSE, Hitoshi ITO, Yoshiyuki IWATA, Masanori KAWADE, Hajime YAZU
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Publication number: 20090154131Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.Type: ApplicationFiled: January 26, 2009Publication date: June 18, 2009Applicant: IBIDEN CO., LTD.Inventors: Naohiro HIROSE, Hitoshi ITO, Yoshiyuki IWATA, Masanori KAWADE, Hajime YAZU
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Publication number: 20090053459Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.Type: ApplicationFiled: October 24, 2008Publication date: February 26, 2009Applicant: IBIDEN CO., LTD.Inventors: Naohiro Hirose, Hitoshi Ito, Yoshiyuki Iwata, Masanori Kawade, Hajime Yazu
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Patent number: 5124884Abstract: An electronic component mounting board includes a substrate having an electronic component mounting opening formed in an upper surface thereof and a recess provided on a rear surface thereof larger in size than the electronic component mounting opening; a heat radiating plate fixed to the recess by bonding material with a position of an upper surface of that heat radiating plate exposed to the electronic component mounting opening; an exposed depression extending over the substrate and the heat radiating plate at a position where a side wall of the recess and a side wall of the heat radiating plate confront each other and having a part of the bonding material exposed flush with a bottom surface thereof; and a metal plating layer continuously covering in sequence a lower surface of the heat radiating plate, a surface of the exposed depression and a rear surface of the substrate. A method of manufacturing the aforesaid electronic component mounting board is also set forth.Type: GrantFiled: November 9, 1990Date of Patent: June 23, 1992Assignee: Ibiden Co., Ltd.Inventors: Hajime Yazu, Takao Iriyama