Patents by Inventor Hajime Yuyama

Hajime Yuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120061623
    Abstract: Waterborne conductive compositions contain acid-stabilized aqueous polymer emulsions and metal flakes or particles. Applications of these waterborne conductive compositions include their use as printable inks for electrical circuits, for example, in intelligent and active packaging, sensors, and RFID antennae.
    Type: Application
    Filed: June 16, 2009
    Publication date: March 15, 2012
    Inventors: Paul B. Foreman, Paul Morganelli, Hajime Yuyama, Adrianus Peter Van Veen
  • Patent number: 5059479
    Abstract: A pressure-sensitive adhesive emulsion composition, characterized in that it is a pressure-sensitive adhesive emulsion composition containing the ingredients (A) and (B) below; the content of ingredient (B) is set at 1-70 solid parts per 100 solid parts by weight of the emulsion composition.(A) A polymer derived from at least one compound selected from a group including alkyl acrylates, alkyl methacrylates, and vinyl compounds, and having a glass transition temperature in the range of -60.degree. C. to -30.degree. C.(B) A bituminous emulsifier with an average particle diameter of the emulsified particles of 0.5-3.0 .mu.m.
    Type: Grant
    Filed: December 29, 1989
    Date of Patent: October 22, 1991
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Hajime Yuyama, Fumio Maekawa, Kazuo Umekage