Patents by Inventor Hajoong YUN

Hajoong YUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240008232
    Abstract: An electronic device includes a first housing; a second housing slidable into and out of the first housing; a sliding plate configured to be at least partially slid within the second housing; a flexible display including a display area that is variable as the second housing slides into and out of the first housing; a printed circuit board in an inner space of the first housing; a first shaft; and a thermal diffusion member including a first end, disposed on the at least one electronic component and partially wound, and a second end coupled to the first shaft, and the thermal diffusion member is configured such that at least a portion of the thermal diffusion member spreads out in an inner space of the second housing as a sliding-out operation is performed by the second housing with respect to the first housing.
    Type: Application
    Filed: September 19, 2023
    Publication date: January 4, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hajoong YUN, Yoonsun Park, Seunghoon Kang, Kyungha Koo, Hongki Moon, Jongkil Park, Yongjae Song
  • Patent number: 11520387
    Abstract: An electronic device and method of operating an electronic device are provided. The electronic device includes a temperature measurement unit configured to measure a temperature of each of multiple components of the electronic device, and a controller configured to change, based on a first reference temperature, an operating frequency of the controller to a first operating frequency when a temperature of the controller, measured by the temperature measurement unit, reaches the first reference temperature and change, based on a third reference temperature that is lower than the first reference temperature, the operating frequency of the controller to a second operating frequency when a temperature of at least one component of the multiple components reaches a second reference temperature while the controller operates at the first operating frequency.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: December 6, 2022
    Inventors: Kyungha Koo, Kuntak Kim, Hajoong Yun, Seungjoo Lee, Seyoung Jang, Hyuntae Jang
  • Patent number: 11497141
    Abstract: A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: November 8, 2022
    Inventors: Kyungha Koo, Kuntak Kim, Jihong Kim, Hongki Moon, Hajoong Yun, Haejin Lee, Seyoung Jang
  • Patent number: 11388276
    Abstract: An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: July 12, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jaeyoung Huh, Kyungwan Park, Seunghoon Kang, Boram Kim, Youngjin Kim, Sunghoon Moon, Hongki Moon, Yoonsun Park, Hajoong Yun, Jonghoon Lim
  • Patent number: 11202363
    Abstract: An electronic device for improving heat transfer is provided. The electronic device includes a housing, a display mounted on at least one surface of the housing, a battery, a supporting member disposed adjacent to a back surface of the display and supporting the display, a printed circuit board on which electronic components are mounted, a shield can surrounding at least a portion of the electronic components, a shielding structure disposed on an outer surface of the shield can to shield the electronic components, and a first heat transfer member disposed on an outer surface of the shielding structure and including a partial area that faces at least one electronic component among the plurality of electronic components mounted on the printed circuit board and another partial area that is bent and faces another electronic component among the plurality of electronic components mounted on the printed circuit board.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: December 14, 2021
    Inventors: Hongki Moon, Yoonsun Park, Seunghoon Kang, Kyungha Koo, Hajoong Yun, Seungjoo Lee, Yeonjoo Lee, Seyoung Jang
  • Publication number: 20210373625
    Abstract: An electronic device and method of operating an electronic device are provided. The electronic device includes a temperature measurement unit configured to measure a temperature of each of multiple components of the electronic device, and a controller configured to change, based on a first reference temperature, an operating frequency of the controller to a first operating frequency when a temperature of the controller, measured by the temperature measurement unit, reaches the first reference temperature and change, based on a third reference temperature that is lower than the first reference temperature, the operating frequency of the controller to a second operating frequency when a temperature of at least one component of the multiple components reaches a second reference temperature while the controller operates at the first operating frequency.
    Type: Application
    Filed: September 25, 2020
    Publication date: December 2, 2021
    Inventors: Kyungha KOO, Kuntak KIM, Hajoong YUN, Seungjoo LEE, Seyoung JANG, Hyuntae JANG
  • Publication number: 20200322467
    Abstract: An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing
    Type: Application
    Filed: April 3, 2020
    Publication date: October 8, 2020
    Inventors: Jaeyoung HUH, Kyungwan PARK, Seunghoon KANG, Boram KIM, Youngjin KIM, Sunghoon MOON, Hongki MOON, Yoonsun PARK, Hajoong YUN, Jonghoon LIM
  • Publication number: 20200267828
    Abstract: An electronic device for improving heat transfer is provided. The electronic device includes a housing, a display mounted on at least one surface of the housing, a battery, a supporting member disposed adjacent to a back surface of the display and supporting the display, a printed circuit board on which electronic components are mounted, a shield can surrounding at least a portion of the electronic components, a shielding structure disposed on an outer surface of the shield can to shield the electronic components, and a first heat transfer member disposed on an outer surface of the shielding structure and including a partial area that faces at least one electronic component among the plurality of electronic components mounted on the printed circuit board and another partial area that is bent and faces another electronic component among the plurality of electronic components mounted on the printed circuit board.
    Type: Application
    Filed: February 19, 2020
    Publication date: August 20, 2020
    Inventors: Hongki MOON, Yoonsun PARK, Seunghoon KANG, Kyungha KOO, Hajoong YUN, Seungjoo LEE, Yeonjoo LEE, Seyoung JANG
  • Publication number: 20200100390
    Abstract: A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.
    Type: Application
    Filed: September 20, 2019
    Publication date: March 26, 2020
    Inventors: Kyungha KOO, Kuntak KIM, Jihong KIM, Hongki MOON, Hajoong YUN, Haejin LEE, Seyoung JANG