Abstract: An electronic component-embedded substrate includes an electronic component module having a first surface and a second surface opposite to the first surface, and including a first support member having a first through-portion, a first electronic component disposed in the first through-portion, a first resin layer covering at least a portion of the first electronic component, a second support member disposed on one side of the first support member and having a second through-portion, a second electronic component disposed in the second through-portion and connected to the first electronic component, and a second resin layer covering at least a portion of the second electronic component, an insulating material covering at least a portion of each of a side surface of the electronic component module and the first surface, and a first wiring layer disposed on the insulating material and connected to the first electronic component.

Abstract: A substrate-on-substrate structure and an electronic device including the same are provided. The substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a reinforcing structure attached to the first side of the second printed circuit board, and spaced apart from the second side of the first printed circuit board; and an underfill resin disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and covering at least a portion of the reinforcing structure.

Abstract: A substrate-on-substrate structure and an electronic device including the same are provided, and the substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side, opposite to the first side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a first structure disposed on the second side of the first printed circuit board, and disposed around the second printed circuit board; a second structure disposed on the second side of the second printed circuit board; and a third structure disposed on the first and second structures, and connected to each of the first and second structures.

Abstract: An electronic component-embedded substrate includes an electronic component module having a first surface and a second surface opposite to the first surface, and including a first support member having a first through-portion, a first electronic component disposed in the first through-portion, a first resin layer covering at least a portion of the first electronic component, a second support member disposed on one side of the first support member and having a second through-portion, a second electronic component disposed in the second through-portion and connected to the first electronic component, and a second resin layer covering at least a portion of the second electronic component, an insulating material covering at least a portion of each of a side surface of the electronic component module and the first surface, and a first wiring layer disposed on the insulating material and connected to the first electronic component.

Abstract: A substrate-on-substrate structure and an electronic device including the same are provided, and the substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side, opposite to the first side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a reinforcing structure attached to the first side of the second printed circuit board, and spaced apart from the second side of the first printed circuit board; and an underfill resin disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and covering at least a portion of the reinforcing structure.

Abstract: A substrate-on-substrate structure and an electronic device including the same are provided, and the substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side, opposite to the first side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a first structure disposed on the second side of the first printed circuit board, and disposed around the second printed circuit board; a second structure disposed on the second side of the second printed circuit board; and a third structure disposed on the first and second structures, and connected to each of the first and second structures.

Abstract: An electronic component embedded substrate includes a core layer having a first cavity and a second cavity on a first surface and a second surface of the core layer, respectively, the second surface opposite to the first surface in a thickness direction of the core layer; an electronic component disposed in the first cavity; a first insulating material covering at least a portion of the electronic component; a first wiring layer disposed on the first insulating material and connected to the electronic component; a built-in block disposed in the second cavity; and a second insulating material covering at least a portion of the built-in block.

Abstract: A blood dialyzing apparatus includes a blood dialyzing filter for dialyzing blood by using a pressure difference between the blood and a dialysis solution, and a supplying means for supplying the blood and the dialysis solution to the blood dialyzing filter in order to alternately generate a state where a blood pressure is higher than a dialysis solution pressure and a state where the dialysis solution pressure is higher than the blood pressure. The blood dialyzing apparatus dialyzes a large volume of blood in a short period of time without increasing the size of the blood dialyzing filter and simply controls the volume of the dialyzed blood by adjusting the supply pressures of the blood and the dialysis solution.