Patents by Inventor Hak Gee Jung

Hak Gee Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240043634
    Abstract: The present invention relates to a polyamide-imide based precursor, a polymer prepared from the precursor, an optical film comprising the polymer, and a display device comprising the optical film. A polymer according to an embodiment of the present invention comprises amide repeating units and imide repeating units that are disposed uniformly and alternately, and an optical film comprising such a polymer can exhibit excellent light transmittance, a low yellow index (Y.I), and superb stability.
    Type: Application
    Filed: December 28, 2021
    Publication date: February 8, 2024
    Inventors: Jong Won YANG, Hyo Jun PARK, Hak-Gee Jung
  • Publication number: 20230374219
    Abstract: The present invention provides an optical film and a display device including same, the optical film comprising a polymer resin which includes: a first repeating unit; a second repeating unit; a third repeating unit; and a fourth repeating unit, wherein the first repeating unit is an imide repeating unit derived from a first diamine-based compound and a dianhydride-based compound, the second repeating unit is an imide repeating unit derived from a second diamine-based compound and a dianhydride-based compound, the third repeating unit is an amide repeating unit derived from a first diamine-based compound and a dicarbonyl-based compound, and the fourth repeating unit is an amide repeating unit derived from a second diamine-based compound and a dicarbonyl-based compound.
    Type: Application
    Filed: December 24, 2021
    Publication date: November 23, 2023
    Inventors: Doo Li CHOI, Hak-Gee JUNG, Hyo Jun PARK
  • Publication number: 20230375750
    Abstract: The present invention provides an optical film comprising a polymer resin, which comprises a first repeating unit, a second repeating unit, a third repeating unit and a fourth repeating unit, wherein the optical index of the film is 1.
    Type: Application
    Filed: December 24, 2021
    Publication date: November 23, 2023
    Inventors: Doo Li CHOI, Hak-Gee JUNG
  • Publication number: 20230312881
    Abstract: One embodiment of the present invention provides a method for manufacturing a light-transmissive film, a light-transmissive film manufactured by the manufacturing method, and a display device comprising the light-transmissive film, the method comprising the steps of: preparing a light-transmissive resin powder; preparing a light-transmissive resin solution by dissolving a first amount of the light-transmissive resin powder in a first solvent; preparing a filler dispersion solution by dispersing a filler in a second solvent; preparing a first mixture solution by mixing the filler dispersion solution and the light-transmissive resin solution; and preparing a second mixture solution by adding a second amount of the light-transmissive resin powder to the first mixture solution and dissolving same.
    Type: Application
    Filed: July 7, 2021
    Publication date: October 5, 2023
    Inventors: Hyo Ra SHIN, Hyo Jun PARK, Hak-Gee JUNG
  • Publication number: 20230257532
    Abstract: The present invention provides: a polyimide-based film, which comprises a polyimide-based matrix and a filler dispersed in the polyimide-based matrix and has a density ratio (DR) of the true density relative to the density in a density gradient column, of 1.10 or less; and a display device comprising the polyimide-based film.
    Type: Application
    Filed: July 9, 2021
    Publication date: August 17, 2023
    Inventors: Hyo Jun PARK, Hak-Gee JUNG
  • Publication number: 20230226745
    Abstract: The present invention relates to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby and, particularly, to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represented by yield elongation, are excellent.
    Type: Application
    Filed: January 12, 2023
    Publication date: July 20, 2023
    Inventors: Ki II HONG, Hak-Gee JUNG
  • Publication number: 20230100624
    Abstract: The present disclosure provides an optical film and a display device including the optical film, the optical film comprising a light-transmissive substrate and a buffer layer, wherein a first folded mark parameter calculated by equation 1 ranges from 0.7 to 7.0.
    Type: Application
    Filed: March 26, 2021
    Publication date: March 30, 2023
    Inventors: Hak-Gee JUNG, Sang-Hyun AHN, Hyora SHIN
  • Publication number: 20230097067
    Abstract: The present disclosure provides an optical film comprising: a light-transmitting substrate; and a buffer layer, wherein a first impact resistance parameter calculated by equation 1 is 0.08 or higher, and a display device comprising the optical film.
    Type: Application
    Filed: March 26, 2021
    Publication date: March 30, 2023
    Inventors: Hak-Gee JUNG, Sang-Hyun AHN, Hyora SHIN
  • Patent number: 11577449
    Abstract: The present invention relates to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby and, particularly, to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represented by yield elongation, are excellent.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: February 14, 2023
    Assignee: Kolon Industries, Inc.
    Inventors: Ki II Hong, Hak-Gee Jung
  • Patent number: 11421081
    Abstract: A polyimide-polybenzoxazole precursor solution, a polyimide-polybenzoxazole film, and a method of manufacturing the film are disclosed. A polyimide-polybenzoxazole film manufactured using the polyimide-polybenzoxazole precursor solution is formed by copolymerizing a unit structure of diamine and dianhydride and a unit structure of diaminophenol and dicarbonyl chloride in an organic solvent. The film is colorless and transparent, like conventional polyimide films, and can exhibit improved heat resistance and low birefringence.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: August 23, 2022
    Assignee: KOLON INDUSTRIES. INC.
    Inventors: Doo Li Choi, Hak Gee Jung
  • Patent number: 11130844
    Abstract: The present invention relates to a polyamide-imide precursor, a polyamide-imide obtained by imidizing the same, a polyamide-imide film, and an image display device including the film. The polyamide-imide precursor includes, in a molecular structure thereof, a first block, obtained by copolymerizing monomers including dianhydride and diamine, a second block, obtained by copolymerizing monomers including an aromatic dicarbonyl compound and the diamine, and a third block, obtained by copolymerizing monomers including the aromatic dicarbonyl compound and aromatic diamine. The dianhydride for forming the first block includes 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine for forming the first block and the second block includes 9,9-bis(3-fluoro-4-aminophenyl)fluorene (FFDA).
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: September 28, 2021
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Jong Won Yang, Hak Gee Jung
  • Patent number: 11040522
    Abstract: Disclosed is a polyimide cover substrate, which is configured such that a device protection layer is formed of a urethane acrylate compound on at least one side of a polyimide film, thereby exhibiting not only high flexural properties and impact resistance but also superior solvent resistance, optical properties and scratch resistance and low water vapor transmission rate, and thus can be effectively utilized as a cover substrate for a flexible electronic device.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: June 22, 2021
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Hak Yong Woo, Hak Gee Jung, Ki Il Hong
  • Publication number: 20210179781
    Abstract: A polyimide-polybenzoxazole precursor solution, a polyimide-polybenzoxazole film, and a method of manufacturing the film are disclosed. A polyimide-polybenzoxazole film manufactured using the polyimide-polybenzoxazole precursor solution is formed by copolymerizing a unit structure of diamine and dianhydride and a unit structure of diaminophenol and dicarbonyl chloride in an organic solvent. The film is colorless and transparent, like conventional polyimide films, and can exhibit improved heat resistance and low birefringence.
    Type: Application
    Filed: February 26, 2021
    Publication date: June 17, 2021
    Applicant: KOLON INDUSTRIES, INC.
    Inventors: Doo Li CHOI, Hak Gee JUNG
  • Patent number: 10884274
    Abstract: Disclosed is a plastic substrate, which includes a plastic film, a metal layer, and a resin layer having a conductive material dispersed therein and which is useful as a lower substrate of a transmissive electronic paper display device or a display device.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: January 5, 2021
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Hak Gee Jung, Jeong Han Kim, Hyo Jun Park
  • Publication number: 20200353668
    Abstract: The present invention relates to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby and, particularly, to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represented by yield elongation, are excellent.
    Type: Application
    Filed: December 4, 2018
    Publication date: November 12, 2020
    Applicant: Kolon Industries, Inc.
    Inventors: Ki II HONG, Hak-Gee JUNG
  • Patent number: 10662290
    Abstract: This invention relates to a polyamide-imide precursor, a polyamide-imide obtained by imidizing the same, a polyamide-imide film, and an image display device including the film. The polyamide-imide precursor includes, in a molecular structure thereof, a first block, obtained by copolymerizing monomers including dianhydride and diamine, and a second block, obtained by copolymerizing monomers including an aromatic dicarbonyl compound and aromatic diamine. The dianhydride includes biphenyltetracarboxylic acid dianhydride (BPDA) and 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine includes bistrifluoromethylbenzidine (TFDB).
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: May 26, 2020
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Jae Il Kim, Hak Gee Jung
  • Patent number: 10538665
    Abstract: This invention relates to a highly heat-resistant polyamic acid solution and a polyimide film having improved thermal dimensional stability, wherein the polyamic acid solution includes a polymer of a diamine compound, containing 1 to 10 mol % of a carboxylic acid functional group-containing diamine compound based on the total amount of diamine, and a dianhydride compound, and the polyimide film includes polyimide, which is an imidized product of the polyamic acid solution and is configured such that main chains thereof are crosslinked through an amide bond (—CONH—).
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: January 21, 2020
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Woong Ki Min, Hyo Jun Park, Hak Gee Jung, Ki Il Hong
  • Patent number: 10526451
    Abstract: Disclosed is a polyamide-imide precursor having a molecular structure in which a first polymer, derived from polymerization of a dianhydride and a diamine, and a second polymer, derived from polymerization of a diamine and an aromatic dicarbonyl compound, are copolymerized, wherein the diamine includes 3 to 50 mol % of at least one of 9,9-bis(4-aminophenyl)fluorene (FDA) and 9,9-bis(4-amino-3-fluorophenyl)fluorene (F-FDA), based on the total molar amount of the diamine. Also, a copolymerized polyamide-imide in which the polyamide-imide precursor is imidized or a copolymerized polyamide-imide film formed by an imidization reaction of the polyamide-imide precursor and an image display device including the copolymerized polyamide-imide film are provided.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: January 7, 2020
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Chul Ha Ju, Hak Gee Jung, Hyo Jun Park
  • Patent number: 10062474
    Abstract: Disclosed is a conductive layer including photopolymerizable resin having dispersed carbon nanotubes, which is transparent with high electrical conductivity and facilitates the formation of an electrode pattern. A laminate and a transparent electrode, including the conductive layer, are also provided.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: August 28, 2018
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Ji Sung Kim, Hak Gee Jung, Jeong Han Kim
  • Patent number: RE48141
    Abstract: Disclosed are a transparent polyamide-imide resin and a film using the same, which can be colorless and transparent, can show excellent thermal stability and mechanical properties, and can have low birefringence, making it possible to serve in various fields including a semiconductor insulator, a TFT-LCD insulator, a passivation layer, a liquid crystal alignment layer, materials for optical communication, a protective film for a solar cell, a flexible display substrate and the like.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: August 4, 2020
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Chul Ha Ju, Hyo Jun Park, Hak Gee Jung