Patents by Inventor Hak Gu Kim
Hak Gu Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12255098Abstract: A carrier substrate includes a base layer, an antireflection layer, and an energy absorption layer, wherein the antireflection layer is formed on one surface of the base layer and allows an elastic wave generated by a first laser beam transmitted through an element adhesively bonded to the antireflection layer to be transmitted through the base layer without being reflected towards the element, the first laser beam being applied to the element through a source substrate of the element, and the energy absorption layer is formed between the base layer and the antireflection layer to be aligned with the element, and evaporates upon energy absorption.Type: GrantFiled: May 11, 2022Date of Patent: March 18, 2025Assignee: CENTER FOR ADVANCED META-MATERIALSInventors: Jae Hyun Kim, Jae Gu Kim, Sang Min Kim, Kwang Seop Kim, Yun Hwangbo, Hak Joo Lee, Se Jeong Won
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Patent number: 12249681Abstract: An electrode assembly, a battery, and a battery pack and a vehicle including the same are provided. One end of the electrode assembly includes a plurality of segment alignments in which the plurality of segment groups are aligned along a radial direction, and an electrolyte impregnation portion provided between segment alignments adjacent in a circumferential direction, wherein an end of the first active material portion is exposed between winding turns of the separator. The segments included in the segment alignment are bent toward the core to form a bending surface region. An end of the separator is spaced apart from a criterion line extending in a winding axis direction along a location corresponding to the plurality of cut grooves by 30% or less of a minimum height of the segments forming the bending surface region.Type: GrantFiled: July 19, 2022Date of Patent: March 11, 2025Assignee: LG ENERGY SOLUTION, LTD.Inventors: Jong-Sik Park, Jae-Won Lim, Yu-Sung Choe, Hak-Kyun Kim, Je-Jun Lee, Duk-Hyun Ryu, Kwan-Hee Lee, Byoung-Gu Lee, Jae-Eun Lee
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Patent number: 11699072Abstract: A virtual reality (VR) sickness assessment method according to an embodiment includes receiving virtual reality content, and quantitatively evaluating virtual reality sickness for the received virtual reality content using a neural network based on a pre-trained neural mismatch model. The evaluating of the virtual reality sickness may include predicting an expected visual signal for an input visual signal of the virtual reality content based on the neural mismatch model, extracting a neural mismatch feature between the predicted expected visual signal based on the neural mismatch model and an input visual signal for a corresponding frame of the virtual reality content corresponding to the expected visual signal, and evaluating a level of the virtual reality sickness based on the neural mismatch model and the extracted neural mismatch feature.Type: GrantFiled: December 2, 2019Date of Patent: July 11, 2023Assignee: Korea Advanced Institute of Science and TechnologyInventors: YongMan Ro, Hak Gu Kim, Sangmin Lee
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Patent number: 11658393Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.Type: GrantFiled: June 22, 2021Date of Patent: May 23, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hak Gu Kim, Young Sik Hur, Yoo Sam Na, Won Gi Kim, Young Bal Kim, Soo Ki Choi, Ho Kyung Kang, Young Kyoon Im, Seong Jong Cheon
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Patent number: 11539138Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.Type: GrantFiled: October 20, 2021Date of Patent: December 27, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hak Gu Kim, Ho Kyung Kang, Seong Jong Cheon, Young Sik Hur, Jin Seon Park, Yong Duk Lee
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Patent number: 11335991Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.Type: GrantFiled: July 24, 2020Date of Patent: May 17, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hak Gu Kim, Young Sik Hur, Yoo Sam Na, Won Gi Kim, Young Bal Kim, Soo Ki Choi, Ho Kyung Kang, Young Kyoon Im, Seong Jong Cheon
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Patent number: 11264719Abstract: A radio frequency module includes an interposer having a stack structure in which at least one insulating layer and at least one wiring layer are alternately stacked; a radio frequency IC disposed on a first surface of the interposer; a front-end IC disposed on a second surface of the interposer opposite to the first surface; and electrical connection structures arranged to surround the front-end IC and having at least a portion electrically connected to the least one wiring layer. The radio frequency IC inputs or outputs a base signal and a first radio frequency signal having a frequency higher than a frequency of the base signal through the at least one wiring layer, and the front-end IC inputs or outputs the first radio frequency signal and a second radio frequency signal having power different from power of the first radio frequency signal.Type: GrantFiled: June 2, 2020Date of Patent: March 1, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Shin Haeng Heo, Young Sik Hur, Hak Gu Kim
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Patent number: 11252371Abstract: Disclosed is an apparatus and method for VR sickness reduction based on VR sickness assessment. According to an embodiment of the inventive concept, an apparatus for reducing virtual reality (VR) content cybersickness includes a first module extracting feature information about each of predetermined cybersickness precipitating factors through analysis of VR content, and a second module determining a cybersickness precipitating factor requiring cybersickness reduction among the cybersickness precipitating factors based on the extracted feature information about each of the cybersickness precipitating factors, and generating the VR content as VR content having a cybersickness score not greater than a predetermined reference cybersickness score, by performing the cybersickness reduction on corresponding feature information, using a deep learning neural network pre-learned for each of the respective determined cybersickness precipitating factor.Type: GrantFiled: August 5, 2020Date of Patent: February 15, 2022Inventors: YongMan Ro, Hak Gu Kim, Sangmin Lee
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Publication number: 20220037792Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.Type: ApplicationFiled: October 20, 2021Publication date: February 3, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Hak Gu KIM, Ho Kyung KANG, Seong Jong CHEON, Young Sik HUR, Jin Seon PARK, Yong Duk LEE
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Patent number: 11183765Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.Type: GrantFiled: June 3, 2020Date of Patent: November 23, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hak Gu Kim, Ho Kyung Kang, Seong Jong Cheon, Young Sik Hur, Jin Seon Park, Yong Duk Lee
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Publication number: 20210313672Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.Type: ApplicationFiled: June 22, 2021Publication date: October 7, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Hak Gu KIM, Young Sik HUR, Yoo Sam NA, Won Gi KIM, Young Bal KIM, Soo Ki CHOI, Ho Kyung KANG, Young Kyoon IM, Seong Jong CHEON
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Patent number: 11133592Abstract: A radio frequency module is provided. The module includes a core member, a front-end integrated circuit (FEIC), a first connection member, a second connection member disposed on an upper surface of the core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the second connection member, and configured to input or output a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, through a wiring layer, a substrate disposed on a lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal which has a power different from a power of the first RF signal.Type: GrantFiled: June 3, 2020Date of Patent: September 28, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung Kang, Seong Jong Cheon, Hak Gu Kim, Young Sik Hur, Jin Seon Park, Yong Duk Lee
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Patent number: 11101840Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.Type: GrantFiled: August 17, 2020Date of Patent: August 24, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hak Gu Kim, Ho Kyung Kang, Seong Jong Cheon, Young Sik Hur, Jin Seon Park, Yong Duk Lee
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Publication number: 20210257736Abstract: A radio frequency module includes an interposer having a stack structure in which at least one insulating layer and at least one wiring layer are alternately stacked; a radio frequency IC disposed on a first surface of the interposer; a front-end IC disposed on a second surface of the interposer opposite to the first surface; and electrical connection structures arranged to surround the front-end IC and having at least a portion electrically connected to the least one wiring layer. The radio frequency IC inputs or outputs a base signal and a first radio frequency signal having a frequency higher than a frequency of the base signal through the at least one wiring layer, and the front-end IC inputs or outputs the first radio frequency signal and a second radio frequency signal having power different from power of the first radio frequency signal.Type: ApplicationFiled: June 2, 2020Publication date: August 19, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Shin Haeng HEO, Young Sik HUR, Hak Gu KIM
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Publication number: 20210242594Abstract: A radio frequency module is provided. The module includes a core member, a front-end integrated circuit (FEIC), a first connection member, a second connection member disposed on an upper surface of the core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the second connection member, and configured to input or output a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, through a wiring layer, a substrate disposed on a lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal which has a power different from a power of the first RF signal.Type: ApplicationFiled: June 3, 2020Publication date: August 5, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho Kyung KANG, Seong Jong CHEON, Hak Gu KIM, Young Sik HUR, Jin Seon PARK, Yong Duk LEE
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Publication number: 20210242896Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.Type: ApplicationFiled: August 17, 2020Publication date: August 5, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Hak Gu KIM, Ho Kyung KANG, Seong Jong CHEON, Young Sik HUR, Jin Seon PARK, Yong Duk LEE
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Publication number: 20210242595Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.Type: ApplicationFiled: June 3, 2020Publication date: August 5, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Hak Gu KIM, Ho Kyung KANG, Seong Jong CHEON, Young Sik HUR, Jin Seon PARK, Yong Duk LEE
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Publication number: 20210185275Abstract: Disclosed is an apparatus and method for VR sickness reduction based on VR sickness assessment. According to an embodiment of the inventive concept, an apparatus for reducing virtual reality (VR) content cybersickness includes a first module extracting feature information about each of predetermined cybersickness precipitating factors through analysis of VR content, and a second module determining a cybersickness precipitating factor requiring cybersickness reduction among the cybersickness precipitating factors based on the extracted feature information about each of the cybersickness precipitating factors, and generating the VR content as VR content having a cybersickness score not greater than a predetermined reference cybersickness score, by performing the cybersickness reduction on corresponding feature information, using a deep learning neural network pre-learned for each of the respective determined cybersickness precipitating factor.Type: ApplicationFiled: August 5, 2020Publication date: June 17, 2021Inventors: YongMan RO, Hak Gu KIM, Sangmin LEE
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Publication number: 20210143525Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.Type: ApplicationFiled: July 24, 2020Publication date: May 13, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Hak Gu KIM, Young Sik HUR, Yoo Sam NA, Won Gi KIM, Young Bal KIM, Soo Ki CHOI, Ho Kyung KANG, Young Kyoon IM, Seong Jong CHEON
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Publication number: 20200327408Abstract: Disclosed are a virtual reality (VR) sickness assessment method and an apparatus thereof considering a neural mismatch model. The virtual reality (VR) sickness assessment method according to an embodiment includes receiving virtual reality content, and quantitatively evaluating virtual reality sickness for the received virtual reality content using a neural network based on a pre-trained neural mismatch model. The evaluating of the virtual reality sickness may include predicting an expected visual signal for an input visual signal of the virtual reality content based on the neural mismatch model, extracting a neural mismatch feature between the predicted expected visual signal based on the neural mismatch model and an input visual signal for a corresponding frame of the virtual reality content corresponding to the expected visual signal, and evaluating a level of the virtual reality sickness based on the neural mismatch model and the extracted neural mismatch feature.Type: ApplicationFiled: December 2, 2019Publication date: October 15, 2020Inventors: YongMan Ro, Hak Gu Kim, Sangmin Lee